JP2001325888A - Plasma display and method of manufacturing the same - Google Patents

Abstract

(57) [Summary] [Problem] A baking step is not required for forming a partition,
It is another object of the present invention to provide a plasma display to which a screen printing method can be applied for forming an electrode and a dielectric layer, and a method for manufacturing the same. SOLUTION: In the plasma display, each partition 15 is formed integrally with the substrate glass 12, between which an electrode arrangement partition 17 is disposed, and on each upper end thereof, an electrode 18 and a dielectric layer 19 are provided. Was adopted. In the manufacturing method, the substrate glass 12
A partition wall forming step of integrally forming the partition walls 15 thereon, an electrode placement partition wall forming step of providing the electrode placement partition walls 17 at positions between the respective partition walls 15, and an electrode 18 on the upper end of each electrode placement partition wall 17
An electrode forming step of providing a dielectric layer 19 on each electrode 18.
And a step of forming a dielectric layer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display used as a display device and a technique suitable for a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, a plasma display is shown in FIG.
As shown in the figure, two substrate glasses 1 and 2 facing each other
A plurality of sets of electrodes 4 covered with a transparent dielectric layer 3 having a protective film made of MgO or the like are formed on one surface of the substrate glass 1 facing the substrate glass 2. A plurality of sets of electrodes 6 covered with a dielectric layer 5 having high reflectivity are arranged on the opposite surface of the other substrate glass 2 in a direction orthogonal to the electrodes 4, and further thereon,
In order to form a discharge cell 7 which is a space for performing gas discharge, a plurality of partition walls 8 are provided in parallel with the electrodes 6 and located between the electrodes 6. Further, inside each discharge cell 7, a phosphor 9 corresponding to RGB (red, green, blue) is arranged.

[0003] The two substrate glasses 1 and 2 facing each other are put together, and the surroundings are sealed with a sealing glass or the like in a state in which a rare gas such as Ne or He is sealed in each discharge cell 7. It has become. The electrode 4 and the electrode 6
Are respectively drawn out to the outside, and by selectively applying a voltage to the terminals connected to them, a discharge is selectively generated between the electrodes 4 and 6 in the discharge cell 7, and this discharge The excitation light from the phosphor 9 in the discharge cell 7 is displayed outside.

The substrate glass 2 of the above-described plasma display is manufactured, for example, by a method outlined below (not shown). First, a plurality of sets of electrodes 6 are patterned on the original substrate glass by a method such as printing and fixed by firing, and then the dielectric material having the high reflectance is placed on the original substrate glass on which these electrodes 6 are formed. The body layer 5 is applied and fired. After that, a partition material is applied so as to cover the entire surface of the original substrate glass including the electrodes 6 and the dielectric layer 5. Then, after forming a pattern with a photoresist such as a dry film resist (DFR), portions other than the pattern are removed by sandblasting or the like.

[0005] In this sand blast, the particle size is 20 to 3
An abrasive such as glass beads of about 0 μm or calcium carbonate is blown out from a nozzle to cut the partition wall material.
At this time, the lower portion of the photoresist remains without being removed, and the partition 6 is formed. Although the film surface of the dielectric layer 5 is exposed in the cut portion other than the partition 6, it is hardened by baking in advance, so that it is harder than the material of the partition 5. Stops. Thereafter, by firing, the processing of the partition 6 is completed.

Thereafter, phosphors (phosphor pixels) 9 are formed in the respective discharge cells 7 separated by the partition walls 6 by using a screen printing method. This screen printing method uses a printing method via a screen,
This is a method in which a paste-like liquid mixed with a phosphor is poured into a predetermined discharge cell 7 and then dried.

[0007]

By the way, the above-mentioned partition wall material has a content of an organic substance as a binder for keeping a shape after printing and drying as small as possible, and is a material which is easy to cut. On the other hand, the dielectric layer 5
Is made harder to be cut by firing. However, in general, glass (the original substrate glass) always undergoes deformation such as thermal shrinkage when heat due to such firing is applied. To avoid this deformation, lower the firing temperature as much as possible or reduce the number of firings. Is preferred in terms of improving the yield.

[0008] Therefore, as disclosed in Japanese Patent Application Laid-Open No. H8-212918, there has been proposed a method of forming a partition by directly etching an original substrate glass. In this case, it is possible to obtain an advantage that a step of baking is not required for forming the partition as in the case of using the partition material. However, it is necessary to form an electrode and a dielectric layer disposed between each partition after forming each partition. However, these electrodes and the dielectric layer are usually formed by a screen printing method, but the height of the partition walls is usually about 150 μm or more, so that each material reaches the deep groove bottom between them. And it is difficult to apply the screen printing method.

The present invention has been made in view of the above circumstances, and aims to achieve the following objects. That is, an object of the present invention is to provide a plasma display which does not require a firing step in forming a partition wall, and which can be applied with a screen printing method in forming an electrode and a dielectric layer, and a method of manufacturing the same.

[0010]

Means for Solving the Problems The plasma display of the present invention and the method for manufacturing the same employ the following means to solve the above-mentioned problems. That is, the plasma display according to claim 1 has a plurality of discharge cells partitioned by a plurality of partition walls between opposed substrate glasses, wherein each of the partition walls is the same as the substrate glass on which these are provided. An electrode arrangement partition is disposed between the partition walls, and an electrode and a dielectric layer are provided on the upper end of the electrode arrangement partition.

According to the first aspect of the present invention, each partition can be integrally formed on the substrate glass by a method such as cutting the substrate glass. Unlike the manufacturing method, it is not necessary to apply baking for hardening each partition to the substrate glass. In addition, since the electrodes and the dielectric layer are not disposed at the deep bottom between the partitions as in the related art, they are disposed at the upper ends of the electrode placement partitions protruding from the bottom. In providing the electrodes and the dielectric layer by the screen printing method, it is not necessary to feed these materials deep between the partition walls as in the related art.

A plasma display according to a second aspect is the plasma display according to the first aspect,
Further, a dielectric layer is provided on the upper end of each partition, and the upper end of the dielectric layer on each partition and the upper end of the dielectric layer on each of the electrode arrangement partition have the same height. And According to the plasma display of claim 2, a dielectric layer is provided not only on the upper end of the electrode arrangement partition but also on the partition, and the dielectric layer upper end on each partition and the dielectric layer on each electrode arrangement partition are provided. Since the upper end of the body layer was the same height, when the rear plate, which is the substrate glass on the side where each partition wall is provided, was overlapped with the front plate, which is the other substrate glass, and bonded together, Sealing can be performed without forming a gap in the bonding surface.

[0013] The plasma display according to claim 3 is the plasma display according to claim 1,
Further, a dielectric layer is provided on an upper end of each of the partition walls, and an upper end of the dielectric layer on each of the partition walls is higher than an upper end of the dielectric layer on each of the electrode arrangement partition walls. According to the plasma display of the third aspect, since the upper end of the dielectric layer on each partition is set higher than the upper end of the dielectric layer on each partition for electrode arrangement, the back plate and the front plate are bonded. When combined, a gap is formed between the dielectric layer on the electrode arrangement partition of the back plate and the front plate.
In the plasma display of the present invention, each discharge cell is divided into two divided discharge cells due to the presence of the electrode arrangement partition. However, two divided discharge cells constituting each discharge cell are formed on the electrode arrangement partition. It is connected via a gap. As a result, the two divided discharge cells constituting each discharge cell can be discharged together, and the discharge efficiency can be improved, so that the drive voltage can be reduced.

According to a fourth aspect of the present invention, in the plasma display according to any one of the first to third aspects, both the upper end of each partition and the upper end of the partition for electrode arrangement are provided. , The electrode is provided. According to the plasma display of the fourth aspect, by forming a dielectric layer of the same thickness on each partition and each electrode arrangement partition,
The upper end of the dielectric layer on each partition and the upper end of the dielectric layer on each electrode arrangement partition can be at the same height.

According to a fifth aspect of the present invention, there is provided the plasma display according to any one of the first to third aspects, wherein each of the partition walls and each of the electrode placement partition walls is the electrode arrangement. Only at the top of the bulkhead for
The electrode is provided. Claim 5
According to the plasma display described in (1), it is not necessary to form an electrode as a dummy on each partition, so that expensive electrode materials can be saved and manufacturing costs can be reduced.

