JPH04104424A - Formation of barrier rib - Google Patents

Abstract

PURPOSE:To prevent breakage or cracking of a rib after baking, improve the discharge characteristics, and prevent occurrence of brightness unevenness by spraying a polishing material to a thick film layer for a rib to etch the thick film layer, and removing the polishing material by an ultrasonic binding agent or grounding. CONSTITUTION:A backing plate 10 having a cathode 12 and an etching protective layer 22 is formed for a base material for forming a barrier rib, and a thick film layer 24 for a rib is laminated on it. A resist pattern 26 exposing a groove forming range 30 in the layer 24 is next formed, and the layer 24 is etching removed by blast using a polishing material 28 for blast. By using an ultrasonic wave vibration means 31 and an air gun, or applying and hardening natural rubber binding agent 34 on the base material and the layer 24, or blowing air to parts where the polishing material is applied while grounding the base material, the polishing material 28 attached to the layer 24, layer 22, etc., is eliminated. The layer 24 is baked finally, thereby a barrier rib 16 for a gas discharge display panel is completed.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of forming barrier ribs of a gas discharge display panel.

(Prior art) Conventionally, barrier rib formation for gas discharge display panels has been
A thick film printing method suitable for mass production is used. Below, the 6th
With reference to the drawings, the manufacturing process of the gas discharge display panel will be explained, as well as the formation of barrier ribs by the thick film printing method. FIG. 6 is a sectional view of a main part showing an example of the configuration of a gas discharge display panel.

First, the cathode 12 is formed on the back plate 10 by a thick film printing method. The cathode 12 is made of a thick Ni film, and a plurality of striped cathodes 12 are arranged in parallel.

Next, barrier ribs 16 for holding the caps of the cathode] 2 and the anode 14 constant are formed by a thick film printing method. The barrier ribs 16 are made of a thick glass film, and a plurality of barrier ribs 16 are arranged in parallel so that the striped barrier ribs 16 are orthogonal to the cathode 12 when viewed from above.

The glass thick films are laminated in a predetermined pattern shape to a predetermined height by repeating printing and drying 1, and then the glass thick films are fired to complete the barrier ribs 16.

Further, the anode 14 is formed on the front plate 18 by a thin film forming technique. The anode 14 is made of a transparent conductive film (ITO: Indi
um Tin Oxide), and a plurality of striped anodes] 4 are arranged in parallel.

Next, a phosphor layer 20 is formed on the anode 14 in the display cell forming area by a thick film printing method.

Next, the cathode 12 and the anode 14 are orthogonal to each other when viewed in plan, the electrode forming surfaces of the back plate]O and the front plate 18 are faced, and the periphery of these 10.18 is sealed with lead glass. A display cell is formed in the area where the cathode 12 and the anode 14 intersect with each other.

Next, the gas-filled area between the sealed back plate 10 and front plate 18 is evacuated to fill this area with discharge gas, thereby completing the panel.

(Problems to be Solved by the Invention) In recent years, there has been an increasing demand for higher definition pixel density in gas discharge display panels (for example, Document ■: Institute of Electronics, Information and Communication Engineers Technical Report EID89-70 p.
699), it is necessary to form fine barrier ribs for high-definition ivy, and for example, fine barrier ribs with a height of about 160 to 200 um and a width of about 50 to 60 um must be formed. To give a concrete example, 640×
When creating a 480-pixel panel with a pixel density of 8 pixels per 1 mm and a size of 12 inches, the aperture ratio of the display cell V
In order to achieve 50% or more, the width of the barrier rib should be 62.5u.
It must be less than m.

In particular, in color display panels, it is necessary to form green, red, and blue display cells in one dot, so the resolution needs to be three times as high as that of monochrome display panels, and the wall width of the barrier rib is required. There is a strong demand for miniaturization.

However, in the conventional barrier rib formation method mentioned above,
Printing is repeated until the thick film paste is laminated to a predetermined height. Therefore, in order to form fine barrier ribs, it is necessary to stack the thick film paste with high accuracy every time printing is performed. This is technically a very difficult task and is not suitable for forming fine barrier ribs.As stated in Reference ①, the limit of thick film printing is to form 5 barrier ribs per 1 mm. .

