JP2001319580A - Plasma display panel, plasma display device and method for manufacturing plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plasma display panel that realizes an improvement of a display property through pertinently preventing an erroneous discharge generated in a warping of a terminal portion of a barrier rib. SOLUTION: A barrier rib 5 is formed on a dielectric layer 2 in non- peripheral portion (and area for display) of a rear glass substrate 1, as well as formed on a main face of the rear glass substrate 1 in a peripheral portion (an area for non-display). It follows that concerning a height from the main face of the rear glass substrate to a top of the barrier rib 5, the non-peripheral portion is higher than the peripheral portion by the thickness of a membrane of the dielectric layer 2. Therefore, even if a warping portion 5a is made at the terminal portion of the barrier rib 5 in a process of backing to form the barrier rib 5, in a process of pasting the front panel and the rear panel, the warping portion 5a does not contact with the front panel.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel (hereinafter referred to as "PDP") and the PDP.
Of plasma display device provided with PD and PD
The present invention relates to a method for producing P.

[0002]

2. Description of the Related Art An AC surface discharge type PDP is a type of gas discharge display panel that displays images and information using light emission based on gas discharge generated along the surface of a dielectric layer in which wall charges are accumulated. is there.

FIG. 27 is a perspective view showing the structure of a conventional AC surface discharge type PDP. 27. However, in FIG. 27, for convenience of explanation, one end of the front panel is shown opened in the Z direction in the figure with respect to the rear panel. The PDP includes a front panel and a rear panel which are separated from each other and face each other. The front panel includes a transparent electrode 107 and a metal electrode 108.
Electrode consisting of: a dielectric layer 109; and a protective film 110
And The rear panel has the address electrodes 102
, A dielectric layer 103, a partition 104, and a phosphor 105.

On the main surface of the front glass substrate 106 (the surface facing the rear glass substrate 101), there are formed a plurality of transparent electrodes 107 which are separated from each other and extend in the X direction in the figure. A part of the transparent electrode 107 has a transparent electrode 10
A metal electrode 108 for supplementing the conductivity of No. 7 is formed extending in the X direction. On the main surface of the front glass substrate 106, a transparent dielectric layer 109 made of low-melting glass is formed so as to cover the transparent electrode 107 and the metal electrode 108. On the dielectric layer 109, a transparent protective film 110 made of MgO is formed. In this specification, the dielectric layer 109 and the protective film 110 are integrally referred to as a dielectric layer 111.

[0005] On the main surface of the rear glass substrate 101 (the surface facing the front glass substrate 106), a plurality of address electrodes 102 are formed which are separated from each other and extend in the Y direction in the figure. On the main surface of the back glass substrate 101, a dielectric layer 103 made of low-melting glass is formed so as to cover the address electrodes 102. Dielectric layer 10
A plurality of partition walls 104 extending in the Y direction between the adjacent address electrodes 102 are formed on 3. Further, phosphors 105 are formed on the upper surface of the dielectric layer 103 and the side surfaces of the partition walls 104.

The front panel and the rear panel are separated from each other by a partition 104.
And the protective film 110 are brought into contact with each other, and are sealed to each other by a sealing material 112 (not shown in FIG. 27) made of low-melting glass disposed on the periphery of the panel.
A discharge gas, for example, a mixed gas of neon and xenon is sealed in each discharge space of the PDP formed by the front panel, the rear panel, and the sealant and partitioned by the partition wall 104.

[0007]

Hereinafter, a conventional method for forming the partition 104 will be described. After forming the dielectric layer 103, a glass paste material prepared by mixing a low-melting glass having a particle size of 0.05 mm or less, a high-melting filler, and a binder is entirely formed by a roll coater, and dried. . Next, a dry film resist is formed on the partition wall material, and a mask pattern is obtained by an exposure and development process. Next, after the partition wall material not covered with the mask pattern is cut by sandblasting, the mask pattern is removed. Next, a heat treatment at 300 to 400 ° C. is performed to burn off the binder. Next, 50
Heat treatment at 0 to 600 ° C. is performed to melt and sinter the low-melting glass. Thereby, the partition 1 having a predetermined shape is formed.
04 can be obtained.

[0008] As described above, the disappearance of the binder and the melting of the low-melting-point glass during the baking step cause the partition wall 1 after baking.
In 04, volume shrinkage has occurred with respect to the partition shape before firing. The volume shrinkage varies depending on the amount of the binder added, the particle size and type of the low-melting glass, and the particle size and type of the high-melting filler, but the volume of the partition 104 after firing is 60 times the volume of the partition shape before firing. It shrinks to about 90%.

Due to the volume shrinkage of the partition wall 104, the shape of the partition wall becomes non-uniform. In particular, the end of the partition wall 104 may be warped more than other portions. FIG. 28 is a cross-sectional view showing such a situation. In the state where the bottom surface of the partition 104 is in close contact with the dielectric layer 103, the partition 104 is fired.
Of the panel is drawn toward the center of the panel in plan view. Further, the adhesion between the partition wall 104 and the dielectric layer 103 is weak. Therefore, as shown in FIG.
The end of 04 is warped.

[0010] As a result, when the front panel and the rear panel are overlapped with each other, the discharge space is insufficiently partitioned due to the warpage of the ends of the partition walls 104, and discharges in predetermined discharge cells are adjacent to each other. There is a problem in that the discharge cells spread to the discharge space and cause erroneous discharge in adjacent discharge cells (that is, interference of discharge occurs).

[0011] In order to improve such warpage at the end of the partition wall, for example, Japanese Patent Application Laid-Open No. 11-120907 proposes the following invention. That is, first, a glass film having a tapered shape at both ends is formed by sandblasting using a predetermined mask pattern, and then the glass film is fired to reduce the non-uniformity of volume shrinkage during firing. By avoiding this, a flat partition wall is formed.

However, in the invention described in the above publication, it is considered difficult to stably form a glass film having a tapered shape at both ends. This is because in sandblasting, the adhesion between the glass film and the mask pattern is important, but in the case of a tapered mask pattern, the airflow generated in the sandblasting makes it easier for the mask pattern at the tip to peel off. is there. When the mask pattern peels off at the leading end, the peeling proceeds and the mask pattern peels off even at the non-leading part.Furthermore, the peeled mask pattern flies in the sandblasting apparatus, thereby causing pixel defects. It can lead to outbreaks. Therefore, in the invention described in the above publication, it is difficult to solve the above-described problem of display deterioration due to warpage of the partition wall end.

The present invention has been made to solve such a problem, and a PDP capable of realizing an improvement in display characteristics by appropriately preventing erroneous discharge caused by warpage of a partition wall end. It is an object to obtain a plasma display device including the PDP, and a method of manufacturing the PDP.

[0014]

Means for Solving the Problems Claim 1 of the present invention
The plasma display panel described in the above, a first substrate that is a display surface, a second substrate spaced apart from the first substrate and facing,
Formed on the main surface of the second substrate on the side facing the first substrate,
A plurality of first electrodes spaced apart from each other and extending in a first direction;
A first dielectric layer formed on the main surface of the second substrate so as to cover the plurality of first electrodes, and a first dielectric layer formed on the main surface of the first substrate facing the second substrate and separated from each other; Second perpendicular to one direction
A plurality of second electrodes extending in the direction, a second dielectric layer formed on the main surface of the first substrate to cover the plurality of second electrodes, a first dielectric layer and a second dielectric layer, And a plurality of partition walls formed between the first electrodes adjacent to each other and extending in the first direction between the first electrodes adjacent to each other. It is characterized in that they are in contact with each other in a display region that is a peripheral portion, and are not in contact with each other in a non-display region that is a peripheral portion of the first substrate.

According to a second aspect of the present invention, the plasma display panel is the plasma display panel according to the first aspect, wherein the first dielectric layer has a first dielectric layer.
With respect to the direction, the partition is formed only in the display area of the display area and the non-display area, and the partition straddles the display area and the non-display area, and is formed on the first dielectric layer in the display area. In the region, each of them is formed on the main surface of the second substrate.

According to a third aspect of the present invention, there is provided the plasma display panel according to the first aspect, wherein the first dielectric layer is formed over a display area and a non-display area. The thickness of the first dielectric layer in the non-display area is smaller than the thickness of the first dielectric layer in the display area.

According to a fourth aspect of the present invention, there is provided a plasma display panel according to the third aspect, wherein the first dielectric layer has a plurality of overlapping portions and a non-overlapping portion. Characterized in that it is a laminate including the following layers.

According to a fifth aspect of the present invention, there is provided a plasma display panel according to the third or fourth aspect, wherein at least a portion formed below an end of the partition wall. One dielectric layer is
It is characterized by being made of a material having a softening point lower than that of the material forming the partition.

According to a sixth aspect of the present invention, there is provided a plasma display panel, comprising: a first substrate which is a display surface; a second substrate spaced apart from the first substrate; and a side opposed to the first substrate. A plurality of first electrodes formed on the main surface of the second substrate and extending apart from each other in the first direction; and a second substrate covering the plurality of first electrodes at a non-peripheral portion of the first substrate. A first dielectric layer formed on the main surface of the second substrate, a second dielectric layer formed on the main surface of the second substrate over the plurality of first electrodes at a peripheral portion of the first substrate, The first substrate is formed on the main surface of the first substrate facing the second substrate, and is spaced apart from the first substrate.
A plurality of second electrodes extending in a second direction perpendicular to the direction, a third dielectric layer formed on the main surface of the first substrate so as to cover the plurality of second electrodes, and a first and a second dielectric layer. A plurality of partition walls formed between the body layer and the third dielectric layer and extending in the first direction between the first electrodes adjacent to each other; the second dielectric layer forms the partition walls It is characterized by being made of a material whose softening point temperature is lower than that of the material.

The plasma display panel according to a seventh aspect of the present invention is the plasma display panel according to the sixth aspect, wherein the second part of the partition wall formed on the second dielectric layer. The width in the direction is wider than the width in the second direction of the partition at the portion formed on the first dielectric layer.

The plasma display panel according to claim 8 of the present invention is the plasma display panel according to claim 7, wherein the width of the partition wall formed on the first dielectric layer is wider than that of the partition wall. The length of the partition in the first direction in the portion where the width is widened is equal to or larger than the width in the second direction of the partition in the portion formed on the first dielectric layer.

According to a ninth aspect of the present invention, there is provided a plasma display panel, comprising: a first substrate which is a display surface; a second substrate spaced apart from the first substrate; and a side opposed to the first substrate. A plurality of first electrodes formed on the main surface of the second substrate and extending in the first direction apart from each other; and a plurality of first electrodes formed on the main surface of the second substrate so as to cover the plurality of first electrodes. A first dielectric layer, a plurality of partition walls formed on the first dielectric layer and extending in the first direction between the first electrodes adjacent to each other, and a first substrate on the side facing the second substrate A plurality of second electrodes formed on the main surface, spaced apart from each other and extending in a second direction perpendicular to the first direction, and formed on the main surface of the first substrate so as to cover the plurality of second electrodes; A second dielectric layer in contact with the partition,
The hardness of at least a portion of the second dielectric layer which is in contact with the end of the partition is lower than the hardness of the partition.

The plasma display panel according to a tenth aspect of the present invention is the plasma display panel according to the ninth aspect, wherein the partition has a Vickers hardness of 420 kg / mm ² or more, and an end of the partition. Vickers hardness of the portion of the second dielectric layer in contact with
g / mm ² or less.

According to a eleventh aspect of the present invention, a plasma display device includes the plasma display panel according to any one of the first to tenth aspects and a driving circuit for driving the plasma display panel. It is provided.

According to a twelfth aspect of the present invention, there is provided a method of manufacturing a plasma display panel, comprising the steps of: Forming a first dielectric layer only on a display area of a non-peripheral portion of the first substrate and a non-display region of a peripheral portion of the first substrate on the main surface; (b) A plurality of partition walls extending in the first direction across the display region and the non-display region between the first electrodes adjacent to each other are formed on the first dielectric layer in the display region and on the first dielectric layer in the non-display region. (C) forming a plurality of second electrodes separated from each other and extending in a second direction perpendicular to the first direction on the main surface of the first substrate by baking the partition wall material; The second substrate on which the body layer is formed is placed in the display area with the second dielectric layer. In which and a step of bonding by a top of the partition wall in contact with one another.

According to a thirteenth aspect of the present invention, there is provided a method for manufacturing a plasma display panel, comprising the steps of: (a) forming a first substrate having a plurality of first electrodes spaced apart from each other and extending in a first direction; On the main surface, the first substrate has a film thickness at a peripheral portion which is smaller than a film thickness at a non-peripheral portion of the first substrate.
Forming a dielectric layer; and (b) forming first dielectric layers adjacent to each other.
Forming a plurality of partitions extending in the first direction between the electrodes on the first dielectric layer by baking the partition material;
(C) separating the second substrate on which the second dielectric layer covering the plurality of second electrodes extending in the second direction perpendicular to the first direction from each other with the second dielectric layer and the non-peripheral portion; And a step of bringing the tops of the partition walls into contact with each other and bonding them together.

The method of manufacturing a plasma display panel according to claim 14 of the present invention is the method of claim 13.
3. The method of manufacturing a plasma display panel according to item 1, wherein in the step (a), the first dielectric layer is formed by partially overlapping and laminating a plurality of layers. is there.

According to a fifteenth aspect of the present invention, a method for manufacturing a plasma display panel is provided.
3. The method for manufacturing a plasma display panel according to item 1, wherein in the step (a), the first dielectric layer is formed by sequentially stacking a plurality of layers having the same shape in plan view while displacing the formation locations. It is characterized by that.

[0029] A method of manufacturing a plasma display panel according to claim 16 of the present invention is directed to claim 13.
16. The method of manufacturing a plasma display panel according to any one of items 15 to 15, wherein at least a portion of the first dielectric layer formed below an end of the partition has a softening point higher than a material forming the partition. It is characterized by being made of a material having a low temperature.