According to a sixth aspect of the present invention, in the method for manufacturing a plasma display having a plurality of discharge cells defined by a plurality of partitions between opposing substrate glasses, each of the partitions is provided. A step of forming the partition walls integrally on the substrate glass, a step of forming an electrode placement partition wall at a position between the partition walls, and providing an electrode at an upper end of each of the electrode placement partition walls. An electrode forming step; and a dielectric layer forming step of providing a dielectric layer on each of the electrodes.

According to the method of manufacturing a plasma display according to the sixth aspect, the same operation as that of the first aspect can be obtained. That is, since each partition can be integrally formed on the substrate glass by a method such as cutting the substrate glass, baking for hardening each partition as in the conventional manufacturing method of applying and cutting the material of the partition. Need not be added to the substrate glass. In addition, since the electrodes and the dielectric layer are not disposed at the deep bottom between the partitions as in the related art, they are disposed at the upper ends of the electrode placement partitions protruding from the bottom. In providing the electrodes and the dielectric layer by the screen printing method, it is not necessary to feed these materials deep between the partition walls as in the related art.

According to a seventh aspect of the present invention, in the method of manufacturing a plasma display according to the sixth aspect, the step of forming the partition and the step of forming the partition for electrode arrangement are performed simultaneously. I do. According to the method of manufacturing a plasma display according to the seventh aspect, the partition forming step and the electrode arrangement partition forming step are collectively performed as a common step, so that the number of steps is reduced and the manufacturing cost is reduced. Can be. Further, the height of each partition and the height of each electrode forming partition can be easily and accurately aligned to the same height.

According to a eighth aspect of the present invention, there is provided a method of manufacturing a plasma display according to the seventh aspect, wherein the partition forming step, the electrode arrangement partition forming step, the electrode forming step, or The partition formation step, the electrode arrangement partition wall formation step, the electrode formation step, and the dielectric layer formation step are performed simultaneously. According to the method for manufacturing a plasma display according to the eighth aspect, the partition forming step, the electrode forming partition forming step and the electrode forming step, or the partition forming step, the electrode forming partition forming step, the electrode forming step, and the dielectric Since the layer forming step is performed collectively as a common step, the number of steps can be further reduced and the manufacturing cost can be reduced.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to a plasma display and a method of manufacturing the same, and its first to seventh embodiments.
The embodiment will be described below with reference to the drawings,
Of course, the present invention should not be construed as being limited to these.

[First Embodiment] First, the first embodiment of the present invention will be described.
An embodiment will be described. FIG. 1 is a diagram showing the plasma display of the embodiment, and is a partially exploded perspective view. FIG. 2 is a cross-sectional view of the plasma display viewed from the direction of arrow A in FIG. FIG. 3 shows the plasma display in FIG.
It is sectional drawing seen from the -B cross section. 4 to 9 are:
It is a diagram showing a manufacturing process of the same plasma display,
FIG. 2 is a cross-sectional view corresponding to a view seen from a direction of an arrow A in FIG. 1.

The plasma display of this embodiment is
As shown in FIGS. 1 to 3, the substrate glass 11 is composed of two substrate glasses 11 and 12 facing each other.
On one surface facing the substrate glass 12, there are formed a plurality of sets of electrodes 14 covered with a transparent dielectric layer 13 having a protective film 13a made of MgO or the like. Further, a plurality of groove-shaped discharge cells 16 defined by a plurality of partition walls 15 integrally formed with the substrate glass 12 are provided on the opposite surface of the other substrate glass 12, and between the partition walls 15, The electrode arrangement partition walls 17 are provided, respectively, and the electrode 18 and the dielectric layer 19 are provided on the upper ends of these electrode arrangement partition walls 17. In addition, an electrode 18 and a dielectric layer 19 are similarly provided at the upper end of each partition 15.

The arrangement relationship of each of the above components in the substrate glass 12 is as follows. That is, each partition 15, each discharge cell 16, each electrode arrangement partition 17, each electrode 18, and each dielectric layer 19 are parallel to each other and orthogonal to each electrode 14 on the substrate glass 11 side. It extends in the direction. The partition wall 17 for electrode arrangement is located at a substantially central portion in the groove width direction between the partition walls 15 and is formed integrally with the substrate glass 12. At each upper end of each of the electrode arrangement partition walls 17 and each of the partition walls 15, a linear electrode 18 is provided along the upper end thereof.
The respective linear dielectric layers 19 are provided so as to cover the upper ends of the electrodes 18.

In this embodiment, each partition 15 and each electrode arrangement partition 17 are set at the same height, and furthermore, the electrode 18 on the partition 15 and the electrode 18 on the electrode arrangement partition 17
The dielectric layer 19 on the partition 15 and the dielectric layer 19 on the electrode arrangement partition 17 are formed to have the same thickness. And
With such a configuration, the upper end of the dielectric layer 19 on each partition 15 and the dielectric layer 1 on each electrode arrangement partition 17 are formed.
Nine upper ends are set at the same height.

It is to be noted that among the electrodes 18, the partition wall 1 for each electrode arrangement is used.
The electrode 18 at the upper end of the electrode 7 is provided for performing electrical discharge between the electrode 14 and the electrode 14 on the substrate glass 11 side, whereas the electrode 18 at the upper end of each of the partition walls 15 is provided. Reference numeral 18 denotes the thickness of the electrode layer 18 when the substrate glass 12 is bonded to the substrate glass 11.
In order to prevent a gap from being formed between the protective film 13a of FIG. 3 and the upper end of each partition 15, the dielectric layer 19 on each partition 15 and the dielectric layer 19 on each electrode arrangement partition 17 have the same height. It is provided in order to align.

Each of the electrode arrangement partitions 17 divides each of the discharge cells 16 located between the partitions 15 into divided discharge cells 16A and 16B which are two equal spaces. These divided discharge cells 16A, 16B (discharge cells 16) are used as spaces for performing gas discharge, and phosphors 20 corresponding to RGB (red, green, blue) are arranged at the bottoms thereof. Note that these phosphors 20 are arranged corresponding to any one of R (red), G (green), and B (blue) between each partition 15, but on both sides of the partition 17 for electrode arrangement. Between the divided discharge cells 16A and 16B of the same color.
Are arranged.

The two opposing substrate glasses 1 described above
1, 12 are superimposed on each other and then each discharge cell 16
A structure in which a rare gas such as Ne or He is sealed in the inside and the periphery is sealed with a seal glass or the like. The electrode 14 and the electrode 18 are respectively drawn out to the outside, and by selectively applying a voltage to the terminal connected thereto, the electrode 14 and the electrode 18 in the discharge cell 16 are selectively.
A discharge is generated between the discharge cells 18 and the discharge cell 1
Excitation light from the phosphor 20 in 6 (in the divided discharge cells 16A and 16B) is displayed outside.

However, as described above, the substrate glass 12
Of the electrodes 18 provided on the electrode 18, the electrode 18 disposed on the upper end of the electrode arrangement partition 17 is connected to generate a discharge, and the other electrode 18 disposed on the upper end of each partition 15 is connected to the other electrode 18. Are used as float electrodes that are not electrically connected, or are grounded so as not to hinder discharge.

The substrate glass 12 of the above-described plasma display is manufactured by the method outlined below. That is, the partition wall forming step of cutting the original substrate glass to form the partition wall 15 integrally therewith, and similarly cutting the original substrate glass to integrally form the electrode arrangement partition walls 17 with the original substrate glass at positions between the partition walls. The electrode forming partition forming step, and the electrode 1 is formed on each upper end of the partition 15 and the electrode forming partition 17.
Forming electrodes 8, forming a dielectric layer 19 on each upper end of these electrodes 18, and forming a phosphor 20 in each discharge cell 16 (in divided discharge cells 16A and 16B). And a phosphor forming step. Here, the partition wall forming step and the electrode arrangement partition wall forming step are performed collectively and simultaneously, and are hereinafter collectively referred to as an all partition wall forming step.

Each of the above steps will be described in detail. First, in the entire partition wall forming step, the original substrate glass is washed and dried, and then a dry film having sand blast resistance (cut resistance to sand blast) is formed on the upper surface thereof. A sheet-like photoresist such as a resist is pressure-bonded (not shown). Then, this photoresist is exposed and developed by using a mask or the like, so that the partition walls 15 are formed as shown in FIG.
And a photoresist 12P having a predetermined pattern corresponding to the position and shape of the electrode arrangement partition wall 17 is formed (note that
Reference numeral 12A shown in the figure is the original substrate glass. ).

