JPH038586B2 - - Google Patents

Info

Publication number
JPH038586B2
JPH038586B2 JP59023254A JP2325484A JPH038586B2 JP H038586 B2 JPH038586 B2 JP H038586B2 JP 59023254 A JP59023254 A JP 59023254A JP 2325484 A JP2325484 A JP 2325484A JP H038586 B2 JPH038586 B2 JP H038586B2
Authority
JP
Japan
Prior art keywords
lead terminal
copper wire
bonding
capillary chip
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59023254A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60167340A (ja
Inventor
Saneyasu Hirota
Kyotaka Okinari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59023254A priority Critical patent/JPS60167340A/ja
Publication of JPS60167340A publication Critical patent/JPS60167340A/ja
Publication of JPH038586B2 publication Critical patent/JPH038586B2/ja
Granted legal-status Critical Current

Links

Classifications

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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP59023254A 1984-02-09 1984-02-09 ステツチボンデイング部の接合状態の検査方法 Granted JPS60167340A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59023254A JPS60167340A (ja) 1984-02-09 1984-02-09 ステツチボンデイング部の接合状態の検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59023254A JPS60167340A (ja) 1984-02-09 1984-02-09 ステツチボンデイング部の接合状態の検査方法

Publications (2)

Publication Number Publication Date
JPS60167340A JPS60167340A (ja) 1985-08-30
JPH038586B2 true JPH038586B2 (enrdf_load_stackoverflow) 1991-02-06

Family

ID=12105458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59023254A Granted JPS60167340A (ja) 1984-02-09 1984-02-09 ステツチボンデイング部の接合状態の検査方法

Country Status (1)

Country Link
JP (1) JPS60167340A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3009564B2 (ja) * 1993-07-16 2000-02-14 株式会社カイジョー ワイヤボンディング装置及びその方法
CN100336191C (zh) * 2005-03-04 2007-09-05 汕头华汕电子器件有限公司 用铜线形成半导体器件内引线的方法

Also Published As

Publication number Publication date
JPS60167340A (ja) 1985-08-30

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