In the method for manufacturing a plasma display panel according to the present invention, preferably, (a) the first substrate is provided with a plurality of first electrodes which are spaced apart from each other and extend in the first direction. Forming a first dielectric layer at a non-peripheral portion of the first substrate and a second dielectric layer at a peripheral portion of the first substrate on the main surface; and (b) forming a first dielectric layer between adjacent first electrodes. Forming a plurality of partition walls extending in the first direction between the first dielectric layer and the second dielectric layer by sintering the partition wall material; Bonding a second substrate on which a third dielectric layer covering a plurality of second electrodes extending in a second direction perpendicular to the second direction is formed by bringing the third dielectric layer and the top of the partition wall into contact with each other With
The second dielectric layer is made of a material having a softening point lower than that of the material forming the partition.

In the method of manufacturing a plasma display panel according to claim 18 of the present invention, (a) a plurality of first electrodes which are separated from each other and extend in a first direction are formed on a main surface; A first substrate is prepared in which the main surface is covered with a first dielectric layer and a plurality of partition walls extending in a first direction between first electrodes adjacent to each other are formed on the first dielectric layer. And (b) forming a plurality of second electrodes separated from each other and extending in a second direction perpendicular to the first direction on the main surface;
A step of preparing a second substrate in which the main surface is covered by a second dielectric layer in which the hardness of at least a portion that comes into contact with the end of the partition wall is lower than the hardness of the partition wall; 2
And bonding the substrate with the partition wall and the second dielectric layer in contact with each other.

[0032]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 1 to 5 are sectional views showing a method of manufacturing a PDP according to Embodiment 1 of the present invention in the order of steps. First, a plurality of address electrodes 2 which are separated from each other and extend in parallel in a predetermined direction on the main surface of the rear glass substrate 1 (the surface on the side facing the front glass substrate 6 later).
5 (not appearing in FIGS. 1-5). Next, the address electrode 25 at the non-peripheral portion is covered on the main surface of the non-peripheral portion (corresponding to the display region of the screen) except for the peripheral portion (corresponding to the non-display region of the screen) of the rear glass substrate 1. Thus, the dielectric layer 2 is formed with a thickness of about 20 μm (FIG. 1).

Specifically, the dielectric layer 2 can be formed by the following method. First, by screen printing using a screen plate, a low softening point glass having a particle size of 0.05 mm or less, a high softening point filler, and a binder,
A glass paste made of a solvent is formed on the main surface at the non-peripheral portion of the back glass substrate 1 and dried.
Next, a heat treatment at 300 to 400 ° C. is performed to burn off the binder. Next, heat treatment at 500 to 600 ° C. is performed to melt and sinter the low softening point glass.
Thereby, the dielectric layer 2 can be formed on the main surface of the non-peripheral portion of the back glass substrate 1.

Next, a dielectric layer 3 serving as a partition wall material is formed on the main surface in a predetermined region of the back glass substrate 1 so as to cover the dielectric layer 2 (FIG. 2). Specifically, the dielectric layer 3
It can be formed by the following method. First, a glass paste composed of a low softening point glass having a particle size of 0.05 mm or less, a high softening point filler, a binder, and a solvent is applied on a main surface in a predetermined region of the back glass substrate 1 using a roll coater. The entire surface is formed and dried. However, the green sheet (unfired tape-like sheet) including the low softening point glass having a particle size of 0.05 mm or less, the high softening point filler, and the binder is not limited to the formation using the roll coater. It may be laminated on the main surface in a predetermined area of the substrate 1.

Next, a dry film resist is formed on the entire surface of the glass paste, and exposure and development are performed to form a mask pattern 4 having an opening in a predetermined portion (FIG. 3). At this time, the length L of the dielectric layer 3
The mask pattern 4 is formed such that the length L2 of the mask pattern 4 is longer by 10 mm than 1.

Next, after removing the dielectric layer 3 in a portion not covered with the mask pattern 4 by sandblasting, the mask pattern 4 is removed, followed by baking to obtain the partition 5 (FIG. 4). . After that, a phosphor is formed on the side surface of the partition wall 5 and the upper surface of the dielectric layer 2 to complete the back panel. As shown in FIG. 4, the partition wall 5 is formed on the dielectric layer 2 at the non-peripheral portion of the rear glass substrate 1, and is formed on the main surface of the rear glass substrate 1 at the peripheral portion.

Next, the rear panel and the conventional front panel are bonded to each other with the sealing material 11 so that the protective film 10 and the top of the partition wall 5 at the non-peripheral portion are adhered to each other. The PDP according to Embodiment 1 is completed (FIG. 5). As described in the description of the related art, the front panel includes the scanning electrodes including the transparent electrodes 7 and the metal electrodes 8, the dielectric layer 9, and the protective film 10.

As described above, according to the PDP manufacturing method according to the first embodiment, as shown in FIG. 4, partition wall 5 is formed on dielectric layer 2 at the non-peripheral portion of rear glass substrate 1. The peripheral portion is formed on the main surface of the back glass substrate 1. As a result, the height from the main surface of the back glass substrate 1 to the top of the partition wall 5 is higher in the non-peripheral portion than in the peripheral portion by the thickness of the dielectric layer 2 (20 μm in the above example). ing. Therefore, even if a warped portion 5a occurs at the end of the partition wall 5 in the step of forming the partition wall 5 by firing (FIG. 6), the warped rising portion 5a remains in the front panel and the rear panel in the bonding step of the front panel and the rear panel. Do not touch For this reason, erroneous discharge caused by warpage of the end of the partition wall 5 can be appropriately prevented, and display characteristics can be improved.

In addition, since the top of the partition 5 is in close contact with the protective film 10 in the display region, there is no occurrence of discharge interference between adjacent discharge spaces defined by the partition 5. This effect becomes even more pronounced by forming the dielectric layer 2 wider than the display area, leaving a space where the end of the partition wall 5 can be formed on the main surface of the rear glass substrate 1.

Embodiment 2 7 to 10 are sectional views showing a method of manufacturing a PDP according to Embodiment 2 of the present invention in the order of steps. First, a plurality of address electrodes 25 (not shown in FIGS. 7 to 10) are formed on the main surface of the back glass substrate 1. Next, leaving the electrode pad formation region of the address electrode 25 corresponding to the outermost peripheral portion of the rear glass substrate 1 on the main surface of the rear glass substrate 1 so as to cover the address electrode 25,
The dielectric layer 13 is formed with a thickness of about 5 μm (FIG. 7).
The dielectric layer 13 is formed so as to be 30 mm longer than the length of the partition 15 to be formed later (the length in the direction in which the partition 15 extends).

Next, a dielectric layer 14 having a thickness of about 20 μm is formed on the non-peripheral portion (corresponding to the display area of the screen) of the dielectric layer 13 (FIG. 8). The dielectric layer 14 is formed so as to be shorter by 10 mm than the length of a partition 15 to be formed later. The dielectric layers 13 and 14 can be formed by forming, drying, and firing a glass paste, similarly to the dielectric layer 2 in the first embodiment.