Thereafter, the portion of the original substrate glass 12A where the photoresist 12P is not formed is cut by sandblasting, and then the photoresist 12P is peeled off as shown in FIG. The partition wall 17 is formed. Spaces sandwiched between the partition wall 15 and the electrode-arranging partition wall 17 are formed as divided discharge cells 16A and 16B, respectively.
The discharge cells 16 are composed of 6A and 16B.

In the above sandblasting, when calcium carbonate or glass beads are used,
Original substrate glass 12 made of a material such as soda lime glass
It is preferable to use silicon carbide powder or alumina having a sufficient cutting force because the cutting force is weaker than that of A and cutting may not be performed sufficiently. In this case, it is preferable to select a dry film resist (for example, trade name “BF403” manufactured by Tokyo Ohka) from the viewpoint of the adhesive strength to the original substrate glass 12A and the high sandblast resistance.

In the above-mentioned all partition forming step, the partition 15 and the electrode-arranging partition 17 are formed so as to be integrated with the original substrate glass 12A by sandblasting. However, the present invention is not limited to this. A method of forming by molding or the like can be adopted.

Subsequently, the manufacturing is sequentially performed in the order of the electrode forming step, the dielectric layer forming step, and the phosphor forming step. That is, in the electrode forming step, a silver paste (for example, trade name “XFP-5” manufactured by Namics) is used.
369-50L ") is applied by a screen printing method so as to cover each upper end of the partition wall 15 and the electrode arrangement partition wall 17. At this time, the partition wall 15 and the electrode arrangement partition wall 17 are formed.
The silver paste may be applied so as to cover only the respective upper end portions, or may be applied from the upper end portion to both side portions near the upper end.

Then, for example, under heating conditions of 150 ° C.
And dried at 550 ° C. for 1 minute.
By baking for 0 minutes, as shown in FIG.
8 is completed. As described above, the electrode 18 arranged on the partition 15 has the same height dimension as the electrode arrangement partition 17 on both sides thereof, as shown in FIG. This is provided so as not to generate a gap g between them. Therefore, these electrodes 18
Among them, the one arranged on the partition wall 15 is used as a float electrode that is not electrically connected, or is grounded so as not to hinder discharge. As the thickness dimension of the electrode 18 thus formed, it is preferable to apply, for example, a thickness dimension range of 5 μm.

Next, the process proceeds to the dielectric layer forming step. In this step, a dielectric paste (for example, “GLP-86087” manufactured by Sumitomo Metal Mining Co., Ltd.) is applied so as to cover the electrode 18 by a screen printing method. At this time, the dielectric paste may be applied so as to cover only the respective upper end surfaces of the respective electrodes 18, or from the upper end surface portions to both side portions near the upper end of the electrode 18, and further,
The coating may be performed so as to cover both side surfaces near the upper end of the partition wall 15 and the electrode arrangement partition wall 17.

Then, for example, under heating conditions of 150 ° C.
And dried at 550 ° C. for 1 minute.
By performing the baking for 0 minutes, the formation of the dielectric layer 19 is completed as shown in FIG. As the thickness dimension of the dielectric layer 19 thus formed, it is preferable to apply a thickness dimension range of, for example, 10 μm.

Next, the process proceeds to the phosphor forming step. In this step, red, green, and blue (R, G, B) shown in FIG.
Corresponding to red, green, and blue (R, G, B) using a screen, a mask, and the like at the bottom inside each discharge cell 16 (that is, each bottom within each divided discharge cell 16A, 16B). Three kinds of phosphor pastes are selectively printed. At this time, the phosphor paste is applied so that the colors of the divided discharge cells 16A and 16B on both sides of each electrode arrangement partition 17 are the same.

The phosphor powder includes, for example, a green phosphor (trade name "P1G1"), a red phosphor (trade name "KX504A"), and a blue phosphor (trade name "KX501A") manufactured by Kasei Optonix. Are mixed in an appropriate amount with a vehicle for screen printing (for example, manufactured by Okuno Pharmaceutical Co., Ltd.), and are formed in a predetermined pattern by a screen printing method. Then, for example, under heating conditions of 150 ° C., 10
After drying for 10 minutes under the peak heating condition of 450 ° C., the formation of the phosphor 20 is completed as shown in FIG.

The substrate glass 12 manufactured through the above-described steps is separated from the substrate glass 11 manufactured separately.
In these terminal portions (not shown), the electrodes 14 and 18 are respectively drawn out and connected to the outside, the inside of the discharge cell 16 is replaced with a rare gas such as Ne or He, and the substrate glasses 11 and 12 are bonded to each other. The periphery is sealed with a sealing glass or the like (not shown) to complete the plasma display shown in FIG.

In the plasma display of the present embodiment, in the substrate glass 12, each partition 15 is formed integrally with the original substrate glass 12A, and
The electrode arrangement partition walls 17 are formed integrally with the original substrate glass 12A.
And a structure in which a dielectric layer 19 is provided. Further, in the manufacturing method, a partition wall forming step of integrally forming each partition wall 15 on the original substrate glass 12A, an electrode arrangement partition wall forming step of forming an electrode arrangement partition wall 17 at a position between each partition wall, A method including an electrode forming step of providing an electrode 18 on the upper end of the arrangement partition 17 and a dielectric layer forming step of providing a dielectric layer 19 on each electrode 18 was employed.

Therefore, according to the plasma display and the method of manufacturing the same according to the present embodiment, the partition walls 15 and the electrode arrangement partition walls 17 can be integrally formed on the original substrate glass 12A by a method of cutting the original substrate glass 12A. Since it is possible, it is not necessary to apply baking for hardening the partition walls 15 and the electrode arrangement partition walls 17 to the original substrate glass 12A as in the conventional manufacturing method of applying and cutting the partition wall material.

In addition, each electrode 18 and dielectric layer 19
Instead of being provided at the deep bottom of each inter-partition position as in the prior art, each electrode arrangement partition 17 protruding from this bottom is provided.
Since the electrode 18 and the dielectric layer 19 are formed by screen printing,
It is not necessary to feed these materials deep between the partition walls 15 as in the related art. Therefore, a baking process is not required for forming the partition wall 15, and the screen printing method can be applied to the formation of the electrode 18 and the dielectric layer 19.

In the plasma display of the present embodiment, electrodes 18 having the same film thickness are provided on both the upper end of each partition wall 15 and the upper end of each partition wall 17 for electrode arrangement on the substrate glass 12, and further thereon. , Dielectric layer 1 having the same thickness
By providing 9, the upper end of the dielectric layer 19 on each partition 15 and the upper end of the dielectric layer 19 on each electrode arrangement partition 17 are made the same height. According to this configuration, when the rear plate, which is the substrate glass 12 on the side on which the partition walls 15 are provided, is overlapped with the front plate, which is the other substrate glass 11, the rear plate and the front plate are bonded. Sealing can be easily performed without forming a gap in the surface. That is, between adjacent discharge cells 16 or divided discharge cells 16
It is possible to easily seal between A and 16B.

The method of manufacturing a plasma display according to the present embodiment employs a method in which the partition wall forming step and the electrode arrangement partition wall forming step are performed simultaneously. According to this manufacturing method, the partition wall forming step and the electrode arrangement partition wall forming step can be performed as a common step, so that the number of steps can be reduced and the manufacturing cost can be reduced. Further, the height of each partition 15 and the height of each electrode forming partition 17 can be easily and accurately aligned to the same height.

In the manufacturing method of this embodiment, the manufacturing process is performed in the order of the entire partition wall forming step, the electrode forming step, the dielectric layer forming step, and the phosphor forming step. The present invention is not limited to this, and it is only necessary to specify that the dielectric layer forming step is performed after the electrode forming step and the phosphor forming step is performed after the entire partition wall forming step. Hereinafter, examples of other manufacturing methods in the second to fourth embodiments will be described.

