JPH039621B2 - - Google Patents
Info
- Publication number
- JPH039621B2 JPH039621B2 JP26044988A JP26044988A JPH039621B2 JP H039621 B2 JPH039621 B2 JP H039621B2 JP 26044988 A JP26044988 A JP 26044988A JP 26044988 A JP26044988 A JP 26044988A JP H039621 B2 JPH039621 B2 JP H039621B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- substrate
- positioning table
- board
- bonding tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 58
- 238000001514 detection method Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 18
- 239000002131 composite material Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75753—Means for optical alignment, e.g. sensors
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26044988A JPH02249242A (ja) | 1988-10-18 | 1988-10-18 | チツプボンデイングの位置合せ方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26044988A JPH02249242A (ja) | 1988-10-18 | 1988-10-18 | チツプボンデイングの位置合せ方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3161981A Division JPS57147245A (en) | 1981-03-05 | 1981-03-05 | Positioning method and device for chip bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02249242A JPH02249242A (ja) | 1990-10-05 |
| JPH039621B2 true JPH039621B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-02-08 |
Family
ID=17348093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26044988A Granted JPH02249242A (ja) | 1988-10-18 | 1988-10-18 | チツプボンデイングの位置合せ方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02249242A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2780000B2 (ja) * | 1993-06-16 | 1998-07-23 | 澁谷工業株式会社 | 半導体位置合せ装置 |
| JP2007173801A (ja) * | 2005-12-22 | 2007-07-05 | Unaxis Internatl Trading Ltd | フリップチップを基板に取り付ける方法 |
-
1988
- 1988-10-18 JP JP26044988A patent/JPH02249242A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02249242A (ja) | 1990-10-05 |