JPH0410556Y2 - - Google Patents

Info

Publication number
JPH0410556Y2
JPH0410556Y2 JP5298989U JP5298989U JPH0410556Y2 JP H0410556 Y2 JPH0410556 Y2 JP H0410556Y2 JP 5298989 U JP5298989 U JP 5298989U JP 5298989 U JP5298989 U JP 5298989U JP H0410556 Y2 JPH0410556 Y2 JP H0410556Y2
Authority
JP
Japan
Prior art keywords
chamber
furnace
electronic components
shaped
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5298989U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02144394U (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5298989U priority Critical patent/JPH0410556Y2/ja
Publication of JPH02144394U publication Critical patent/JPH02144394U/ja
Application granted granted Critical
Publication of JPH0410556Y2 publication Critical patent/JPH0410556Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Tunnel Furnaces (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP5298989U 1989-05-10 1989-05-10 Expired JPH0410556Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5298989U JPH0410556Y2 (cs) 1989-05-10 1989-05-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5298989U JPH0410556Y2 (cs) 1989-05-10 1989-05-10

Publications (2)

Publication Number Publication Date
JPH02144394U JPH02144394U (cs) 1990-12-07
JPH0410556Y2 true JPH0410556Y2 (cs) 1992-03-16

Family

ID=31573778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5298989U Expired JPH0410556Y2 (cs) 1989-05-10 1989-05-10

Country Status (1)

Country Link
JP (1) JPH0410556Y2 (cs)

Also Published As

Publication number Publication date
JPH02144394U (cs) 1990-12-07

Similar Documents

Publication Publication Date Title
EP0480181B1 (en) Method and apparatus for batch processing of a semiconductor wafer
US7094993B2 (en) Apparatus and method for heating and cooling an article
KR100697426B1 (ko) 열적 프로파일 향상 대류로
CN100505158C (zh) 在可变温度下可控地加热混合物的炉体
KR940701531A (ko) 전자 부품이 설비된 리드프레임용 매거진을 열처리하기 위한 장치
US6501051B1 (en) Continuous-conduction wafer bump reflow system
JPH0410556Y2 (cs)
US6715662B2 (en) Waste energy recovery system for a controlled atmosphere system
JP2000055564A (ja) ロ―ラ―ハ―スキルン
JP3461434B2 (ja) ガラス基板の冷却装置
JP6491216B2 (ja) 対流加熱及び放射加熱を用いた炉
JPH0426878Y2 (cs)
JP3987064B2 (ja) 熱処理装置
JP6382321B2 (ja) 密閉温度被制御部を備えた炉
JPS645757Y2 (cs)
CN1194594C (zh) 软钎焊方法及其装置
JPH11298135A (ja) はんだ付け用加熱炉
JP3017786B2 (ja) 熱処理装置
JPH07161652A (ja) 高温熱処理炉及び炉内搬送装置
JPH0558429A (ja) 連続処理装置
JPH07159768A (ja) 連続熱処理装置
JPH03247988A (ja) 連続処理装置
JPH03213991A (ja) 連続処理装置
JPH0933905A (ja) 液晶用ガラス基板の熱処理装置
JP2003194477A (ja) 熱処理装置