JPH0397254A - Ic lead terminal - Google Patents

Ic lead terminal

Info

Publication number
JPH0397254A
JPH0397254A JP23347089A JP23347089A JPH0397254A JP H0397254 A JPH0397254 A JP H0397254A JP 23347089 A JP23347089 A JP 23347089A JP 23347089 A JP23347089 A JP 23347089A JP H0397254 A JPH0397254 A JP H0397254A
Authority
JP
Japan
Prior art keywords
lead terminals
substrate
groove
horizontal part
sop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23347089A
Other languages
Japanese (ja)
Inventor
Takatoshi Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP23347089A priority Critical patent/JPH0397254A/en
Publication of JPH0397254A publication Critical patent/JPH0397254A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

PURPOSE: To avoid the short circuit with adjacent lead terminals by providing a groove in one part of lead terminal surface to be soldered onto a substrate.
CONSTITUTION: The rear surface of lower side horizontal part 2c in contact with a substrate 3 is soldered onto the substrate 3. A groove 4 opened on the rear surface side of the lower horizontal part 2c is formed along the long direction of the horizontal part 2c. An SOP 1 is provided with multiple lead terminals 2 as shown by only one terminal 2 as an example while it is a matter of course that respective lead terminals 2 are provided with the groove 4. When the SOP 1 is mounted on the substrate 3, the respective lead terminals 2 are fixed to the substrate 3 through the intermediary of solder. At this time, any surplus solder produced in such a process can run into the grooves 4 of the respective lead terminals 2 so as not to run into any other lead terminals 2.
COPYRIGHT: (C)1991,JPO&Japio
JP23347089A 1989-09-09 1989-09-09 Ic lead terminal Pending JPH0397254A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23347089A JPH0397254A (en) 1989-09-09 1989-09-09 Ic lead terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23347089A JPH0397254A (en) 1989-09-09 1989-09-09 Ic lead terminal

Publications (1)

Publication Number Publication Date
JPH0397254A true JPH0397254A (en) 1991-04-23

Family

ID=16955530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23347089A Pending JPH0397254A (en) 1989-09-09 1989-09-09 Ic lead terminal

Country Status (1)

Country Link
JP (1) JPH0397254A (en)

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