[Second Embodiment] Referring to FIGS. 10 to 12, an example of a method of manufacturing the plasma display of the first embodiment will be described. An embodiment will be described.
In the manufacturing method of the first embodiment, the substrate glass 12 is manufactured by performing the manufacturing processing in the order of the entire partition wall forming step, the electrode forming step, the dielectric layer forming step, and the phosphor forming step.
In contrast, in the present embodiment, the substrate glass 12 is manufactured by performing manufacturing processes in the order of the electrode forming step, the entire partition wall forming step, the dielectric layer forming step, and the phosphor forming step. This is significantly different from the first embodiment. Note that, in the present embodiment, the dielectric layer forming step, the phosphor forming step, and the method of manufacturing the substrate glass 12 and then manufacturing the plasma display of the first embodiment are described in the first embodiment. Is the same as
Description is omitted. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

First, in the electrode forming step, after cleaning and drying the original substrate glass 12A, the position and shape of the upper end of the partition 15 and the electrode-arranging partition 17 (position and shape of the electrode 18) are screen-printed. A silver paste is applied according to the above. Thereafter, for example, by holding for 10 minutes under a heating condition of 150 ° C. and drying, and further performing baking for 10 minutes under a heating condition of 550 ° C., as shown in FIG. The electrode 18 is formed corresponding to the position and the shape of.

Next, in the entire partition forming step, each electrode 1
By pressing a sheet-shaped photoresist such as a dry film resist having sandblast resistance on the entire upper surface of the original substrate glass 12A on which the substrate 8 is formed, and exposing and developing the photoresist with a mask or the like, as shown in FIG. The photoresist 12P having a predetermined pattern corresponding to the position and shape of the partition 15 and the electrode-arranging partition 17, that is, corresponding to the position and shape of each electrode 18.
To form

Thereafter, a portion of the surface of the original substrate glass 12A on which the photoresist 12P is not formed is cut by sandblasting, and then the photoresist 12P is peeled off, as shown in FIG. Partition 17 is formed. Spaces sandwiched between the partition wall 15 and the electrode arrangement partition wall 17 are formed as divided discharge cells 16A and 16B, respectively, and a pair of divided discharge cells 16A and 16B which are spaces on both sides of the electrode arrangement partition wall 17 as boundaries. Thus, the discharge cells 16 are configured. Thereafter, as described in the first embodiment, the dielectric layer 1
9. The substrate glass 12 is manufactured by forming the phosphor 20, and the plasma display of the first embodiment can be manufactured from the substrate glass 12.

As described above, the first embodiment can also be performed by manufacturing the substrate glass 12 by performing the manufacturing process in the order of the electrode forming process, the entire partition forming process, the dielectric layer forming process, and the phosphor forming process. The plasma display according to the embodiment can be manufactured, and the same effects as those of the plasma display manufacturing method according to the first embodiment can be obtained. That is, according to the manufacturing method of the present embodiment, as in the conventional manufacturing method of applying and cutting the partition wall material, baking for hardening each partition wall 15 and the electrode arrangement partition wall 17 is applied to the original substrate glass 12A. There is no necessity, and no baking step is required for forming the partition 15 and the electrode 1
The screen printing method can be applied to the formation of the dielectric layer 8 and the dielectric layer 19.

[Third Embodiment] A third embodiment of the method of manufacturing a plasma display according to the present invention will be described with reference to FIGS. 13 to 15 as an example of the method of manufacturing the plasma display of the first embodiment. An embodiment will be described.
The manufacturing method of this embodiment is almost the same as that of the second embodiment, but the present embodiment is different from the second embodiment in that the firing of the silver paste and the base glass 12A
1 after sandblasting
The difference is that 2P removal is performed in the same step. In the present embodiment, a dielectric layer forming step, a phosphor forming step, and a method of manufacturing a plasma display after manufacturing the substrate glass 12 are the same as those in the first embodiment, and therefore will be described. Is omitted. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

First, in the electrode forming step, after cleaning and drying the original substrate glass 12A, as shown in FIG. 13, the position and shape of the upper end of the partition wall 15 and the electrode arrangement partition wall 17 are formed by screen printing (FIG. 13). The silver paste 18A is applied corresponding to the position and shape of the electrode 18). Thereafter, the substrate is dried by holding it at a heating condition of, for example, 150 ° C. for 10 minutes. Here, the baking of the silver paste 18A is not performed. Then, during the electrode forming step, that is, the silver paste 18A
Before baking, the process proceeds to the next step of forming all partitions.

Next, in the entire partition wall forming step, the entire upper surface of the original substrate glass 12A coated with the silver paste 18A is
Printing a photoresist with sandblast resistance,
By exposing and developing this photoresist using a mask or the like, as shown in FIG. 14, the positions and shapes of the partition walls 15 and the electrode arrangement partition walls 17, that is, each silver paste 1
A photoresist 12P having a predetermined pattern is formed corresponding to the position and shape of 8A. Thereafter, a portion of the surface of the original substrate glass 12A where the photoresist 12P is not formed is cut by sandblasting, thereby forming the partition 15 and the partition 17 for electrode arrangement.

Subsequently, the removal of the photoresist 12P in the entire partition wall forming step and the baking of the silver paste 18A in the electrode forming step are performed simultaneously. That is, as shown in FIG. 15, for example, by baking for 10 minutes under a heating condition of 550 ° C., the baking of the silver paste 18A is performed, thereby forming the electrode 18 and burning out the photoresist 12P.

Then, the partition wall 15 and the electrode-arranging partition wall 17 are formed.
Spaces sandwiched between the divided discharge cells 16A,
A pair of divided discharge cells 16A and 16B, which are formed as 16B and are spaces on both sides of the electrode arrangement partition 17 as a boundary.
Thus, the discharge cells 16 are configured. Thereafter, as described in the first embodiment, the substrate glass 12 is manufactured by forming the dielectric layer 19 and the phosphor 20, and the plasma display of the first embodiment is further manufactured from the substrate glass 12. Can be manufactured.

According to the manufacturing method of this embodiment, first,
The same effect as in the second embodiment can be obtained. That is, according to the manufacturing method of the present embodiment, each partition 15
It is not necessary to add baking for curing the partition wall 17 for disposing the electrode to the original substrate glass 12A, a baking process is not required for forming the partition wall 15, and screen printing is performed for forming the electrode 18 and the dielectric layer 19. The law is applicable. Further, according to the present embodiment, silver paste 18A
Baking and the removal of the photoresist 12P can be performed in the same step, so that the manufacturing steps can be shortened as compared with the first and second embodiments.

[Fourth Embodiment] Referring to FIGS. 16 and 17, an example of a method of manufacturing the plasma display according to the first embodiment will be described. An embodiment will be described.
The manufacturing method of the present embodiment is different from the second method in that the substrate glass 12 is manufactured by performing manufacturing processing in the order of an electrode forming step, a whole partition forming step, a dielectric layer forming step, and a phosphor forming step. , And the third embodiment. This embodiment is different from the second and third embodiments in that the electrode 18 has a function as a mask when the original substrate glass 12A is cut by sandblasting, and the partition 18 and the electrode The only difference is that the photoresist 12P of the pattern of the partition wall 17 is not formed. Also, in the present embodiment, the dielectric layer forming step, the phosphor forming step, and the method of manufacturing the plasma display after manufacturing the substrate glass 12 are the same as those of the first embodiment, and therefore will be described. Is omitted. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

First, in the electrode forming step, after cleaning and drying the original substrate glass 12A, the position and shape of the upper end of the partition 15 and the electrode-arranging partition 17 (position and shape of the electrode 18) are screen-printed. A silver paste is applied according to the above. Thereafter, for example, the substrate is dried by holding it at a heating condition of 150 ° C. for 10 minutes, and further baked at a heating condition of 550 ° C. for 10 minutes, as shown in FIG. The electrode 18 is formed corresponding to the position and the shape of.

In this embodiment, the electrode 18 is formed so that the electrode 18 has sandblast resistance in order to function as a mask when the original substrate glass 12A is cut by sandblasting. That is, after firing, the electrode 18 is formed using a silver paste having anti-sandblast properties. Further, in the present embodiment, since the electrode 18 functions as a mask when the original substrate glass 12A is cut by sandblasting, no partition is formed at a portion where the electrode 18 is not formed. Therefore, in this step, it is necessary to form the electrodes 18 corresponding to all the formation positions of the partition walls 15 and the electrode arrangement partition walls 17.

