JPH04101304A - Electroconductive material - Google Patents

Abstract

PURPOSE:To accomplish a low-cost conductive material excellent in prevention of oxidation and migration by using electroconductive powder for the conductive material, and forming the conductive powder through coating of the surfaces of a base metal with noble metal other than Ag by means of, e.g. plating process. CONSTITUTION:A conductive powder is formed by coating surfaces of base metal such as Ni or Cu with noble metal other than Ag, e.g. Pd, Au, Pt, by means of plating process, etc. A conductive material according to the present invention is formed from this powder, a binder, and some additives. The binder used may be anything if it presents a bond performance fundamentally, for example, glass, resin such as epoxy, phenol, etc. The additives are dispersing agent for the conductive powder, surface treatment agent, etc. This invention provides a low-impedance, low--cost conductive material, being equivalent to Ag and, equipped with high effect of preventing oxidation and migration.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to the improvement of electrically conductive materials. Conventional technology In electronics, electrically conductive materials such as electrodes of devices and electrically conductive adhesives are used everywhere. As a conductive material that fulfills its function even when it is required (
Example E (1) Ag, (2) Base metal (Ni,
(Cu, etc.), (3) Precious metals other than silver (Pd.

Even if conductive powder (Au, Pt, etc.) dispersed in a binder is used, there are still problems to be solved by the invention. Ly (2) In the case of base metals (Ni, Cu, etc.), the resistance value increases sharply due to oxidation of the conductive powder. The construction method and design are such that the parts are not directly exposed to high temperature atmosphere.

With the increasing density of electronic parts and device packaging, the distance between electrodes has become narrower, and due to design considerations, conductive materials are often used in situations where they are directly exposed to the outside air.1. Therefore, (3) noble metals other than silver (Pd).

Au, Pt, etc.) are also used (cost increases).

The present invention: A method for solving the problem of providing a low-cost conductive material that has the effect of preventing migration and oxidation by dispersing a conductive powder different from conventional ones into an inder. Invention 1: Pd on the surface of base metals such as LNi and Cu.

The object is to provide a conductive material using conductive powder whose surface is coated with a noble metal other than silver such as Au or Pt by metallization or the like.4 Function Conductive material according to the present invention 1; iNi, Cu As a conductive powder binder whose surface is coated with a noble metal other than silver such as Pd, Au, or Pt by plating on the surface of a base metal such as Any additives may be used, such as resins such as epoxy and phenol, and glass, as well as other additives such as dispersants, surface treatment agents, etc. that help the dispersibility of the conductive powder. 1; Pd, A to base metals such as t, Ni, Cu
A material whose surface is coated with a noble metal other than silver such as Pt by plating etc. has high migration and oxidation prevention effects, and can be made into a low-cost conductive material equivalent to Ag with low impedance. As an embodiment of the invention, Epicoat 1001 (Yuka Shell) 100! Dicyandiamide 5 doses Amicure P
Mix 2 parts of N23 (Ajinomoto) to create a binder. For 15 parts of this binder, conductive powder was prepared by coating Ni powder with 5% Pd. In the figure, 1 is the base metal Ni, 2 is the noble metal Pd, and 3 is the binder.
As an example for comparison, Ag, Ni, and Au powders were mixed in a ratio of 85 parts to obtain each conductive paste. Comparing the properties of these conductive pastes after curing them at 120°C/lh, we found that the paste made of N1 powder coated with 5% Pd showed better migration and oxidation prevention at lower cost than the conventional Ag and NiAu pastes, as shown in the table below. (Less impedance change) effect (leave below) Table Comparison of characteristics of conductive ink 120℃ 95% 1.7 atm After IHr 60℃
95X 20V gear? '/bu0.2mm 1000H
The base metal used in the present invention may be other materials such as Cu, and the noble metal may also be other than silver such as Au or Pt. The present invention can be widely used as a conductive material for electrically conductive materials such as Ni, C, etc.
By using conductive powder whose surface is coated with a noble metal other than silver such as Pd, Au, or Pt on the surface of a base metal such as U, we can create a conductive material that is low cost and has excellent migration and oxidation prevention. It greatly contributes to the high functionality (L) and cost reduction of electronic components.

[Brief explanation of the drawing]

The figure is a schematic structural diagram of materials of an embodiment of the present invention. ■...Bay money 2...Funds, 3...Binder.

Claims (1)

[Claims] A conductive material characterized by dispersing in a binder a conductive object whose base metal surface is coated with a noble metal other than Pd or Au by plating or the like.