Next, partition walls 15 are formed in predetermined regions on the dielectric layers 13 and 14 (FIG. 9). The partition 15 can be formed by forming a glass paste, drying, forming a mask pattern, sandblasting, and firing, as in the first embodiment. Thereafter, phosphors are formed on the side surfaces of the partition walls 5 and the upper surfaces of the dielectric layers 13 and 14, thereby completing the rear panel. As shown in FIG. 9, the partition wall 15 is formed on the dielectric layer 14 at the non-peripheral portion of the rear glass substrate 1 and is formed on the dielectric layer 13 at the peripheral portion.

Next, the back panel and the front panel similar to that of the first embodiment are adhered to each other with the sealing material 11 so that the protective film 10 and the top of the partition 15 at the non-peripheral portion are brought into close contact with each other. The PDP according to the second embodiment is completed (FIG. 10).

As described above, according to the method of manufacturing the PDP according to the second embodiment, as shown in FIG. 9, the partition wall 15 is formed on the dielectric layer 14 at the non-peripheral portion of the back glass substrate 1. The peripheral portion is formed on the dielectric layer 13. As a result, the height from the main surface of the back glass substrate 1 to the top of the partition wall 15 is higher in the non-peripheral portion than in the peripheral portion by the thickness of the dielectric layer 14 (20 μm in the above example). ing. Therefore, even if a warped portion occurs at the end of the partition 15 in the step of forming the partition 15 by firing, the warped portion of the partition 15 does not come into contact with the front panel in the bonding step of the front panel and the back panel. . For this reason, it is possible to appropriately prevent erroneous discharge caused by warpage of the end of the partition wall 15, and to improve display characteristics.

In addition, since the top of the partition 15 is in close contact with the protective film 10 in the display area, there is no occurrence of discharge interference between adjacent discharge spaces defined by the partition 15. This effect becomes more remarkable by forming the dielectric layer 14 wider than the display area, leaving a space where the end of the partition 15 can be formed on the dielectric layer 13.

Furthermore, since the address electrode 25 is covered with the dielectric layer 13 even in the non-display area, the address electrode 25 can be protected from various types of damage during the manufacturing process, and the wiring caused by the entry of foreign matter and the like can be prevented. It is possible to appropriately avoid the occurrence of a short circuit during the operation.

FIGS. 11 and 12 are sectional views showing a method of manufacturing a PDP according to a first modification of the second embodiment of the present invention in the order of steps. First, a plurality of address electrodes 25 (not shown in FIGS. 11 and 12) are formed on the main surface of the back glass substrate 1. Next, a dielectric layer 14 having a thickness of about 20 μm is formed on the main surface of the non-peripheral portion of the back glass substrate 1 so as to cover the address electrodes 25. Next, the address electrode 2
5 on the main surface of the rear glass substrate 1 at the peripheral portion of the rear glass substrate 1 and on the dielectric layer 14 at the non-peripheral portion, leaving a dielectric layer having a thickness of about 5 μm. 13 is formed (FIG. 11).

Next, similarly to the process shown in FIG. 9, after forming the partition 15 in a predetermined region on the dielectric layer 13, a phosphor is formed, and the rear panel is completed. Next, the back panel and the front panel similar to that of the first embodiment are adhered to each other with the sealing material 11 so that the protective film 10 and the top of the partition 15 at the non-peripheral edge are adhered to each other. It is completed (FIG. 12).

As described above, the manufacturing method of the PDP according to the first modification of the second embodiment also allows the second embodiment to be used.
The same effect as the effect obtained by the method for manufacturing a PDP according to the above is obtained.

FIGS. 13 and 14 are sectional views showing a method of manufacturing a PDP according to a second modification of the second embodiment of the present invention in the order of steps. First, a plurality of address electrodes 25 (not shown in FIGS. 13 and 14) are formed on the main surface of the back glass substrate 1. Next, over the main surface of the non-peripheral portion of the rear glass substrate 1 and the main surface of the peripheral portion located on the left side of the non-peripheral portion in FIG. Then, a dielectric layer 16a having a thickness of about 20 μm is formed so as to cover the address electrodes 25.

Next, leaving the electrode pad formation region of the address electrode 25 on the dielectric layer 16a at the non-peripheral portion,
In FIG. 13, over the main surface of the rear glass substrate 1 at the peripheral portion located on the right side of the non-peripheral portion, the address electrodes 25 exposed from the dielectric layer 16 a are covered.
The dielectric layer 16b is formed with a thickness of about 0 μm (FIG.
3). The dielectric layers 16a and 16b can be formed by forming, drying, and firing a glass paste by screen printing using a screen plate, similarly to the dielectric layer 2 in the first embodiment.

Next, in the same manner as in the step shown in FIG. 9, a partition 17 is formed in a predetermined region on the dielectric layers 16a and 16b, and then a phosphor is formed, thereby completing the rear panel. next,
The PDP is completed by bonding the back panel and the front panel similar to that of the first embodiment to each other with the protective film 10 and the top of the partition wall 17 at the non-peripheral portion in close contact with each other with the sealing material 11 ( (FIG. 14).

As described above, according to the PDP manufacturing method according to the second modification of the second embodiment, the same effects as those obtained by the PDP manufacturing method according to the second embodiment can be obtained. In addition to the above, the following effects can be obtained. That is, according to the method of manufacturing the PDP according to the second modification of the second embodiment, as the dielectric layer covering the address electrode 25, two types of dielectric layers 13 and 1 having different thicknesses and formation areas are provided.
Instead of forming the dielectric layer 4, the dielectric layers 16a and 16b having the same shape in plan view are sequentially formed with their formation locations shifted from each other. Therefore, in forming the dielectric layer, there is no need to prepare two types of screen plates that are completely different from each other.
Using substantially one type of screen plate, the dielectric layer 16
a, 16b can be formed.

Embodiment 3 FIG. 15 to 17 are sectional views showing a method of manufacturing a PDP according to Embodiment 3 of the present invention in the order of steps. First, a plurality of address electrodes 25 (not shown in FIGS. 15 to 17) are formed on the main surface of the back glass substrate 1. Next, on the main surface of the non-peripheral portion except the peripheral portion of the rear glass substrate 1, the address electrode 25 at the non-peripheral portion is provided.
Is formed to a thickness of about 20 μm so as to cover. Next, on the main surface of the peripheral portion of the back glass substrate 1, so as to cover the address electrode 25 at the peripheral portion,
The dielectric layer 2b is formed with a thickness of about 20 μm. However,
The order of forming the dielectric layers 2a and 2b may be reversed from the above description.

The dielectric layers 2a and 2b correspond to the first embodiment.
As in the case of the dielectric layer 2 in the above, the glass paste can be formed at respective predetermined locations by forming a glass paste by screen printing, drying, and firing. At this time, in the third embodiment, the softening point temperature of the inorganic substance (low softening point glass and high softening point filler) constituting each glass paste material is lower in the dielectric layer 2b than in the dielectric layer 2a. First, the type of the granular glass and the filler are selected.
Note that the softening point of the glass paste material used for the partition 5 to be formed later is equal to or higher than the softening point of the dielectric layer 2a. However, at least the softening point temperature of the glass paste material used for forming the dielectric layer 2b may be lower than the softening point temperature of the glass paste material used for forming the partition walls 5.