Therefore, in an application separate from this application, this applicant:
We have proposed a barrier rib formation method using blast etching as a method more suitable for forming fine barrier ribs than the thick film printing method, and according to this method, the wall width is 50 to 80 mm.
Barrier ribs with a height of 160 to 200 um can be formed.

To roughly explain this method of forming barrier ribs, a thick film layer for ribs is laminated on a substrate on which an electrode, such as a cathode, is formed, and a resist pattern exposing a groove forming region is provided on the dried thick film layer for ribs. Then, an abrasive such as alumina powder is sprayed onto the exposed portions of the thick film layer for ribs to remove the exposed portions by etching, and the etched thick film layer for ribs is fired to complete the barrier ribs. The remaining rib thick film layer constitutes the barrier rib.

FIGS. 7A and 7B are cross-sectional views showing the state of barrier ribs before and after firing the etched thick film layer for ribs.

In the figure, 22 is an etching prevention layer for preventing etching of the cathode 12, 24 is a thick film layer for ribs, 26 is a resist pattern for exposing the groove forming region tg of the thick film layer for ribs 24, and 28 is an abrasive. show. Incidentally, when the thick film layer 24 is fired, the etching prevention layer 22 and the resist 26 are gasified by decomposition or combustion and are blown away.

In implementing the forming method proposed by this applicant, the seventh
As shown in FIG. 3C, after the thick film layer 24 is etched, the etching prevention layer 22, the substrate 10, and the thick film layer 24 are removed.
Is it necessary to remove the abrasive material 28 adhering to the thick film layer 24 or the resist pattern 26 before firing because it is very difficult to completely remove it using an air gun? The thick film layer 24 is fired while it is attached or adsorbed onto the etching prevention layer 22. As a result, as shown in FIG. 7(B), cracks and chips occur in the thick film layer 24 (barrier ribs 16) due to the difference in thermal expansion coefficients between the thick film layer 24 and the abrasive material 28.

Furthermore, when the etching prevention layer 22 is no longer baked, the cathode 12
Abrasive material adheres to the top. The adhesive force of this abrasive material is strong and it is difficult to remove it. Moreover, since the abrasive does not contribute to the discharge, the discharge area of the cathode]2 decreases due to the adhesion of the abrasive.
As a result, there were problems in that the discharge characteristics deteriorated and the brightness was uneven due to 77 charges occurring at the part where the abrasive was attached.

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, it is an object of the present invention to provide a method for forming barrier ribs that allows the abrasive to be removed more reliably.

(Means for Solving the Problems) In order to achieve this object, the barrier rib forming method of the present invention includes the steps of laminating a thick film layer for ribs on a base when forming barrier ribs for a gas discharge display panel. , a step of forming a resist pattern that exposes the groove forming region of the thick film layer for ribs, a step of supplying an abrasive material to the groove forming region and etching away the thick film layer for ribs in the groove forming region by blasting, and polishing. The present invention is characterized by comprising the steps of: removing the material; and firing the thick film layer for the ribs.

In carrying out this invention, the abrasive material is removed by applying ultrasonic vibration to the base and thick film layer for ribs, or the adhesive is applied to the part of the base and thick film layer for ribs to which the abrasive is attached. or (2) ground the base and remove the abrasive material. Any one of these (1) to (2) may be implemented, or a plurality of methods arbitrarily selected from (1) to (3) may be implemented in combination.

(Function) According to such a rib forming method, since the thick film layer for ribs is etched by spraying an abrasive on the thick film layer for ribs,
■Ultrasonic vibration is applied to the base and thick film layer for ribs to remove the abrasive, or ■Adhesive is applied to the part of the base and thick film layer for ribs where the abrasive is attached and cured. Remove the abrasive along with the material, or (2) ground the base and remove the abrasive.

According to (2), since the base and thick film layer for ribs are subjected to ultrasonic vibration, the action of this vibration makes it easier to separate the base and thick film layer for ribs from the abrasive material, making it possible to remove the abrasive material more reliably. .

According to (2), the adhesive hardens while in contact with the abrasive material on the abrasive-attached portion, and the hardened adhesive and abrasive material adhere to each other. Therefore, by removing the cured adhesive from the adhered portion, the abrasive can be removed together with the adhesive, and the removal can be carried out more reliably.

In addition, when etching a thick film layer for ribs, the abrasive material collides with the thick film layer for ribs or the base, and due to this collision, the abrasive material, the thick film layer for phosphorus, or the base is charged, and this charged abrasive material collides with the thick film layer for ribs or the base. Attach it to the thick film layer.

However, according to (2), it is possible to prevent the abrasive material, the base material, and the thick film layer for ribs from being charged, or to remove the electric charge generated by the charging, so that the adhesion of the abrasive material due to charging is almost eliminated, and therefore the abrasive material can be removed more reliably.

(Example) Hereinafter, as an example, an example in which the present invention is applied when barrier ribs are formed on the back plate side of a gas discharge panel shown in FIG. 6 will be described. It should be noted that the drawings are merely shown schematically to the extent that the invention can be understood.

1 and 2 (A) to (I) are a manufacturing process flow and a manufacturing process diagram of an embodiment of the present invention.

Figures 2 (A) to (C) are cross sections taken in the direction perpendicular to the direction in which the cathode extends, and Figure 2 CD) to (F), (H) to (
I) represents a cross section taken along the extending direction of the cathode, and FIG. 2(G) is a diagram schematically showing the state in which the base is attached to an ultrasonic vibrator for removing the abrasive.

A first embodiment of the present invention will be explained with reference to FIGS. 1 and 2.

*Step 1: First, a back plate 1o including a cathode 12 and an etching prevention layer 22 is formed as a base for forming barrier ribs.

In step 1, a glass substrate is prepared as the back plate 10, and as shown in FIG. 2(A), a plurality of striped cathodes 12 are formed in parallel on the back plate 10. In the case of N1 thick film paste (DuPon's well 95
35) '% printing to form a plurality of striped cathode patterns, drying this pattern at a drying temperature of 50°C for 1 hour, and drying the pattern at a firing peak temperature of 50°C.
Bake by holding at 80°C for 10 minutes.

Next, as shown in FIG. 2(B), an etching/etching prevention layer 2 is provided to protect the cathode 12 from etching caused by blasting.
2 is formed on the cathode 12. The etching prevention layer 22 is 1
Although either a layered structure or a multilayered structure may be used, in this embodiment, a two-layered structure consisting of a blast-resistant resin and a protective layer sequentially provided on the cathode 12 is used.

The blast-resistant resin is made of an organic resin with low hardness and has a property that it is difficult to be etched or not etched by blasting. A buffer film resist made by Tokyo Ohka Co., Ltd. is used as the blast-resistant resin, and this resin is applied to the barrier rib formation region to a thickness of 15 to 20 um using a spin coater.

The resist coating conditions were as follows: The rotation speed of the spin coater was 500 r, p, m for 5 seconds from the start of rotation.

After closing, hold at 500r, p, m for 15 seconds, then 1500r, p, m, then 1500r,
Hold p, m, for 1 second, then press Or, for 5 seconds.
The condition is to drop down to p,,m,. After applying the resist, the resist was dried at a temperature of 70°C for 15 minutes, and the dried resist was exposed to light at a dose of 15 to 20 mJ/cm.
2. Expose to light and harden.

Moreover, the protective layer is for preventing the solvent component contained in the printed thick film layer 24 for ribs from penetrating the blast-resistant resin and causing the blast-resistant resin to swell and peel. For the protective layer, a seepage preventive agent manufactured by Tokyo Ohka Co., Ltd. is used, and this preventive agent is applied to the blast-resistant resin using a spin coater. The coating conditions for the protective layer are the same as those for the resist. After applying the protective layer, apply the protective layer at a temperature of 40°C for 5 to 10 minutes.
Let dry for minutes.

