JPH038587B2 - - Google Patents

Info

Publication number
JPH038587B2
JPH038587B2 JP59105889A JP10588984A JPH038587B2 JP H038587 B2 JPH038587 B2 JP H038587B2 JP 59105889 A JP59105889 A JP 59105889A JP 10588984 A JP10588984 A JP 10588984A JP H038587 B2 JPH038587 B2 JP H038587B2
Authority
JP
Japan
Prior art keywords
circuit board
circuit
cooling
semiconductor element
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59105889A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60249351A (ja
Inventor
Kishio Yokochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10588984A priority Critical patent/JPS60249351A/ja
Publication of JPS60249351A publication Critical patent/JPS60249351A/ja
Publication of JPH038587B2 publication Critical patent/JPH038587B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP10588984A 1984-05-24 1984-05-24 沸騰冷却型回路基板と冷媒液中での配置構造 Granted JPS60249351A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10588984A JPS60249351A (ja) 1984-05-24 1984-05-24 沸騰冷却型回路基板と冷媒液中での配置構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10588984A JPS60249351A (ja) 1984-05-24 1984-05-24 沸騰冷却型回路基板と冷媒液中での配置構造

Publications (2)

Publication Number Publication Date
JPS60249351A JPS60249351A (ja) 1985-12-10
JPH038587B2 true JPH038587B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-02-06

Family

ID=14419483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10588984A Granted JPS60249351A (ja) 1984-05-24 1984-05-24 沸騰冷却型回路基板と冷媒液中での配置構造

Country Status (1)

Country Link
JP (1) JPS60249351A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7011221B2 (ja) * 2018-03-28 2022-01-26 日本電気株式会社 実装基板、電子機器及び素子冷却方法
JP7419994B2 (ja) * 2020-07-03 2024-01-23 株式会社オートネットワーク技術研究所 電気機器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51141462U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1975-05-07 1976-11-15
JPS52114271A (en) * 1976-03-22 1977-09-24 Hitachi Ltd Semiconductor pellet mounting structure for substrate
JPS5887836A (ja) * 1981-11-20 1983-05-25 Hitachi Ltd 基板およびそれを用いたペレツトボンデイング方法

Also Published As

Publication number Publication date
JPS60249351A (ja) 1985-12-10

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