Next, the partition 12 is formed in a predetermined region on the dielectric layers 2a and 2b (FIG. 16). As shown in FIG. 16, the end of the partition wall 12 is located on the dielectric layer 2b. The partition 12 can be formed by forming a glass paste by screen printing, drying, forming a mask pattern, sandblasting, and firing, as in the first embodiment. Thereafter, phosphors are formed on the side surfaces of the partition walls 12 and the upper surfaces of the dielectric layers 2a and 2b, thereby completing the rear panel.

Next, the back panel and the front panel similar to that of the first embodiment are adhered to each other with the sealing material 11 so that the protective film 10 and the top of the partition wall 12 are adhered to each other. The PDP according to Embodiment 3 is completed (FIG. 17).

As described above, according to the method of manufacturing the PDP according to the third embodiment, the end of the partition 12 is located on the dielectric layer 2b, and the glass paste material used for forming the dielectric layer 2b is used. Is lower than the softening point of the glass paste material used to form the partition walls 12. Therefore, in the step of forming the partition walls 12 by firing, the glass paste material for the dielectric layer 2b softens faster than the glass paste material for the partition walls 12 when the temperature of firing is increased. Then, when the temperature of the firing is lowered after the peak temperature, the glass paste for the dielectric layer 2b is still in a softened state when the glass paste for the partition 12 starts to harden and shrink.

Therefore, when the end of the glass paste material for the partition wall 12 starts to shrink inward, the glass paste material for the dielectric layer 2b located below the end easily shrinks inward. In addition, the difference in contraction force generated between the upper end portion and the lower end portion of the partition wall 12 can be reduced, and as a result, the end portion of the partition wall 12 can be prevented from warping.

The PDP manufacturing method according to the second embodiment and the PDP according to the first modification of the second embodiment are described.
The invention according to the third embodiment is applied to the DP manufacturing method, and the softening point temperature of the glass paste material for the dielectric layer 13 is set lower than the softening point temperature of the glass paste material for the partition wall 15. May be. Further, the invention according to the third embodiment is applied to the method of manufacturing a PDP according to the second modification of the second embodiment, and the softening point temperature of the glass paste material for the dielectric layers 16a and 16b is determined by the partition wall. It may be set lower than the softening point temperature of the glass paste material for No. 17. This can more effectively prevent erroneous discharge caused by warpage of the partition wall end.

Embodiment 4 FIG. 18 is a top view showing one step of a method for manufacturing a PDP according to Embodiment 4 of the present invention. The method of manufacturing a PDP according to the fourth embodiment is different from the method of manufacturing a PDP according to the third embodiment in that a mask for sandblasting is used such that the shape of the partition wall end 12a has the shape shown in FIG. The shape of the pattern is devised.

In FIG. 18, the width W2 of the partition end 12a
Is wider than the width W1 of the partition 12 at the non-end portion (that is, W2> W1). Thereby, the contact area between the partition wall end 12a and the dielectric layer 2b is larger than when W2 is equal to W1. Further, the formation pitch P of the partition 12
Is larger than twice the width W2 of the partition end 12a (that is, P> 2 × W2). Thereby, contact between adjacent partition walls can be prevented. Furthermore, the length L of the partition end 12a in the direction in which the partition 12 extends is at least
It is not less than the width W1 of the partition wall 12 at the partition non-end portion (that is, L ≧ W1). Thereby, it is possible to prevent the mask pattern from being peeled off in the sandblasting process due to the formation of a pattern that is too thin.

As described above, according to the method of manufacturing the PDP according to the fourth embodiment, the width W2 of the partition wall end 12a is made larger than the width W1 of the partition wall 12 at the non-end portion. The contact area between the substrate and the dielectric layer 2b was increased. As described in the third embodiment, the dielectric layer 2
b is a dielectric layer formed of a glass paste material having a low inorganic softening point temperature. Therefore, the dielectric layer 2b
For example, the smoothness of the surface of the dielectric layer is higher than that of the dielectric layer 2a, for example, and the adhesion to the partition wall material is reduced. However, according to the PDP manufacturing method according to the fourth embodiment, the contact area between partition end 12a and dielectric layer 2b is increased, whereby the adhesion between them is increased. As a result, in the sandblasting step or the mask pattern peeling step, the partition wall end 12a from the dielectric layer 2b is removed.
Can be prevented, and the occurrence of defective products can be suppressed.

Embodiment 5 19 to 21 are sectional views showing a method of manufacturing a PDP according to Embodiment 5 of the present invention in the order of steps. First, a back panel similar to the conventional one is prepared. As described in the description of the related art, the back panel includes the address electrodes 25 (not shown in FIG. 19) and the dielectric layer 1.
8, a partition wall 19, and a phosphor (not shown in FIG. 19).

Further, a front panel shown in FIG. 20 is formed. Specifically, the front panel can be formed through the following manufacturing steps. First, a plurality of transparent electrodes 7 extending in a direction perpendicular to the direction in which the address electrodes 25 extend are formed on the main surface of the front glass substrate 6 (the surface facing the rear glass substrate 1 later) as the display surface. Are formed parallel to each other at a distance from each other. Next, a metal electrode 8 for supplementing the conductivity of the transparent electrode 7 is formed on a part of the transparent electrode 7. Next, a transparent dielectric layer 9 made of low-melting glass is formed on the main surface of the front glass substrate 6 so as to cover the transparent electrode 7 and the metal electrode 8.

Next, a transparent dielectric layer 20 made of low-melting glass is formed on the entire surface of the dielectric layer 9 by forming, drying, and firing a glass paste by screen printing using a screen plate. Here, the dielectric layer 20
The partition 6 is formed of a material having a lower hardness than the material constituting the partition 6. For example, the Vickers hardness of the partition 6 is 420 kg /
If it is not less than ² mm, the Vickers hardness of the dielectric layer 20 is 380 kg / mm ² or less. Next, the dielectric layer 20
A protective film 10 is formed on the entire upper surface to complete the front panel.

Next, the front panel shown in FIG.
The PDP according to the fifth embodiment is completed by bonding the rear panel shown in FIG. 9 to the top of the partition wall 19 with the protective film 10 and the sealing member 11 (FIG. 21).

FIGS. 22 and 23 are sectional views showing a method of manufacturing a PDP according to a modification of the fifth embodiment of the present invention in the order of steps. First, similarly to the above, the transparent electrode 7 is formed on the front glass substrate 6, the metal electrode 8 is formed on the transparent electrode 7, and then the dielectric layer 9 is formed. Next, formation of a glass paste by screen printing using a screen plate,
By drying and firing, the dielectric layer 20 is formed on the dielectric layer 9.
a is selectively formed. The dielectric layer 20a is formed in a region where the end of the partition wall 19 does not contact via the protective film 10 when the front panel and the rear panel are bonded later.

