JPH0388370U - - Google Patents
Info
- Publication number
- JPH0388370U JPH0388370U JP14952389U JP14952389U JPH0388370U JP H0388370 U JPH0388370 U JP H0388370U JP 14952389 U JP14952389 U JP 14952389U JP 14952389 U JP14952389 U JP 14952389U JP H0388370 U JPH0388370 U JP H0388370U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- hole
- insulating substrate
- conductive patterns
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の実施例に係るハイブリツドＩ
Ｃの要部断面図、第２図はその要部の一方の面を
示す平面図、第３図はその要部の他方の面を示す
背面図、第４図は本考案の他の実施例に係るハイ
ブリツドＩＣの要部断面図、第５図はその要部の
一方の面を示す平面図である。第６図は従来例に
係るハイブリツドＩＣの要部断面図である。
１……絶縁基板、２，３……第１の導電パター
ン、４，５……第２の導電パターン、６……貫通
孔、７……第１の導体層、８……絶縁体層、９…
…第２の導体層。
Figure 1 shows a hybrid I according to an embodiment of the present invention.
FIG. 2 is a plan view showing one side of the main part, FIG. 3 is a rear view showing the other side of the main part, and FIG. 4 is another embodiment of the present invention. FIG. 5 is a sectional view of a main part of the hybrid IC according to the present invention, and FIG. 5 is a plan view showing one side of the main part. FIG. 6 is a sectional view of a main part of a conventional hybrid IC. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2, 3... First conductive pattern, 4, 5... Second conductive pattern, 6... Through hole, 7... First conductor layer, 8... Insulator layer, 9...
...Second conductor layer.
Claims (1)
の導体層７、絶縁体層８、第２の導体層９、およ
び、第２の導電パターン４，５を有しており、 絶縁基板１は、貫通孔６を有しており、 第１の導電パターン２，３は、絶縁基板１の両
面のそれぞれに形成されており、 第１の導体層７は貫通孔６の内周面に形成され
ており、 絶縁体層８は、第１の導体層７の上、および、
少なくとも前記貫通孔６周辺にある第１の導電パ
ターン２，３の上に形成されており、 第２の導体層９は、絶縁体層８の上に形成され
ており、 第１の導電パターン２，３は、それぞれ、第１
の導体層７を介して互いに接続されており、 第２の導電パターン４，５は、それぞれ、少な
くとも絶縁基板１の両面側における貫通孔６周辺
の絶縁体層８の上に形成されており、かつ、第２
の導体層９を介して互いに接続されている ことを特徴とするハイブリツドＩＣ。[Claims for Utility Model Registration] Insulating substrate 1, first conductive patterns 2, 3, first
The insulating substrate 1 has a through hole 6, and the insulating substrate 1 has a through hole 6. The conductive patterns 2 and 3 are formed on both surfaces of the insulating substrate 1, the first conductor layer 7 is formed on the inner peripheral surface of the through hole 6, and the insulator layer 8 is formed on the inner circumferential surface of the through hole 6. on layer 7, and
The second conductive layer 9 is formed on at least the first conductive patterns 2 and 3 around the through hole 6, and the second conductive layer 9 is formed on the insulating layer 8. , 3 are the first
are connected to each other via a conductor layer 7, and the second conductive patterns 4 and 5 are each formed on the insulator layer 8 around the through hole 6 on at least both surfaces of the insulating substrate 1, And the second
A hybrid IC characterized in that two ICs are connected to each other via a conductor layer 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14952389U JPH0388370U (en) | 1989-12-25 | 1989-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14952389U JPH0388370U (en) | 1989-12-25 | 1989-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0388370U true JPH0388370U (en) | 1991-09-10 |
Family
ID=31695910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14952389U Pending JPH0388370U (en) | 1989-12-25 | 1989-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0388370U (en) |
-
1989
- 1989-12-25 JP JP14952389U patent/JPH0388370U/ja active Pending