*Step 2: Next (this cathode 12 and etching prevention layer 2)
The back plate 10 on which 2 is formed is used as a base for forming barrier ribs, and a thick film layer 24 for ribs is laminated on this base.

In step 2, a glass thick film paste (M-9741 manufactured by DuPont) is printed all over the etching prevention layer 22, and printing is repeated until the layer is stacked to a height of 160 to 200 μm. If the layers are not stacked to the specified height, dry the printed thick film paste at a drying temperature of 150'C for 10 minutes before printing the next print, and once the layers are stacked to the specified height, dry the printed thick film paste. Thick film layer 24 for ribs made of thick film paste dried at a temperature of 150° C. for 1 hour and laminated to a predetermined height as shown in FIG. 2(C).
get.

By the way, in conventional barrier rib formation, thick film paste must be laminated to a predetermined height in a fine pattern shape. Therefore, in order to prevent the fine pattern shape from collapsing during the lamination process, viscosity is added to the thick film paste. I was using a high quality one. In thick film printing, leveling is performed to flatten the surface of the laminated paste, but it is difficult to sufficiently flatten the surface of thick film paste with high viscosity. As a result, during alignment when bonding the back plate and front plate of the gas discharge display panel, the barrier ribs are likely to get caught on components on the front plate side and become chipped.

In this embodiment, the thick film layer 24 for ribs is not printed in a fine J batashi shape, but is printed in a rough pattern, so that the thick film paste (52 ()) of the thick film layer 24 for ribs is A material with a low viscosity can be used.

As a result, the surface lanoness of the thick film layer 24 for ribs can be further reduced by leveling, and therefore the barrier ribs can be made less likely to be chipped when bonding the back plate and the front plate.

*Step 3・Next, groove forming area 30 of thick film layer 24 for ribs
A resist pattern 26 is formed that exposes.

In step 3, as shown in FIG. 2(D), a resist 32 having blast resistance is applied to the rib thick film layer 24.
A film thickness of 15 to 20 LJ m is applied on top using a spin coater. The coating conditions for the resist 32 are as follows: The rotational speed of the spin coater is set to 500 r/p for 5 seconds from the start of rotation.
, rη, and then held at 500r, p, m for 60 seconds, then 1500r, p, m, and then 15
00r.

Hold p, m, for 1 second, then press Or, for 5 seconds.
The conditions are that p, m, and mata are dropped. After applying the resist 32, the resist 32 is dried at a temperature of 70° C. for 15 minutes.

As the resist 32, ○5BR82Bu manufactured by Tokyo Ohka Co., Ltd. is used, or since it is a negative type, a mask is used that can expose the region of the thick film layer 24 that is desired to remain as a balnotube. For exposure of the resist 32, a negative film of the same size is used. Therefore, since the mask is used in close contact with the resist 32, a film made by Tokyo Ohka Co., Ltd. Anti-tack agent (
Apply t) as shown. The coating conditions are as follows: The rotation speed of the spin coater is set to 1000 r, p over 5 seconds from the start of rotation.
, m, 1000r after closing.

Hold p, m, for 15 seconds, then 1500r, p
, m, hold C at 1500 r, p, m for 1 second, then Or, p for 5 seconds.

The condition is to drop m and maC. After this application, it is allowed to stand for 2-3 minutes at room temperature.

Next, the resist 32 is exposed, developed, fixed, and dried to obtain a resist pattern 26 exposing the groove forming regions 30, as shown in FIG. 2(E). For exposure, the exposure amount was film thickness x 0.7 mJ/cm2, and after exposure, a 0.2% by weight aqueous sodium carbonate solution was sprayed with a low-pressure nozzle for development. Spray the mixture and let it set. Note that the anti-tack agent is also patterned into the same shape as the resist pattern 26.

*Step 4 Next, thick film layer 24 for ribs in groove forming area 30
is removed by etching by blasting using an abrasive material for blasting.

In step 4, using a blasting machine (fine powder type 5C-3 manufactured by T1 Manufacturing Co., Ltd.), abrasive material 28 of alumina powder is applied to the groove forming areas 111 that are not covered with the resist pattern 26.
As shown in FIG. 2(F), the rib thick film layer 24 in the groove forming region 30 is etched away. Since the thick film layer 24 for ribs is in a dry state, it can be easily processed and etched.

*Step 51 Next, the abrasive material 28 is removed.

In step 5, first, use an air gun to blow air onto the abrasive-attached portion of the base and the abrasive-attached portion of the rib thick film layer 24 that has been etched, and then dry the rib thick film layer 24.
4, the abrasive material 28 attached to the etching prevention layer 22, etc.
remove.

Next, as shown in FIG. 2(G), the base and the rib thick film layer 24 are subjected to ultrasonic vibration to remove the abrasive material 28 attached thereto.

In this embodiment, as the ultrasonic vibration device 31, for example, Silent Sonic UT304 (manufactured by Sharp, output 300
W) Use u. The vibrator included in this silent sock is made of ferrite and vibrates at 40 KHz.

When removing the abrasive material 28 by ultrasonic vibration, the direction from the bottom to the top of the groove formed in the thick film layer 24 for ribs is made to be almost the same as the vertical direction. 31 is supported by a jig 32. When the ultrasonic vibration device 31 is operated in this supported state and ultrasonic vibration is applied to the base and thick film layer 24 for ribs, the abrasive material 28 separates from the base and thick film layer 24 for ribs and moves in the vertical direction. Since it falls, the abrasive material 28 can be removed.

Next, the abrasive material 28 is removed by blowing air onto the base and the rib thick film layer 24 using an air gun again.

By removing the abrasive using ultrasonic vibration and an air gun, the abrasive 28 is removed as shown in FIG. 2(H).
can be removed well enough to be practically satisfactory.

In this embodiment, the removal of the abrasive by ultrasonic vibration and the abrasive by the air gun were performed separately, but the removal by ultrasonic vibration and the removal by the air gun may be performed simultaneously. Thick film layer 2
4 and the etching prevention layer 22, which is difficult to remove by simply blowing air with an air gun, can be removed by applying ultrasonic vibration and then blowing air. It can be removed more reliably (and/or more easily) by blowing air without applying vibration.

*Step 6: After the removal of the abrasive material 28 is completed, the thick film layer 24 for ribs is then fired.

Step 6 is to bake the rib thick film layer 24 at a temperature of 530'.
C for 10 minutes to complete the barrier rib 16 of the gas discharge display panel, as shown in FIG. 2 (CI).

Next, a second embodiment of the invention will be described.

FIG. 3 is a diagram for explaining the abrasive removal process in the second embodiment of the present invention, and FIG. ) is an enlarged cross-sectional view of the main part showing a state in which the hardened adhesive is removed.

The second embodiment is the same as the first embodiment described above, except that the abrasive material is removed using an adhesive in step 5, which is carried out after the etching of the thick film layer 24 for ribs. , mainly points that are different from the first embodiment will be explained, and detailed explanations of the same points as the first embodiment will be omitted.

In step 5 of the second embodiment, first, an air gun is used to blow air onto the abrasive-adhered portion of the base and the abrasive-adhered portion of the rib thick film layer 24 that has been etched. The etching prevention layer 22, etc. (the abrasive material 28 attached thereto is removed).

Next, as shown in FIG. 3(A), an adhesive 34 is applied to the base and the portions of the rib thick film layer 24 where the abrasive material is attached. The adhesive material 34 is applied to a portion corresponding to the entire display area of the gas discharge display panel, for example. As the adhesive 34, a natural rubber adhesive (Tar 100 manufactured by Kokuyo Co., Ltd.) consisting of 20% by weight of natural rubber and 80% by weight of cyclohexane is used. In order to make the adhesive 34 easy to peel off, it is preferable to use an adhesive 34 that has weak adhesion to the base and the thick film layer 24 for ribs. In addition, in order to ensure removal of the abrasive material 28,
It is preferable to use an adhesive 34 that has strong adhesion to the abrasive material 28.

Next, the applied adhesive 34 is cured, and the abrasive 28 is removed together with the adhesive. When the cured adhesive 34 is peeled off from the base and rib thick film layer 24, the abrasive 28 adhering to the adhesive 28 is removed together with the adhesive 28.

Next, the abrasive material 28 is removed by blowing air onto the base and the rib thick film layer 24 using an air gun again.

By removing the abrasive material 28 using the adhesive 34 and an air gun, the abrasive material 28 can be removed well enough to be practically satisfactory.

The adhesive 3 also removes the abrasive material 28 that is buried in the rib thick film layer 24 and the etching prevention layer 22 and is difficult to remove by simply blowing air with an air gun.
The adhesion force of 4 allows for more reliable and/or easier removal.

Next, a third embodiment of the present invention will be described.

FIG. 4 is a diagram for explaining the polishing grit removal process in the third embodiment of the present invention, and FIG. (B) is a diagram showing a state in which charges due to charging have been removed from the base and the thick film layer for ribs.

The third embodiment is the same as the first embodiment described above, except that in steps 4 and 5, which are performed after forming the resist pattern 26, the thick film layer 24 for ribs is etched and the abrasive material 28 is removed without grounding the base. This is similar to the example, and in the following description, the points that are different from the first embodiment will be mainly explained, and the detailed explanation of the points that are similar to the first embodiment will be omitted.

In the third embodiment, in step 4, as shown in FIG. 5(A), the cathode 10 on the base is grounded, and the abrasive material 28 is supplied to the groove forming region 30 while the base is grounded. Then, the rib thick film layer 24 is etched by blasting.

FIG. 5 is a diagram for explaining charging during etching by blasting, FIG. 5(A) is a diagram showing a state in which an abrasive is being supplied to the groove forming area, and FIG. It is a figure which shows the state where the thick film layer for ribs is electrically charged.

In the etching by blasting, as shown in FIG. 5A, the abrasive material 28 is supplied to the groove forming region 30 by being fed under pressure using, for example, compressed air. As a result, the abrasive material 28 collides with the base and the thick film layer 24 for ribs, and the resist pattern 26
The rib thick film layer 24 in the groove forming area 30 not covered by the etching is etched. As a result of this collision during etching, as shown in FIG. 5(B), the abrasive material 28, for example, alumina powder, becomes negatively charged, and the back plate 12, the rib thick film layer 24, and other bases become positively charged. The charging causes the abrasive material 28 to be attracted to the base and the thick film layer 24 for ribs. The inventor of this application has visually confirmed that if the base is not grounded, a sufficient charge is generated to generate sparks due to discharge.

However, in this embodiment, the cathode 10 is grounded, so even if charging occurs due to collision during etching, as shown in FIG. 5(A), as shown in FIG. 5(B), In this way, the electrical charge caused by the charging can be released to the graphite, and the potential of the base and the thick film layer 24 for ribs can be brought to the ground level, so that the adsorption force of the abrasive 28 due to the charging can be eliminated or significantly reduced. .

After completing the elatinization of the thick film layer 24 for ribs, in the third embodiment, in step 5, while the base is grounded, the abrasive is attached to the base and the thick film layer 24 for ribs. Blow air (air blow) to polish the rib thick film layer 24, etching prevention layer 22, etc.
Remove month 28.

By removing the abrasive material 28 by air flow without making contact with the ground, the abrasive material 28 can be removed sufficiently to be practically satisfactory.

The present invention is not limited to the embodiments described above, and therefore the shape, size, arrangement, etc. of each component (!12 places,
The structure, forming material, forming method, numerical conditions, and other conditions may be changed as desired.

For example, the etching prevention layer may be provided only on the entire upper surface of the cathode and not on the substrate surface, or the etching prevention layer may be provided only on the upper surface of the cathode in the barrier rib formation area and not on the substrate surface. It may not be provided on the upper surface of the cathode in the groove forming region. Further, the structure of the base for forming barrier ribs can be changed to any suitable structure. Further, washing with water may be used to remove the abrasive material, such as washing away the abrasive material while applying ultrasonic vibrations.

(Effects of the Invention) As is clear from 1 and the explanation above, according to the rib forming method of the present invention, after etching the thick film layer for ribs by spraying an abrasive on the thick film layer for ribs, and applying ultrasonic vibration to the thick film layer for ribs to remove the abrasive material, or
An adhesive is applied to the base and the part of the rib thick film layer to which the abrasive is attached, and the adhesive is cured, and the abrasive is removed together with the cured adhesive, or (2) the base is grounded and the abrasive is removed.

According to (2), since ultrasonic waves are applied to the thick film layer for the base and ribs and the abrasive material is separated, the abrasive material can be removed more reliably. can be done.

According to (2), the adhesive hardens while in contact with the abrasive in the abrasive-attached portion, and the hardened adhesive and the abrasive adhere to each other. Therefore, by removing the cured adhesive from the adhered portion, the abrasive can be removed together with the adhesive, and the removal can be performed more reliably.

According to item (3), it is possible to prevent the abrasive material, the base material, and the thick film layer for ribs from being charged, or to remove the electric charge generated by the charging, so that the adhesion of the abrasive material due to the charging is almost eliminated.
Therefore, the abrasive can be removed more reliably.

Since the abrasive material can be removed more reliably, even if fine barrier ribs are created by blasting (or etching), the barrier ribs will not be chipped or cracked when the thick film layer for the ribs is fired, thereby increasing the yield. Furthermore, since the abrasives adhering to the cathode can be almost eliminated, the discharge characteristics of the gas discharge display panel can be improved, and unevenness in brightness due to adhesion of the abrasives can be eliminated.

[Brief explanation of the drawing]

FIG. 1 is a manufacturing process flow diagram of a barrier rib, which provides a detailed explanation of the present invention. FIGS. (B) is a diagram for explaining the second embodiment of this invention, FIGS. 4(A)-(B) are diagrams for explaining the third embodiment of this invention, and FIGS. 5(A)-(B) ) is a diagram used to explain charging in etching by blasting, Figure 6 is a diagram showing an example of the configuration of a gas discharge display panel, and Figures 7 (A) and (B) are diagrams showing the structure of a thick film layer for ribs in the conventional method. It is a sectional view showing the state before and after the final baking. 16... Barrier rib, 24... Thick film layer 26 for ribs
...Resist pattern 28...Abrasive material, 30...Groove formation region 31.
...Ultrasonic vibration device 34...Adhesive material. He 0? −\Kusefu Kude\,/ ? -\ Roro N1〆〆1\\ Configuration example of Rokono gas discharge display panel (B) Figure 7: Conditions before and after firing of thick film layer for wab in conventional method

Claims (5)

[Claims] (1) In forming the barrier ribs of the gas discharge display panel, there are a step of laminating a thick film layer for the ribs on the base, a step of forming a resist pattern that exposes the groove forming region of the thick film layer for the ribs, and a step of forming the grooves. The method includes a step of supplying an abrasive material to the formation region and etching away the thick film layer for ribs in the groove forming region by blasting, a step of removing the abrasive material, and a step of firing the thick film layer for ribs. A barrier rib forming method characterized by: (2) The barrier rib forming method according to claim 1, characterized in that the abrasive material is removed by applying ultrasonic vibration to the base and the rib thick film layer. (3) Barrier rib formation according to claim 1, characterized in that an adhesive is applied to the abrasive-attached portion of the base and the rib thick film layer and cured, and the abrasive is removed together with the cured adhesive. Method. (4) The barrier rib forming method according to claim 1, wherein the abrasive material is removed by grounding the base. (5) The barrier rib forming method according to claim 1, characterized in that the substrate is grounded and an abrasive material is supplied to the groove forming region.