Next, a dielectric layer 20b is formed on the portion of the dielectric layer 9 where the dielectric layer 20a is not formed by forming, drying, and firing a glass paste by screen printing using a screen plate. . Dielectric layer 20b
Is formed of a material having a lower hardness than the material forming the partition 6, like the dielectric layer 20. However, the order of forming the dielectric layers 20a and 20b may be reversed from the above description. Next, the protective film 1 is formed on the entire surface of the dielectric layers 20a and 20b.
0 is formed to complete the front panel.

As described above, according to the PDP manufacturing method of the fifth embodiment, at least the partition wall 19 of the front panel is provided.
Dielectric layers 20 and 20b having a lower hardness than the partition wall 19 were formed in a portion which comes into contact with the end of the substrate later. Therefore, FIG.
As shown in FIG.
a, even if a occurs, the warp-up portion 19a is generated by the pressing force when the two panels are bonded to each other.
Penetrates through the protective film 10 having a sufficiently small thickness and is pushed into the dielectric layers 20 and 20b. As a result, the partition 19
Even if the warped portion 19a is generated,
Since a gap generated between the partition wall 19 and the protective film 10 after the bonding can be suppressed, erroneous discharge between adjacent discharge cells can be appropriately prevented.

According to the experimental data by the inventor,
When the Vickers hardness of the partition wall 19 is 420 kg / mm ² and the warped portion 19a of 10 μm is generated at the end of the partition wall 19, the Vickers hardness of the dielectric layers 20 and 20b is 400 kg / mm ² and 420 kg / mm ^2. m
In the case of m ^2, the warpage portion 19a is damaged by the pressing at the time of bonding, and the Vickers hardness is 380 kg /
In the case of mm ² , the warped portion 19a is formed of the dielectric layer 20,
5b embedded in 20b, Vickers hardness is 360kg
/ Mm ² , the warped portion 19a is formed of the dielectric layer 2
It was confirmed that 10 μm was buried in 0.20b.

The PDP described in each of the above embodiments and the PD
By configuring the plasma display device with a known driving circuit for driving P, a plasma display device with improved display characteristics can be obtained.

[0073]

According to the first aspect of the present invention, even if a warped portion is generated at the end of the partition in the step of forming the partition by sintering, the first substrate and the second substrate are separated from each other. In the bonding step, the warped portion of the partition does not contact the second dielectric layer. Therefore, erroneous discharge between adjacent discharge cells caused by warpage of the partition walls is appropriately prevented, and a plasma display panel with improved display characteristics can be obtained.

According to the second aspect of the present invention, the height from the main surface of the second substrate to the top of the partition is larger than the display area by the thickness of the first dielectric layer. The non-display area is lower. Therefore, when the first substrate and the second substrate are bonded to each other, a gap corresponding to the thickness of the first dielectric layer is formed between the top of the partition wall and the second dielectric layer in the non-display area. Can be done.

According to the third aspect of the present invention, the height from the main surface of the second substrate to the top of the partition is smaller in the non-display area than in the display area.
Therefore, in a state where the first substrate and the second substrate are bonded to each other, a gap can be generated between the top of the partition and the second dielectric layer in the non-display area.

Further, since the first dielectric layer is formed over the display area and the non-display area, the first electrode can be covered with the first dielectric layer even in the non-display area.

Further, according to the fourth aspect of the present invention, the first dielectric material having a partially different film thickness can be obtained by a simple structure in which a plurality of layers having an overlapping portion and a non-overlapping portion are laminated. A body layer can be formed.

According to the fifth aspect of the present invention, in the step of forming the partition by firing, the first dielectric layer softens faster than the partition when the temperature of the firing is increased.
Then, when the temperature of the firing is lowered, the first dielectric layer is still in a softened state when the partition walls start to harden / shrink. Therefore, when the end of the partition starts to contract inward, the first dielectric layer located below the end also tends to contract inward. Can reduce the difference in contraction force that occurs in As a result, it is possible to obtain a plasma display panel in which the warpage of the ends of the partition walls is suppressed and display characteristics are improved by avoiding erroneous discharge.

According to the sixth aspect of the present invention, in the step of forming the partition by firing, the second dielectric layer softens faster than the partition when the temperature of the firing is increased.
Then, when the temperature of the firing decreases, the second dielectric layer is still in a softened state when the partition walls start to harden / shrink. Therefore, when the end of the partition starts to shrink inward, the second dielectric layer located below the end also tends to shrink inward, so that the second dielectric layer between the top and bottom of the end of the partition can easily shrink inward. Can reduce the difference in contraction force that occurs in As a result, it is possible to obtain a plasma display panel in which the warpage of the ends of the partition walls is suppressed and display characteristics are improved by avoiding erroneous discharge.

According to the seventh aspect of the present invention, by increasing the contact area between the end of the partition and the second dielectric layer, it is possible to increase the adhesion between the two. As a result, in the sandblasting step or the mask pattern peeling step, peeling of the partition wall end from the second dielectric layer can be prevented, and a highly reliable plasma display panel can be obtained.

Further, according to the eighth aspect of the present invention, it is possible to prevent the mask pattern from peeling off in the sand blasting process due to the excessively narrow end shape of the wide partition wall. Thus, a highly reliable plasma display panel can be obtained.

Further, according to the ninth aspect of the present invention, even when a warped portion is formed at the end of the partition, the first substrate and the second substrate can be bonded together. Due to the pressing force, the warped portion is pushed into the second dielectric layer having a lower hardness than the partition. as a result,
Even if the partition wall has a warped portion, the gap between the bonded partition wall and the second dielectric layer can be suppressed. Therefore, it is possible to obtain a plasma display panel in which erroneous discharge between adjacent discharge cells is appropriately prevented and display characteristics are improved.

According to the tenth aspect of the present invention, the warped portion at the end of the partition wall can be pushed into the second dielectric layer by the pressing force of the bonding, and the partition wall and the second dielectric layer can be pressed. The gap between the two dielectric layers can be sufficiently suppressed.

According to the eleventh aspect of the present invention, it is possible to obtain a plasma display device having improved display characteristics.

Further, according to the twelfth aspect of the present invention, even if a warped portion occurs at the end of the partition wall in the step of forming the partition wall by firing, the first substrate and the second substrate are separated from each other. In the bonding step, the warped portion of the partition does not contact the second dielectric layer. For this reason, it is possible to appropriately prevent erroneous discharge between adjacent discharge cells caused by warpage of the partition walls.

According to the thirteenth aspect of the present invention, even if a warped portion occurs at the end of the partition in the step of forming the partition by sintering, the first substrate and the second substrate are separated from each other. In the bonding step, the warped portion of the partition does not contact the second dielectric layer. For this reason, it is possible to appropriately prevent erroneous discharge between adjacent discharge cells caused by warpage of the partition walls.

In addition, since the first dielectric layer is formed over the peripheral portion and the non-peripheral portion of the first substrate, the first electrode can be covered with the first dielectric layer also at the peripheral portion. In addition, the first electrode can be protected from various types of damage during the manufacturing process.

According to the fourteenth aspect of the present invention, the first dielectric layer having a partially different film thickness can be formed by a simple process of partially overlapping and laminating a plurality of layers. Can be formed.

Further, according to the present invention, in forming the first dielectric layer by screen printing, it is not necessary to prepare two completely different types of screen plates. It can be formed using substantially one type of screen plate, in which the design of the plate is only reversed.

According to the sixteenth aspect of the present invention, in the step of forming the partition by firing, the first dielectric layer softens faster than the partition when the temperature of the firing is increased. Then, when the temperature of the firing is lowered, the first dielectric layer is still in a softened state when the partition walls start to harden / shrink. Therefore, when the end of the partition starts to contract inward, the first dielectric layer located below the end also tends to contract inward. Can reduce the difference in contraction force that occurs in As a result, it is possible to obtain a plasma display panel in which the warpage of the ends of the partition walls is suppressed and display characteristics are improved by avoiding erroneous discharge.

According to the seventeenth aspect of the present invention, in the step of forming the partition by firing, the second dielectric layer softens faster than the partition when the temperature of the firing is increased. Then, when the temperature of the firing decreases, the second dielectric layer is still in a softened state when the partition walls start to harden / shrink. Therefore, when the end of the partition starts to shrink inward, the second dielectric layer located below the end also tends to shrink inward, so that the second dielectric layer between the top and bottom of the end of the partition can easily shrink inward. Can reduce the difference in contraction force that occurs in As a result, it is possible to suppress warpage of the ends of the partition walls, and it is possible to appropriately prevent erroneous discharge between adjacent discharge cells.

According to the eighteenth aspect of the present invention, even when a warped portion is formed at the end of the partition, the first substrate and the second substrate can be bonded together. By the pressing force, the warped portion is pushed into the second dielectric layer. As a result, even when a warped portion is generated in the partition, the gap between the bonded partition and the second dielectric layer can be suppressed, so that erroneous discharge between adjacent discharge cells can be prevented. It can be properly prevented.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a method of manufacturing a PDP according to Embodiment 1 of the present invention in the order of steps.

FIG. 2 is a cross-sectional view illustrating a method of manufacturing the PDP according to Embodiment 1 of the present invention in the order of steps.

FIG. 3 is a cross-sectional view illustrating a method of manufacturing the PDP according to Embodiment 1 of the present invention in the order of steps.

FIG. 4 is a cross-sectional view illustrating a method of manufacturing the PDP according to Embodiment 1 of the present invention in the order of steps.

FIG. 5 is a sectional view illustrating a method of manufacturing the PDP according to the first embodiment of the present invention in the order of steps.

FIG. 6 is a cross-sectional view for describing effects in the method of manufacturing a PDP according to the first embodiment of the present invention.

FIG. 7 is a sectional view illustrating a method of manufacturing the PDP according to the second embodiment of the present invention in the order of steps.

FIG. 8 is a sectional view illustrating a method of manufacturing the PDP according to the second embodiment of the present invention in the order of steps.

FIG. 9 is a cross-sectional view illustrating a method of manufacturing the PDP according to the second embodiment of the present invention in the order of steps.

FIG. 10 is a cross-sectional view showing a method of manufacturing the PDP according to the second embodiment of the present invention in the order of steps.

FIG. 11 is a cross-sectional view showing a method of manufacturing a PDP according to a first modification of the second embodiment of the present invention in the order of steps.

FIG. 12 is a cross-sectional view illustrating a method of manufacturing a PDP according to a first modification of the second embodiment of the present invention in the order of steps.

FIG. 13 is a sectional view illustrating a method of manufacturing a PDP according to a second modification of the second embodiment of the present invention in the order of steps.

FIG. 14 is a cross-sectional view showing a method of manufacturing a PDP according to a second modification of the second embodiment of the present invention in the order of steps.

FIG. 15 is a cross-sectional view showing a method of manufacturing the PDP according to Embodiment 3 of the present invention in the order of steps.

FIG. 16 is a cross-sectional view showing a method of manufacturing the PDP according to Embodiment 3 of the present invention in the order of steps.

FIG. 17 is a cross-sectional view illustrating a method of manufacturing the PDP according to Embodiment 3 of the present invention in the order of steps.

FIG. 18 is a top view showing one step of a method for manufacturing a PDP according to Embodiment 4 of the present invention.

FIG. 19 is a cross-sectional view showing a method of manufacturing the PDP according to Embodiment 5 of the present invention in the order of steps.

FIG. 20 is a cross-sectional view showing a method of manufacturing the PDP according to Embodiment 5 of the present invention in the order of steps.

FIG. 21 is a cross-sectional view showing a method of manufacturing the PDP according to Embodiment 5 of the present invention in the order of steps.

FIG. 22 is a PD according to a modification of the fifth embodiment of the present invention.
It is sectional drawing which shows the manufacturing method of P in order of a process.

FIG. 23 is a PD according to a modification of the fifth embodiment of the present invention.
It is sectional drawing which shows the manufacturing method of P in order of a process.

FIG. 24 is a PD according to a modification of the fifth embodiment of the present invention.
It is sectional drawing which shows the manufacturing method of P in order of a process.

FIG. 25 is a cross-sectional view for describing effects of the PDP manufacturing method according to the fifth embodiment of the present invention.

FIG. 26 is a PD according to a modification of the fifth embodiment of the present invention.
It is sectional drawing for demonstrating the effect by the manufacturing method of P.

FIG. 27 is a perspective view showing a structure of a conventional AC surface discharge type PDP.

FIG. 28 is a cross-sectional view for describing a problem in a conventional PDP manufacturing method.

[Explanation of symbols]

1 back glass substrate, 2, 2a, 2b, 3, 9, 13,
14, 16a, 16b, 18, 20, 20a, 20b
Dielectric layer, 4 mask patterns, 5, 12, 15, 1
7, 19 partition, 6 front glass substrate, 7 transparent electrode,
8 metal electrodes, 25 address electrodes.

Claims (18)

[Claims] A first substrate that is a display surface; a second substrate that faces the first substrate at a distance from the first substrate; and a second substrate that is formed on a main surface of the second substrate facing the first substrate. A plurality of first members spaced apart from each other and extending in a first direction;
An electrode; a first dielectric layer formed on the main surface of the second substrate so as to cover the plurality of first electrodes; and on a main surface of the first substrate on a side facing the second substrate. A plurality of second electrodes that are formed and are separated from each other and extend in a second direction perpendicular to the first direction; and formed on the main surface of the first substrate so as to cover the plurality of second electrodes. A second dielectric layer; a plurality of partition walls formed between the first dielectric layer and the second dielectric layer and extending in the first direction between the first electrodes adjacent to each other; The partition wall and the second dielectric layer are in contact with each other in a display region that is a non-peripheral portion of the first substrate in the first direction, and at a peripheral portion of the first substrate A plasma display panel, which is not in contact with each other in a certain non-display area. 2. The display device according to claim 1, wherein the first dielectric layer is formed only in the display area of the display area and the non-display area with respect to the first direction. Over the non-display area, in the display area, on the first dielectric layer,
The plasma display panel according to claim 1, wherein the non-display area is formed on the main surface of the second substrate. 3. The first dielectric layer is formed over the display area and the non-display area, and the thickness of the first dielectric layer in the non-display area is:
The plasma display panel according to claim 1, wherein the thickness of the first dielectric layer in the display area is smaller than the thickness of the first dielectric layer. 4. The plasma display panel according to claim 3, wherein the first dielectric layer is a laminate including a plurality of layers having an overlapping portion and a non-overlapping portion. 5. A method according to claim 1, wherein at least a portion of the first dielectric layer formed below an end portion of the partition is made of a material having a softening point lower than a material forming the partition. The plasma display panel according to claim 3, wherein 6. A first substrate which is a display surface, a second substrate spaced apart from and facing the first substrate, and formed on a main surface of the second substrate facing the first substrate, A plurality of first members spaced apart from each other and extending in a first direction;
An electrode, a non-peripheral portion of the first substrate, a first dielectric layer formed on the main surface of the second substrate so as to cover the plurality of first electrodes, and a non-peripheral portion of the first substrate. A second dielectric layer formed on the main surface of the second substrate so as to cover the plurality of first electrodes; and a second dielectric layer formed on the main surface of the first substrate on a side facing the second substrate. A plurality of second electrodes spaced apart from each other and extending in a second direction perpendicular to the first direction; and a third electrode formed on the main surface of the first substrate so as to cover the plurality of second electrodes. A plurality of partition walls formed between the first and second dielectric layers and the third dielectric layer and extending in the first direction between the first electrodes adjacent to each other; Wherein the second dielectric layer is made of a material having a softening point lower than that of the material forming the partition walls. Plasma display panel according to claim. 7. The width of the partition in the second direction in a portion formed on the second dielectric layer is equal to the second width of the partition in a portion formed on the first dielectric layer. The plasma display panel according to claim 6, wherein the width is wider than the width in the direction. 8. The length of the partition in the first direction in a portion wider than the partition in a portion formed on the first dielectric layer is equal to the length in the first direction. 8. The plasma display panel according to claim 7, wherein the width of the partition in the second direction is equal to or greater than a width of the partition formed in the second direction. 9. A first substrate serving as a display surface, a second substrate spaced apart from and facing the first substrate, and formed on a main surface of the second substrate facing the first substrate, A plurality of first members spaced apart from each other and extending in a first direction;
An electrode; a first dielectric layer formed on the main surface of the second substrate so as to cover the plurality of first electrodes; and a first electrode formed on the first dielectric layer and adjacent to each other. A plurality of partition walls extending in the first direction between each other; and a plurality of partition walls formed on a main surface of the first substrate on a side facing the second substrate and separated from each other and perpendicular to the first direction. A plurality of second electrodes extending in two directions; and a second dielectric layer formed on the main surface of the first substrate so as to cover the plurality of second electrodes and contact the partition wall. The plasma display panel according to claim 1, wherein a hardness of the second dielectric layer at a portion in contact with an end of the partition is lower than a hardness of the partition. 10. The partition wall has a Vickers hardness of 420 k.
and the g / mm ² or more, the Vickers hardness of the second dielectric layer of the portion contacting the end portion of the partition wall is characterized in that it is 380 kg / mm ² or less, a plasma display according to claim 9 panel. 11. A plasma display device comprising: the plasma display panel according to claim 1; and a driving circuit for driving the plasma display panel. 12. A display region, which is a non-peripheral portion of the first substrate, on a main surface of the first substrate on which a plurality of first electrodes extending in a first direction and spaced from each other are formed. Forming a first dielectric layer only in the display area of the non-display area which is a peripheral portion of the first substrate; and (b) forming the display area and the display area between the first electrodes adjacent to each other. A plurality of partitions extending in the first direction across the non-display area, on the first dielectric layer in the display area, and on the main surface of the first substrate in the non-display area; (C) forming a second dielectric layer that covers a plurality of second electrodes that are separated from each other and extend in a second direction perpendicular to the first direction; The second dielectric layer and the top of the partition wall in the display area. And a step of bonding by contacting the door together, the manufacturing method of the plasma display panel. 13. (a) On a main surface of a first substrate on which a plurality of first electrodes extending in a first direction and separated from each other are formed,
Forming a first dielectric layer in which the film thickness at the peripheral portion of the first substrate is smaller than the film thickness at the non-peripheral portion of the first substrate; (b) between the first electrodes adjacent to each other; In the first
Forming a plurality of partitions extending in the direction on the first dielectric layer by baking the partition material; and (c) separating a plurality of partitions extending in a second direction perpendicular to the first direction. Bonding a second substrate, on which a second dielectric layer covering the second electrode is formed, by contacting the second dielectric layer and the top of the partition wall at the non-peripheral portion with each other. Display panel manufacturing method. 14. The method according to claim 13, wherein in the step (a), the first dielectric layer is formed by partially overlapping and laminating a plurality of layers.
3. The method for manufacturing a plasma display panel according to 1. 15. The method according to claim 15, wherein in the step (a), the first dielectric layer is formed by sequentially stacking the plurality of layers having the same shape in plan view while displacing the formation locations. The method for manufacturing a plasma display panel according to claim 14, wherein 16. A method according to claim 1, wherein at least a portion of the first dielectric layer formed below an end of the partition is made of a material having a softening point lower than a material forming the partition. The method for manufacturing a plasma display panel according to any one of claims 13 to 15, wherein: 17. (a) On a main surface of a first substrate on which a plurality of first electrodes which are separated from each other and extend in a first direction are formed, a first dielectric material is provided on a non-peripheral portion of the first substrate. Forming a second dielectric layer at a peripheral portion of the first substrate; and (b) forming the first dielectric layer between the first electrodes adjacent to each other.
Forming a plurality of partitions extending in the direction by sintering the partition material over the first dielectric layer and the second dielectric layer; and (c) separating the first dielectric layer from each other in the first direction. A second substrate on which a third dielectric layer covering a plurality of second electrodes extending in a second direction perpendicular to the first substrate is formed by bonding the third dielectric layer and the top of the partition wall to each other. A manufacturing method of the plasma display panel, wherein the second dielectric layer is made of a material having a softening point lower than a material of the partition wall. 18. (a) A plurality of first electrodes which are separated from each other and extend in a first direction are formed on a main surface, and the main surface is formed on the first surface.
Preparing a first substrate on which the plurality of partition walls covered by a dielectric layer and extending in the first direction between the first electrodes adjacent to each other are formed on the first dielectric layer; (B) a plurality of second electrodes, which are separated from each other and extend in a second direction perpendicular to the first direction, are formed on a main surface, and the main surface comes into contact at least with an end of the partition wall later; Providing a second substrate covered by a second dielectric layer having a hardness lower than that of the partition walls; and (c) separating the first substrate and the second substrate from the partition walls and the second dielectric layer. A step of bringing the body layers into contact with each other and bonding them together.