Next, in the entire partition wall forming step, each electrode 1
8 as a mask, on the surface of the original substrate glass 12A,
By cutting the portion where the electrode 18 is not formed by sandblasting, as shown in FIG.
Then, the electrode arrangement partition 17 is formed. Spaces sandwiched between the partition walls 15 and the electrode arrangement partition walls 17 are formed as divided discharge cells 16A and 16B, respectively.
The discharge cells 16 are constituted by a pair of divided discharge cells 16A and 16B which are spaces on both sides of the electrode arrangement partition wall 17 as a boundary. Thereafter, as described in the first embodiment, the substrate glass 12 is manufactured by forming the dielectric layer 19 and the phosphor 20.
The plasma display according to the embodiment can be manufactured.

In the present embodiment, the silver paste is fired before the original substrate glass 12A is cut by sandblasting. However, the present invention is not limited to this. The firing may be performed after the original substrate glass 12A is cut by sandblasting. In this case, the original substrate glass 12A may be cut using a silver paste having sandblast resistance and using the silver paste before firing as a mask. In addition, as a silver paste having sandblast resistance, specifically, a silver paste, a glass frit, and a resin component having sandblast resistance can be exemplified.

According to the manufacturing method of the present embodiment, first to
The same effect as that of the third embodiment can be obtained. That is, according to the manufacturing method of the present embodiment, each partition 15
It is not necessary to add baking for curing the partition wall 17 for disposing the electrode to the original substrate glass 12A, a baking process is not required for forming the partition wall 15, and screen printing is performed for forming the electrode 18 and the dielectric layer 19. The law is applicable. Further, according to the present embodiment, the steps of coating, exposing, developing, and removing the photoresist are not required, so that
Compared with the third embodiment, the manufacturing process can be shortened and the manufacturing cost can be reduced.

As described above, in the manufacturing methods of the first to fourth embodiments, the case where the manufacturing process is performed with the whole partition forming step, the electrode forming step, the dielectric layer forming step, and the phosphor forming step as separate steps has been described. However, the present invention is not limited to this, and a plurality of steps among these steps can be simultaneously performed simultaneously. Hereinafter, examples of other manufacturing methods in which the fifth and sixth embodiments are characterized in that a plurality of steps among these steps are performed simultaneously and collectively will be described.

[Fifth Embodiment] A fifth embodiment of the method of manufacturing a plasma display according to the present invention will be described with reference to FIGS. 18 to 20 as an example of the method of manufacturing the plasma display according to the first embodiment. An embodiment will be described.
The present embodiment is characterized in that the entire partition wall forming step and the electrode forming step are performed simultaneously and collectively. Note that, in the present embodiment, the dielectric layer forming step, the phosphor forming step, and the method of manufacturing the substrate glass 12 and then manufacturing the plasma display of the first embodiment are described in the first embodiment. Therefore, the description is omitted. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

First, after cleaning and drying the original substrate glass 12A, a silver paste is applied to the entire surface of the original substrate glass 12A, and then dried by holding at, for example, a heating condition of 150 ° C. for 10 minutes. 10 ° C under heating condition
By baking for minutes, the electrode material 18B is formed on the entire surface of the original substrate glass 12A, as shown in FIG. Next, a sheet-like photoresist such as a dry film resist having sand blast resistance is pressure-bonded to the entire upper surface of the original substrate glass 12A on which the electrode material 18B is formed, and the photoresist is exposed and developed by using a mask or the like. As shown in FIG. 19, a photoresist 12P having a predetermined pattern is formed in accordance with the positions and shapes of the partition wall 15 and the electrode arrangement partition wall 17.

Thereafter, the surface of the original substrate glass 12A and the portion of the electrode material 18B where the photoresist 12P is not formed is cut by sandblasting, and then the photoresist 12P is peeled off, as shown in FIG. 15, the electrode arrangement partition wall 17, and the electrode 18 can be formed collectively. Spaces sandwiched between the partition wall 15 and the electrode arrangement partition wall 17 are formed as divided discharge cells 16A and 16B, respectively.
A pair of divided discharge cells 16 which are spaces on both sides of the boundary 7
The discharge cells 16 are constituted by A and 16B. Thereafter, as described in the first embodiment, the substrate glass 12 is manufactured by forming the dielectric layer 19 and the phosphor 20, and the plasma display of the first embodiment is further manufactured from the substrate glass 12. Can be manufactured.

According to the manufacturing method of the present embodiment, first to first
The same effect as in the fourth embodiment can be obtained. That is, according to the manufacturing method of the present embodiment, each partition 15
It is not necessary to add baking for curing the partition wall 17 for disposing the electrode to the original substrate glass 12A, a baking process is not required for forming the partition wall 15, and screen printing is performed for forming the electrode 18 and the dielectric layer 19. The law is applicable. Further, according to the present embodiment, since the entire partition wall forming step and the electrode forming step can be performed collectively as a common step, the present embodiment is compared with the plasma display manufacturing methods of the first to fourth embodiments. Thus, the manufacturing process can be shortened and the manufacturing cost can be reduced.

[Sixth Embodiment] Referring to FIGS. 21 to 23, an example of the method of manufacturing the plasma display according to the first embodiment will be described. An embodiment will be described.
In the manufacturing method of the fifth embodiment, the method of simultaneously performing the all-partition forming step and the electrode forming step at the same time is employed. In the present embodiment, however, the all-partition forming step and the electrode forming step are further performed. And the step of forming a dielectric layer is performed simultaneously and collectively. In the present embodiment, the phosphor forming step and the method of manufacturing the plasma display of the first embodiment after manufacturing the substrate glass 12 are the same as those of the first embodiment, and therefore will be described. Is omitted. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

First, after cleaning and drying the original substrate glass 12A, a silver paste is applied to the entire surface of the original substrate glass 12A, and then dried and dried in the same manner as in the fifth embodiment.
By baking, the electrode material 18B is formed on the entire surface of the original substrate glass 12A. Next, a dielectric paste is applied to the entire surface of the original substrate glass 12A on which the electrode material 18B is formed,
Thereafter, for example, the film is held at a heating condition of 150 ° C. for 10 minutes, dried, and further baked at a heating condition of 550 ° C. for 10 minutes, as shown in FIG.
An electrode material 18B and a dielectric 19A are formed on the entire surface of 2A.
After forming the electrode paste, without drying and firing,
A dielectric paste is formed, and the electrode paste and the dielectric paste are simultaneously dried and fired. As shown in FIG. 21, an electrode material 18B and a dielectric 19A are formed on the entire surface of the original substrate glass 12A.
May be formed.

Next, a sheet-like photoresist such as a dry film resist having sand blast resistance is pressed on the entire upper surface of the original substrate glass 12A on which the dielectric 19A is formed, and the photoresist is exposed and developed using a mask or the like. Thereby, as shown in FIG. 22, a photoresist 12P having a predetermined pattern is formed corresponding to the positions and shapes of the partition wall 15 and the electrode arrangement partition wall 17.

Thereafter, portions of the surface of the original substrate glass 12A, the electrode material 18B, and the dielectric 19A where the photoresist 12P is not formed are cut by sandblasting, and thereafter, the photoresist 12P is peeled off, as shown in FIG. As described above, the partition 15, the electrode arrangement partition 17, the electrode 1
8. The dielectric layer 19 can be formed at once. Spaces sandwiched between the partition wall 15 and the electrode arrangement partition wall 17 are formed as divided discharge cells 16A and 16B, respectively, and a pair of divided discharge cells 16A and 16B which are spaces on both sides of the electrode arrangement partition wall 17 as boundaries. Thus, the discharge cells 16 are configured. Thereafter, as described in the first embodiment, the substrate glass 12 is manufactured by forming the phosphors 20, and the plasma display of the first embodiment can be manufactured from the substrate glass 12. it can.

According to the manufacturing method of the present embodiment, first to
The same effect as in the fifth embodiment can be obtained. That is, according to the manufacturing method of the present embodiment, each partition 15
It is not necessary to add baking for curing the partition wall 17 for disposing the electrode to the original substrate glass 12A, a baking process is not required for forming the partition wall 15, and screen printing is performed for forming the electrode 18 and the dielectric layer 19. The law is applicable. Further, according to the present embodiment, since the entire partition wall forming step, the electrode forming step, and the dielectric layer forming step can be collectively performed as a common step, the plasma displays of the first to fifth embodiments can be collectively performed. The manufacturing process can be shortened and the manufacturing cost can be reduced as compared with the manufacturing method of (1).

[Seventh Embodiment] Next, a description will be given of a seventh embodiment of the plasma display and the method of manufacturing the same according to the present invention. FIG. 24 is a diagram showing the plasma display of the same embodiment, and is a partially exploded perspective view. FIG. 25 is a cross-sectional view of the plasma display viewed from the direction of arrow D in FIG. FIG. 26 shows the plasma display of FIG.
It is sectional drawing seen from E section. 27 to 35
24 is a view showing a manufacturing process of the plasma display, and is a cross-sectional view corresponding to a view seen from the direction of arrow D in FIG. 24.

The plasma display of this embodiment is
Compared with the plasma display of the first embodiment, the substrate glass 11 (front plate) has the same structure, but the structure of the substrate glass 12 (back plate) is particularly different. In the description, the front glass will be described as a substrate glass 11 using the same reference numeral 11 and the rear plate will be described as a substrate glass 32 using a new reference numeral 32.

The plasma display of this embodiment is
As shown in FIGS. 24 to 26, the substrate glass 1 is composed of two substrate glasses 11 and 32 facing each other.
On one surface facing the substrate glass 32, a plurality of sets of electrodes 14 covered with a transparent dielectric layer 13 having a protective film 13a made of MgO or the like are formed. In addition, a plurality of groove-shaped discharge cells 36 defined by a plurality of partition walls 35 integrally formed with the substrate glass 32 are provided on the opposite surface of the other substrate glass 32, and between the partition walls 35,
The electrode arrangement partition walls 37 are respectively provided. Further, an electrode 38 is provided only at the upper end of each of the partition walls 37 and each of the electrode arrangement partition walls 37, and a dielectric layer is provided on both the upper end of each of the electrode 38 and each of the partition walls 35. 39 is provided.

The arrangement relationship of each of the above components in the substrate glass 32 is as follows. That is, each partition 35, each discharge cell 36, each electrode arrangement partition 37, each electrode 38, and each dielectric layer 39 are parallel to each other, and are orthogonal to each electrode 14 on the substrate glass 11 side. It extends in the direction. Each of the partition walls 37 for electrode arrangement is located substantially at the center of the partition wall 35 in the groove width direction, and is formed integrally with the substrate glass 32.
On the upper end of each electrode arrangement partition 37, there is formed a linear electrode 38 along the same. Further, each of the linear dielectric layers 39 is formed so as to cover the upper end of the electrode 38.
Are formed. On the other hand, at the upper end of each partition 35, each linear dielectric layer 39 along the same is formed.

As described above, in the present embodiment, the electrode 38 is provided only at the upper end of each of the electrode arrangement partitions 37 among the respective partition walls 35 and each of the electrode arrangement partitions 37. Further, each partition wall 35 and each electrode arrangement partition wall 37 are set at the same height, and the dielectric layer 39 on each partition wall 35 is more electrode than the dielectric layer 39 on each electrode arrangement partition wall 37. It is formed thicker by a thickness of 38. By adopting such a configuration, the upper end of the dielectric layer 39 on each partition 15 and the upper end of the dielectric layer 39 on each electrode arrangement partition 37 are set at the same height. By adopting such a configuration, when the substrate glass 32 (back plate) is bonded to the substrate glass 11 (front plate), no gap is generated in the bonding surface.

Each of the electrode arrangement partition walls 37 is provided with a corresponding one of the partition walls 35.
Each of the discharge cells 36 located therebetween is divided into divided discharge cells 36A and 36B, which are two equal spaces. These divided discharge cells 36A and 36B (discharge cells 36)
It is used as a space for gas discharge, and at the bottom,
Phosphors 40 corresponding to RGB (red, green, blue) are arranged. Note that these phosphors 40 are provided on each partition 3.
Each of the divided discharge cells 36A and 36B on both sides of the partition wall 37 for electrode placement is arranged corresponding to any one of R (red), G (green), and B (blue) every 5 spaces. Phosphors 40 of the same color are arranged.

The two glass substrates 1 facing each other as described above
1, 32 are superimposed on each other, each discharge cell 36
A structure in which a rare gas such as Ne or He is sealed in the inside and the periphery is sealed with a seal glass or the like. The electrode 14 and the electrode 38 are respectively drawn out to the outside, and by selectively applying a voltage to the terminals connected to the electrodes 14 and 38, the electrodes 14 and 38 in the discharge cell 36 are selectively selected.
38, a discharge is generated between the discharge cells 3.
The excitation light from the phosphors 40 in 6 (in the divided discharge cells 36A and 36B) is externally displayed.

The substrate glass 32 of the plasma display described above is manufactured by the method outlined below. That is, an electrode forming step of forming the electrodes 38 on the upper surface of the original substrate glass, and forming the dielectric layers 39 on the upper ends of the respective electrodes 38 and the positions on the upper surface of the original substrate glass where the upper ends of the partition walls 35 are formed. A dielectric layer forming step, a partition wall forming step of cutting the original substrate glass to form the partition wall 35 integrally therewith, and a similar process of cutting the original substrate glass to form the electrode arrangement partition 37 at a position between the partition walls 35. A step of forming a partition for electrode arrangement integrally formed with the substrate glass;
6 (in the divided discharge cells 36A and 36B) and a phosphor forming step of forming the phosphor 40. here,
The partition wall forming step and the electrode arrangement partition wall forming step,
This is performed collectively and simultaneously, and is hereinafter collectively referred to as an all partition wall forming step.

The above steps will be described in detail. First, in the electrode forming step, after cleaning and drying the original substrate glass,
As shown in FIG. 27, an electrode sheet 38A is pressed on the entire surface of the upper surface of the original substrate glass 32A in the order of Cr, Cu, and Cr. Thereafter, as shown in FIG. 28, an etching resist 32P having a pattern corresponding to the shape and the pitch interval of the electrode 38 to be formed is stuck on the upper surface of the electrode sheet 38A to perform masking. At this time, the etching resist 32P is patterned so that the electrode 38 is formed only on the upper end of the electrode arrangement partition 37. Thereafter, by removing the remaining portion of the electrode sheet 38A except for the portion covered with the etching resist 32P, FIG.
The formation of the electrode 38 is completed as shown in FIG.

Next, the process proceeds to the dielectric layer forming step. In this step, the position and shape of the upper end of the partition wall 35 and the electrode-arranging partition wall 37 which are to be subsequently formed by a screen printing method using a dielectric paste (eg, “GLP-86087” manufactured by Sumitomo Metal Mining Co., Ltd.). Print according to. At this time, the dielectric paste on the partition wall 35 is formed so as to be thicker than the paste on the electrode arrangement partition wall 37 by the thickness of the electrode 38. Note that the dielectric paste is applied to the partition walls 35.
By printing separately on the upper side and on the electrode arrangement partition 37, the thickness of the dielectric paste can be changed between the partition 35 and the electrode arrangement partition 37.

If the thickness of the electrode 38 is negligibly small compared to the thickness of the dielectric layer 39, it is necessary to print the dielectric paste separately on the partition wall 35 and the electrode arrangement partition wall 37. However, they may be formed at substantially the same thickness at the same time. After forming the dielectric paste as described above, for example, it is dried by holding it at a heating condition of 150 ° C. for 10 minutes,
Further, by baking for 10 minutes under the heating condition of 550 ° C., the formation of the dielectric layer 39 is completed as shown in FIGS.

Next, the process proceeds to the all-partitioning-wall forming step. In this step, first, a sheet-shaped photoresist such as a dry film resist having sandblast resistance is pressure-bonded (not shown). The photoresist is exposed and developed using a mask or the like, thereby forming a photoresist 32Q having a predetermined pattern corresponding to the position and shape of each of the discharge cells 36, as shown in FIG.

Thereafter, the portion of the original substrate glass 32A, on which the photoresist 32Q is not formed, is cut by sandblasting to obtain the state shown in FIG. Thereafter, the photoresist 32Q is peeled off and dried to complete the formation of the partition wall 35 and the electrode arrangement partition wall 37, as shown in FIG. Spaces sandwiched between the partition wall 35 and the electrode arrangement partition wall 37 are formed as divided discharge cells 36A and 36B, respectively.
The discharge cells 36 are composed of 6A and 36B.

In the above sandblasting, when calcium carbonate or glass beads are used,
Original substrate glass 32 made of a material such as soda lime glass
It is preferable to use silicon carbide powder or alumina having a sufficient cutting force because the cutting force is weaker than that of A and cutting may not be performed sufficiently. In this case, it is preferable to select a dry film resist in consideration of the adhesive strength to the original substrate glass 32A and the high sandblast resistance. In the above-mentioned all-partition forming step, the partition 35 and the electrode-arranging partition 37 are formed so as to be integrated with the original substrate glass 32A by a sand blast method. However, the present invention is not limited to this. Etc. can also be adopted.

Next, the process proceeds to the phosphor forming step. In this step, red, green, and blue (R, G,
B), a screen is provided on the bottom inside each discharge cell 36 (that is, each bottom inside each divided discharge cell 36A, 36B).
Red, green, blue (R, G, B) respectively using a mask
Are selectively printed with three types of phosphor pastes corresponding to. At this time, the phosphor paste is applied such that the colors of the divided discharge cells 36A and 36B on both sides of each electrode arrangement partition 37 become the same.

The phosphor powder includes, for example, a green phosphor (trade name “P1G1”), a red phosphor (trade name “KX504A”), and a blue phosphor (trade name “KX501A”) manufactured by Kasei Optonics. Are mixed in an appropriate amount with a vehicle for screen printing (for example, manufactured by Okuno Pharmaceutical Co., Ltd.), and are formed in a predetermined pattern by a screen printing method. Then, for example, under heating conditions of 150 ° C., 10
After drying for about 10 minutes under the peak heating condition of 450 ° C., the formation of the phosphor 40 is completed as shown in FIG.

The substrate glass 32 manufactured through the above-described steps is separated from the substrate glass 11 manufactured separately.
In these terminal portions (not shown), the electrode 14 and the electrode 38 are respectively drawn out and connected, and the inside of the discharge cell 36 is replaced with a rare gas such as Ne or He, so that the substrate glasses 11 and 32 are bonded to each other. Then, the plasma display shown in FIG. 24 is completed by sealing the periphery with a sealing glass or the like (not shown).

In the plasma display of the present embodiment, similarly to the first embodiment, in the substrate glass 32, each partition 35 is formed integrally with the original substrate glass 32A. An electrode arrangement partition 37 is formed integrally with the original substrate glass 32A, and an electrode 38 and a dielectric layer 39 are formed on each upper end of the electrode arrangement partition 37.

In the manufacturing method, an electrode forming step of forming the electrodes 38 on the upper surface of the original substrate glass 32A, and the upper ends of the electrodes 38 and the upper ends of the partition walls 35 on the upper surface of the original substrate glass 32A are formed. Dielectric layer 39 in place
Forming the dielectric layer, cutting the original substrate glass 32A to form the partition wall 35 integrally therewith, and cutting the original substrate glass 32A to form an electrode at a position between the respective partition walls 35. An electrode arrangement partition wall forming step of forming the partition wall 37 integrally with the original substrate glass 32A;
And a phosphor forming step of forming the phosphor 40 therein.

Therefore, according to the plasma display and the method of manufacturing the same according to the present embodiment, the partition wall 35 and the electrode arrangement partition wall 37 can be integrally formed on the original substrate glass 32A by a method of cutting the original substrate glass 32A. Since it is possible, unlike the conventional manufacturing method of applying and cutting the partition wall material, it is not necessary to apply baking for hardening the partition walls 35 and the electrode arrangement partition walls 37 to the original substrate glass 32A.

Further, each electrode 38 and the dielectric layer 39 are
Instead of being disposed at the deep bottom of the position between the partitions 35 as in the conventional case, the electrodes 38 are disposed at the upper ends of the electrode placement partitions 37 protruding from the bottom. In forming the dielectric layer 39 and the dielectric layer 39, it is not necessary to feed these materials deep between the partition walls 35 as in the related art. Therefore, a baking process is not required for forming the partition wall 35, and the screen printing method can be easily applied to the formation of the electrode 38 and the dielectric layer 39.

Further, in the plasma display according to the present embodiment, the electrode
The electrode 38 is provided only on the upper surface, and the dielectric layer 39 on each partition 35 is provided.
Is formed by forming the dielectric layer 39 so as to be thicker by the thickness of the electrode 38 than the dielectric layer 39 on each of the electrode arrangement partition walls 37. A configuration was adopted in which the upper end of the dielectric layer 39 on the electrode arrangement partition 37 was flush with the upper end. According to this configuration, each partition 35
When the back plate, which is the substrate glass 32 on the side where is provided, is superimposed on and bonded to the front plate, which is the other substrate glass 11, no gap is formed on the bonding surface between the back plate and the front plate. It can be easily sealed. That is,
Between adjacent discharge cells 36 or divided discharge cells 36A, 36A
B can be easily sealed.

In the plasma display of the present embodiment, the electrodes 38 are provided only on the upper end of each of the partition walls 37 and each of the partition walls 37 in the substrate glass 32. The configuration was adopted. According to this configuration, since it is not necessary to form an electrode as a dummy on each partition 35, it is possible to save the electrode material (electrode sheet) and reduce the manufacturing cost.

The method of manufacturing a plasma display according to the present embodiment employs a method in which the partition wall forming step and the electrode arrangement partition wall forming step are performed simultaneously. According to this manufacturing method, the partition wall forming step and the electrode arrangement partition wall forming step can be performed as a common all partition wall forming step,
It is possible to reduce the man-hour and the manufacturing cost. Furthermore, the height of each partition 35 and each electrode forming partition 3
It is also possible to easily and accurately align the height 7 with the same height.

In the manufacturing method according to the present embodiment, the manufacturing process is performed in the order of the electrode forming step, the dielectric layer forming step, the entire partition wall forming step, and the phosphor forming step. The present invention is not limited to this. It is only necessary to define that the dielectric layer forming step is performed after the electrode forming step and that the phosphor forming step is performed after the entire partition wall forming step. For example, as in the first embodiment, An electrode forming step after the entire partition forming step,
The manufacturing process may be performed in the order of the dielectric layer forming step and the phosphor forming step.

Further, the present invention is not limited to the case where the manufacturing process is performed by separately performing the entire partition wall forming step, the electrode forming step, the dielectric layer forming step, and the phosphor forming step. As described in the embodiment, a method of performing the entire partition forming step and the electrode forming step, or the method of performing the entire partition forming step, the electrode forming step, and the dielectric layer forming step at the same time may be employed.

In the first and seventh embodiments, the structure is adopted in which the upper end of the dielectric layer on each partition and the upper end of the dielectric layer on each partition for electrode arrangement are the same height. Is not limited to this. Even if the upper end of the dielectric layer on each partition and the upper end of the dielectric layer on each partition for electrode placement are not at the same height, each discharge cell is formed so that discharge leakage does not occur between discharge cells displaying each color. In the case where the height of the upper end of the dielectric layer on the partitioning partition can be made uniform, the upper end of the dielectric layer on each partition is 10 times higher than the upper end of the dielectric layer on each partition for electrode arrangement.
It is desirable to form the dielectric layer so as to be about 50 μm higher.

As described above, the upper end of the dielectric layer on each partition is
By making it higher than the upper end of the dielectric layer on each electrode arrangement partition, when the back plate and the front plate are bonded together, the upper end of the dielectric layer on each electrode arrangement partition of the back plate and the front plate Since a gap is formed between the two cells, two divided discharge cells constituting each discharge cell are connected through the gap. as a result,
Since two divided discharge cells constituting each discharge cell can be discharged together, and the discharge efficiency can be improved, the driving voltage can be reduced. As described in the seventh embodiment, the dielectric paste is divided and printed on the partition and the electrode-arranging partition so that the thickness of the dielectric layer is reduced on the partition and the electrode-arranging partition. Can be changed with above.

[0102]

As described above, according to the plasma display of the present invention, each partition is formed integrally with the substrate glass on which the partition is provided, and between each partition, the partition for electrode arrangement is provided. A configuration in which an electrode and a dielectric layer are provided on the upper end of the electrode arrangement partition wall is adopted. According to this configuration, since each partition can be integrally formed on the substrate glass by a method such as cutting the substrate glass, each partition is hardened as in the conventional manufacturing method of applying and cutting the material of the partition. There is no need to apply firing to the substrate glass.

Further, the respective electrodes and the dielectric layer are not provided at the deep bottom between the respective partitions as in the prior art, but are provided at the upper end of each electrode arrangement partition protruding from this bottom. Therefore, when the electrodes and the dielectric layer are provided by the screen printing method, it is not necessary to feed these materials deep between the partition walls as in the related art. Therefore, a baking process is not required for forming the partition, and the screen printing method can be applied to the formation of the electrode and the dielectric layer.

The method of manufacturing a plasma display according to the present invention includes a partition wall forming step of integrally forming the partition walls on the substrate glass on which the partition walls are provided, and an electrode for providing a partition for electrode arrangement at a position between the partition walls. A method including an arrangement partition formation step, an electrode formation step of providing an electrode on the upper end of each electrode arrangement partition, and a dielectric layer formation step of providing a dielectric layer on each electrode was employed.

According to this manufacturing method, the same effects as those of the plasma display of the present invention can be obtained. That is, since each partition can be integrally formed on the substrate glass by a method such as cutting the substrate glass, baking for hardening each partition as in the conventional manufacturing method of applying and cutting the material of the partition. Need not be added to the substrate glass. In addition, since the electrodes and the dielectric layer are not disposed at the deep bottom between the partitions as in the related art, they are disposed at the upper ends of the electrode placement partitions protruding from the bottom. In providing the electrodes and the dielectric layer by the screen printing method, it is not necessary to feed these materials deep between the partition walls as in the related art. Therefore, a baking process is not required for forming the partition, and the screen printing method can be applied to the formation of the electrode and the dielectric layer. In the method of manufacturing a plasma display according to the present invention, a partition wall forming step, a partition wall forming step for electrode arrangement,
By simultaneously performing a plurality of steps of the electrode forming step and the dielectric layer forming step, it is possible to reduce the number of steps and the manufacturing cost.

[Brief description of the drawings]

FIG. 1 is a view showing a plasma display according to a first embodiment of the present invention, and is a partially exploded perspective view.

FIG. 2 is a cross-sectional view of the plasma display as viewed from the direction of arrow A in FIG.

FIG. 3 is a cross-sectional view of the plasma display as viewed from a cross section BB of FIG. 2;

FIG. 4 is a cross-sectional view showing a first step in the method of manufacturing the plasma display and corresponding to a view seen from the direction of arrow A in FIG. 1;

FIG. 5 is a cross-sectional view showing a next step in the manufacturing method of the plasma display.

FIG. 6 is a cross-sectional view showing a next step in the manufacturing method of the plasma display.

FIG. 7 is an enlarged view of a portion C of FIG. 6 in the method of manufacturing the plasma display.

FIG. 8 is a cross-sectional view showing a next step in the manufacturing method of the plasma display.

FIG. 9 is a cross-sectional view showing a next step in the plasma display manufacturing method.

FIG. 10 is a diagram showing a first step in the method for manufacturing a plasma display according to the second embodiment of the present invention.

FIG. 11 is a diagram showing the next step in the method for manufacturing the plasma display.

FIG. 12 is a diagram showing the next step in the method for manufacturing the plasma display.

FIG. 13 is a diagram illustrating a first step in the method for manufacturing a plasma display according to the third embodiment of the present invention.

FIG. 14 is a view showing the next step in the method for manufacturing the plasma display.

FIG. 15 is a view showing the next step in the method for manufacturing the plasma display.

FIG. 16 is a diagram illustrating a first step in the method for manufacturing a plasma display according to the fourth embodiment of the present invention.

FIG. 17 is a view showing a next step in the method of manufacturing the plasma display.

FIG. 18 is a diagram illustrating a first step in the method for manufacturing a plasma display according to the fifth embodiment of the present invention.

FIG. 19 is a diagram showing the next step in the method for manufacturing the plasma display.

FIG. 20 is a diagram showing the next step in the method for manufacturing the plasma display.

FIG. 21 is a diagram illustrating a first step in the method of manufacturing a plasma display according to the sixth embodiment of the present invention.

FIG. 22 is a diagram showing a next step in the plasma display manufacturing method.

FIG. 23 is a diagram showing the next step in the plasma display manufacturing method.

FIG. 24 is a view showing a plasma display according to a seventh embodiment of the present invention, and is a partially exploded perspective view.

FIG. 25 is a cross-sectional view of the same plasma display as viewed from the direction of arrow D in FIG. 24.

FIG. 26 shows the same plasma display as E- of FIG.
It is sectional drawing seen from E section.

FIG. 27 is a view showing the first step in the method of manufacturing the plasma display, and is a cross-sectional view corresponding to the view seen from the direction of arrow D in FIG. 24.

FIG. 28 is a cross-sectional view showing a next step in the manufacturing method of the plasma display.

FIG. 29 is a cross-sectional view showing a next step in the manufacturing method of the plasma display.

FIG. 30 is a cross-sectional view showing a next step in the manufacturing method of the plasma display.

FIG. 31 is an enlarged view of a portion F in FIG. 30 in the same method for manufacturing a plasma display.

FIG. 32 is a cross-sectional view showing a next step in the manufacturing method of the plasma display.

FIG. 33 is a cross-sectional view showing a next step in the manufacturing method of the plasma display.

FIG. 34 is a cross-sectional view showing a next step in the manufacturing method of the plasma display.

FIG. 35 is a cross-sectional view showing a next step in the manufacturing method of the plasma display.

FIG. 36 is a view showing a conventional plasma display, and is a partially exploded perspective view.

[Explanation of symbols]

 11, 12, 32 ... substrate glass 15, 35 ... partition 16, 36 ... discharge cell 17, 37 ... electrode arrangement partition 18, 38 ... electrode 19 ... dielectric layer

Continuing from the front page (72) Inventor Wu Ji-Hwan 2-7 Sugasawa-cho, Tsurumi-ku, Yokohama-shi, Kanagawa Prefecture F-term in Samsung Electronics Research Laboratories Co., Ltd. 5C027 AA01 AA09 5C040 FA01 FA04 GA03 GB03 GB12 GC12 GC19 GF08 GF19 JA12 JA15 JA17 MA22 MA26

Claims (8)

[Claims] 1. A plasma display having a plurality of discharge cells defined by a plurality of partitions between opposing substrate glasses, wherein each of the partitions is integrally formed with the substrate glass on which they are provided. A plasma display, comprising a partition for electrode arrangement disposed between partitions, and an electrode and a dielectric layer provided on the upper end of the partition for electrode arrangement. 2. The plasma display according to claim 1, further comprising: a dielectric layer provided on an upper end of each of the partition walls; an upper end of the dielectric layer on each of the partition walls; A plasma display, wherein the upper end of the dielectric layer is flush with the upper end. 3. The plasma display according to claim 1, further comprising: a dielectric layer provided on an upper end of each of the partition walls; and an upper end of the dielectric layer on each of the partition walls being provided on each of the electrode arrangement partition walls. A plasma display, wherein the height is higher than the upper end of the dielectric layer. 4. The plasma display according to claim 1, wherein the electrodes are provided on both the upper ends of the partition walls and the upper ends of the partition walls for disposing the electrodes. A plasma display characterized by the following. 5. The plasma display according to claim 1, wherein the electrode is provided only at an upper end of each of the electrode arrangement partitions among the partition and the electrode arrangement partitions. A plasma display comprising: 6. A method of manufacturing a plasma display having a plurality of discharge cells defined by a plurality of partitions between opposed substrate glasses, wherein each of the partitions is integrally formed on the substrate glass on which each of the partitions is provided. A partition forming step of forming; an electrode disposing partition forming step of providing an electrode disposing partition at a position between the respective partitions; an electrode forming step of providing an electrode on an upper end of each electrode disposing partition; and a dielectric material on each of the electrodes. A dielectric layer forming step of providing a layer,
A method for manufacturing a plasma display, comprising: 7. The method for manufacturing a plasma display according to claim 6, wherein the step of forming the partition wall and the step of forming the electrode arrangement partition wall are performed.
A method for manufacturing a plasma display, which is performed simultaneously. 8. The method for manufacturing a plasma display according to claim 7, wherein the partition forming step, the electrode forming partition forming step and the electrode forming step, or the partition forming step and the electrode forming partition forming step. And performing the electrode forming step and the dielectric layer forming step at the same time.