JPH0385662U - - Google Patents
Info
- Publication number
- JPH0385662U JPH0385662U JP14686689U JP14686689U JPH0385662U JP H0385662 U JPH0385662 U JP H0385662U JP 14686689 U JP14686689 U JP 14686689U JP 14686689 U JP14686689 U JP 14686689U JP H0385662 U JPH0385662 U JP H0385662U
- Authority
- JP
- Japan
- Prior art keywords
- photo sensor
- sensor chip
- convex portion
- concave portion
- portion formed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Description
第１図は本考案に係るフオトセンサの一実施例
を示す構成断面図、第２図は第１図装置の製造工
程を示すための平面図、第３図は第１図装置の製
造工程を示すための構成断面図、第４図は従来の
フオトセンサを示す構成ブロツク図である。
１……フオトセンサチツプ、２……構造物、１
２……凹部、１３……受光部、２２……凸部。
Fig. 1 is a cross-sectional view of the configuration of an embodiment of the photo sensor according to the present invention, Fig. 2 is a plan view showing the manufacturing process of the device shown in Fig. 1, and Fig. 3 is a diagram showing the manufacturing process of the device shown in Fig. 1. FIG. 4 is a block diagram showing a conventional photo sensor. 1...Photo sensor chip, 2...Structure, 1
2... Concave portion, 13... Light receiving portion, 22... Convex portion.
Claims (1)
凹部を形成したフオトセンサチツプと、凸部を形
成した構造物とを備え、凹部を凸部にはめ込むこ
とによりフオトセンサチツプの位置決めを行うよ
うに構成したことを特徴とするフオトセンサ。 The photo sensor chip has a concave portion formed on the surface opposite to the light receiving surface by anisotropic etching, and a structure having a convex portion formed thereon, and the photo sensor chip is positioned by fitting the concave portion into the convex portion. A photo sensor characterized by the following configuration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14686689U JPH0385662U (en) | 1989-12-20 | 1989-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14686689U JPH0385662U (en) | 1989-12-20 | 1989-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385662U true JPH0385662U (en) | 1991-08-29 |
Family
ID=31693408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14686689U Pending JPH0385662U (en) | 1989-12-20 | 1989-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385662U (en) |
-
1989
- 1989-12-20 JP JP14686689U patent/JPH0385662U/ja active Pending