JPH0396050U - - Google Patents
Info
- Publication number
- JPH0396050U JPH0396050U JP494290U JP494290U JPH0396050U JP H0396050 U JPH0396050 U JP H0396050U JP 494290 U JP494290 U JP 494290U JP 494290 U JP494290 U JP 494290U JP H0396050 U JPH0396050 U JP H0396050U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- inner leads
- buffer layer
- layer made
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 3
- 239000011247 coating layer Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990004942U JP2511765Y2 (ja) | 1990-01-23 | 1990-01-23 | リ―ドフレ―ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990004942U JP2511765Y2 (ja) | 1990-01-23 | 1990-01-23 | リ―ドフレ―ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0396050U true JPH0396050U (US07922777-20110412-C00004.png) | 1991-10-01 |
| JP2511765Y2 JP2511765Y2 (ja) | 1996-09-25 |
Family
ID=31508669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990004942U Expired - Fee Related JP2511765Y2 (ja) | 1990-01-23 | 1990-01-23 | リ―ドフレ―ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2511765Y2 (US07922777-20110412-C00004.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55110051A (en) * | 1979-02-15 | 1980-08-25 | Nec Corp | Lead frame and semiconductor device |
| JPS57103342A (en) * | 1981-11-02 | 1982-06-26 | Nec Corp | Semiconductor device |
-
1990
- 1990-01-23 JP JP1990004942U patent/JP2511765Y2/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55110051A (en) * | 1979-02-15 | 1980-08-25 | Nec Corp | Lead frame and semiconductor device |
| JPS57103342A (en) * | 1981-11-02 | 1982-06-26 | Nec Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2511765Y2 (ja) | 1996-09-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |