JPH0385163U - - Google Patents
Info
- Publication number
- JPH0385163U JPH0385163U JP14830389U JP14830389U JPH0385163U JP H0385163 U JPH0385163 U JP H0385163U JP 14830389 U JP14830389 U JP 14830389U JP 14830389 U JP14830389 U JP 14830389U JP H0385163 U JPH0385163 U JP H0385163U
- Authority
- JP
- Japan
- Prior art keywords
- hinge
- rim
- attached
- carrier frame
- automatic soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims 3
- 238000007790 scraping Methods 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Molten Solder (AREA)
Description
第１図は本考案の一実施例の要部工程説明図、
第２図は第１図のＡ−Ａ断面図、第３図は要部斜
視図、第４図は従来より一般に使用されている従
来例の構成説明図である。
１……駆動チエーン、２……キヤリアフレーム
、３……フラクサー、４……プリヒーター、５…
…デイプ槽、６……キヤリアフレーム受け箱、７
……キヤリアフレーム返却シユーター、１１……
クリーニングキヤリアフレーム、１２……第１の
クリーニングユニツト、１２１……第１のリム、
１２２……第１のヒンジ、１２３……第１のウイ
ング、１３……第２のクリーニングユニツト、１
３１……第２のリム、１３２……第２のヒンジ、
１３３……第２のウイング。
FIG. 1 is an explanatory diagram of the main steps of an embodiment of the present invention.
FIG. 2 is a sectional view taken along the line A-A in FIG. 1, FIG. 3 is a perspective view of a main part, and FIG. 4 is an explanatory diagram of the configuration of a conventional example that has been commonly used. 1... Drive chain, 2... Carrier frame, 3... Fluxer, 4... Preheater, 5...
...Dip tank, 6...Carrier frame receiving box, 7
...Carrier frame return shooter, 11...
cleaning carrier frame, 12... first cleaning unit, 121... first rim,
122...first hinge, 123...first wing, 13...second cleaning unit, 1
31... second rim, 132... second hinge,
133...Second wing.
Claims (1)
ツプ槽を通過させて自動半田付けを行う自動はん
だ付け装置において、 前記キヤリアフレームの進行方向に一定の傾斜
角度をなして取付けられた第１のリムと、 該リムに一端が取付けられた第１のヒンジと 該第１のヒンジの他端に取付けられ前記デイツ
プ槽のはんだの酸化物を掻寄せ除去するウイング
とからなる第１のクリーニングユニツトと、 前記第１のリムと対称な傾斜角度をなしキヤリ
アフレームの進行方向に一定の傾斜角度をなして
取付けられた第２のリムと 該リムに一端が取付けられた第２のヒンジと 該第２のヒンジの他端に取付けられ前記デイツ
プ槽のはんだの酸化物を前記第２のクリーニング
ユニツトとは反対方向に掻寄せ除去するウイング
とからなる第２のクリーニングユニツトと を備えるクリーニングキヤリアフレーム を具備したことを特徴とする自動はんだ付け装置
。[Claim for Utility Model Registration] In an automatic soldering device that carries out automatic soldering by mounting a printed board on a carrier frame and passing it through a dip tank, the device is installed at a constant angle of inclination in the direction of travel of the carrier frame. a first hinge having one end attached to the rim; and a wing attached to the other end of the first hinge for scraping and removing solder oxide in the dip bath. a second rim attached at a symmetrical inclination angle to the first rim and at a constant inclination angle in the traveling direction of the carrier frame; and a second hinge having one end attached to the rim. and a second cleaning unit comprising a wing attached to the other end of the second hinge for scraping and removing solder oxide in the dip tank in a direction opposite to that of the second cleaning unit. An automatic soldering device characterized by being equipped with a frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14830389U JPH0385163U (en) | 1989-12-22 | 1989-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14830389U JPH0385163U (en) | 1989-12-22 | 1989-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385163U true JPH0385163U (en) | 1991-08-28 |
Family
ID=31694761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14830389U Pending JPH0385163U (en) | 1989-12-22 | 1989-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385163U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009248165A (en) * | 2008-04-09 | 2009-10-29 | Mitsubishi Electric Corp | Mask for flow soldering, and flow soldering method |
-
1989
- 1989-12-22 JP JP14830389U patent/JPH0385163U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009248165A (en) * | 2008-04-09 | 2009-10-29 | Mitsubishi Electric Corp | Mask for flow soldering, and flow soldering method |
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