JPH0395663U - - Google Patents

Info

Publication number
JPH0395663U
JPH0395663U JP95390U JP95390U JPH0395663U JP H0395663 U JPH0395663 U JP H0395663U JP 95390 U JP95390 U JP 95390U JP 95390 U JP95390 U JP 95390U JP H0395663 U JPH0395663 U JP H0395663U
Authority
JP
Japan
Prior art keywords
ceramic substrate
ceramic
terminal portion
core material
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP95390U
Other languages
English (en)
Other versions
JP2512712Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990000953U priority Critical patent/JP2512712Y2/ja
Publication of JPH0395663U publication Critical patent/JPH0395663U/ja
Application granted granted Critical
Publication of JP2512712Y2 publication Critical patent/JP2512712Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は、この考案の実施例であるセラミツク
パツケージの部分断面斜視図、第２図はそのピン
接合部における要部拡大断面図である。 １……セラミツクＩＣパツケージ基板、２……
セラミツク基板、３……内部配線用メタライズ、
４……スルーホールメタライズ、５……孔部、６
……引出し端子用のピン、７……芯材、８……被
膜層、９……銀ロウ材。

Claims (1)

    【実用新案登録請求の範囲】
  1. Ｃｕ系金属よりなる芯材の外表面にＰｔ，Ｐｄ
    ，Ｒｈ，Ｎｉ及びＣｏのうち、いずれか１種の金
    属又は２種以上の合金からなる被膜層を形成して
    なる外部リードをセラミツク基板上の端子部にロ
    ウ付け接合し、更に少なくともその接合部表面に
    メツキによる保護層を形成してなるセラミツクＩ
    Ｃパツケージ基板。
JP1990000953U 1990-01-11 1990-01-11 Ｉｃパッケ―ジ基板 Expired - Fee Related JP2512712Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990000953U JP2512712Y2 (ja) 1990-01-11 1990-01-11 Ｉｃパッケ―ジ基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990000953U JP2512712Y2 (ja) 1990-01-11 1990-01-11 Ｉｃパッケ―ジ基板

Publications (2)

Publication Number Publication Date
JPH0395663U true JPH0395663U (ja) 1991-09-30
JP2512712Y2 JP2512712Y2 (ja) 1996-10-02

Family

ID=31504888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990000953U Expired - Fee Related JP2512712Y2 (ja) 1990-01-11 1990-01-11 Ｉｃパッケ―ジ基板

Country Status (1)

Country Link
JP (1) JP2512712Y2 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9414486B2 (en) * 2013-07-29 2016-08-09 Kyocera Corporation Wiring board, wiring board with lead, and electronic device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6354760A (ja) * 1986-08-25 1988-03-09 Kobe Steel Ltd ピン・グリツド・アレイ用ピンの製造方法
JPS63261868A (ja) * 1987-04-20 1988-10-28 Kobe Steel Ltd ピングリツド・アレイ用クラツド線材
JPH01214150A (ja) * 1988-02-23 1989-08-28 Shinko Electric Ind Co Ltd セラミックパッケージの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6354760A (ja) * 1986-08-25 1988-03-09 Kobe Steel Ltd ピン・グリツド・アレイ用ピンの製造方法
JPS63261868A (ja) * 1987-04-20 1988-10-28 Kobe Steel Ltd ピングリツド・アレイ用クラツド線材
JPH01214150A (ja) * 1988-02-23 1989-08-28 Shinko Electric Ind Co Ltd セラミックパッケージの製造方法

Also Published As

Publication number Publication date
JP2512712Y2 (ja) 1996-10-02

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees