JPH0396050U - - Google Patents
Info
- Publication number
- JPH0396050U JPH0396050U JP494290U JP494290U JPH0396050U JP H0396050 U JPH0396050 U JP H0396050U JP 494290 U JP494290 U JP 494290U JP 494290 U JP494290 U JP 494290U JP H0396050 U JPH0396050 U JP H0396050U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- inner leads
- buffer layer
- layer made
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 3
- 239000011247 coating layer Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Description
第１図ａおよび第１図ｂは、本考案実施例のリ
ードフレームを示す説明図、第２図は本考案のリ
ードフレームの変形例を示す図、第３図は通常の
ダイレクトボンド方式を示す図、第４図は従来例
のリードフレームを用いた場合のダイレクトボン
ダの平衡度の違いによるミスボンデイングを示す
図である。
１……インナーリード、１ａ……インナーリー
ド先端内薄部、１ｐ……バンプ、２……アウター
リード、３……タイバー、４……銅めつき層、５
……金めつき層。
Figures 1a and 1b are explanatory diagrams showing a lead frame according to an embodiment of the present invention, Figure 2 is a diagram showing a modification of the lead frame of the present invention, and Figure 3 is a diagram showing a normal direct bonding method. 4 are diagrams showing misbonding caused by a difference in the balance of the direct bonder when a conventional lead frame is used. DESCRIPTION OF SYMBOLS 1... Inner lead, 1a... Inner lead tip inner thin part, 1p... Bump, 2... Outer lead, 3... Tie bar, 4... Copper plating layer, 5
...Gold plated layer.
Claims (1)
ドとを具えたダイレクトボンデイング方式のリー
ドフレームにおいて、 前記インナーリードの先端が、軟金属からなる
緩衝層を介して、前記緩衝層よりも膜厚の小さい
金層からなる被覆層で覆われていることを特徴と
するリードフレーム。[Claims for Utility Model Registration] In a direct bonding lead frame comprising a plurality of inner leads and an outer lead extending from the inner leads, the tips of the inner leads are bonded to each other through a buffer layer made of soft metal. . A lead frame, characterized in that the lead frame is covered with a coating layer made of a gold layer having a thickness smaller than that of the buffer layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990004942U JP2511765Y2 (en) | 1990-01-23 | 1990-01-23 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990004942U JP2511765Y2 (en) | 1990-01-23 | 1990-01-23 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0396050U true JPH0396050U (en) | 1991-10-01 |
| JP2511765Y2 JP2511765Y2 (en) | 1996-09-25 |
Family
ID=31508669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990004942U Expired - Fee Related JP2511765Y2 (en) | 1990-01-23 | 1990-01-23 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2511765Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55110051A (en) * | 1979-02-15 | 1980-08-25 | Nec Corp | Lead frame and semiconductor device |
| JPS57103342A (en) * | 1981-11-02 | 1982-06-26 | Nec Corp | Semiconductor device |
-
1990
- 1990-01-23 JP JP1990004942U patent/JP2511765Y2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55110051A (en) * | 1979-02-15 | 1980-08-25 | Nec Corp | Lead frame and semiconductor device |
| JPS57103342A (en) * | 1981-11-02 | 1982-06-26 | Nec Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2511765Y2 (en) | 1996-09-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |