JPH0381654U - - Google Patents

Info

Publication number
JPH0381654U
JPH0381654U JP14354889U JP14354889U JPH0381654U JP H0381654 U JPH0381654 U JP H0381654U JP 14354889 U JP14354889 U JP 14354889U JP 14354889 U JP14354889 U JP 14354889U JP H0381654 U JPH0381654 U JP H0381654U
Authority
JP
Japan
Prior art keywords
light
substrate
display device
wiring
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14354889U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14354889U priority Critical patent/JPH0381654U/ja
Publication of JPH0381654U publication Critical patent/JPH0381654U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
JP14354889U 1989-12-12 1989-12-12 Pending JPH0381654U (US06277897-20010821-C00009.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14354889U JPH0381654U (US06277897-20010821-C00009.png) 1989-12-12 1989-12-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14354889U JPH0381654U (US06277897-20010821-C00009.png) 1989-12-12 1989-12-12

Publications (1)

Publication Number Publication Date
JPH0381654U true JPH0381654U (US06277897-20010821-C00009.png) 1991-08-21

Family

ID=31690316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14354889U Pending JPH0381654U (US06277897-20010821-C00009.png) 1989-12-12 1989-12-12

Country Status (1)

Country Link
JP (1) JPH0381654U (US06277897-20010821-C00009.png)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11185517A (ja) * 1997-12-24 1999-07-09 Kyocera Corp ２層構造の反射形ｌｅｄ照明装置
JP2003081197A (ja) * 2001-09-13 2003-03-19 Ishikawajima Harima Heavy Ind Co Ltd 植物観賞システム及び方法
JP2008161484A (ja) * 2006-12-28 2008-07-17 Sansei R & D:Kk 遊技機
JP2009010204A (ja) * 2007-06-28 2009-01-15 Nichia Corp 発光装置
WO2014087564A1 (ja) * 2012-12-06 2014-06-12 株式会社デンソー 表示装置
WO2015015719A1 (ja) * 2013-07-30 2015-02-05 株式会社デンソー 表示装置
JP2021503184A (ja) * 2018-08-24 2021-02-04 ケーティー・アンド・ジー・コーポレーション 発光素子及びそれを含むエアロゾル生成装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5613281B2 (US06277897-20010821-C00009.png) * 1973-10-25 1981-03-27
JPS59151185A (ja) * 1983-02-17 1984-08-29 株式会社東芝 デイスプレイ装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5613281B2 (US06277897-20010821-C00009.png) * 1973-10-25 1981-03-27
JPS59151185A (ja) * 1983-02-17 1984-08-29 株式会社東芝 デイスプレイ装置の製造方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11185517A (ja) * 1997-12-24 1999-07-09 Kyocera Corp ２層構造の反射形ｌｅｄ照明装置
JP2003081197A (ja) * 2001-09-13 2003-03-19 Ishikawajima Harima Heavy Ind Co Ltd 植物観賞システム及び方法
JP2008161484A (ja) * 2006-12-28 2008-07-17 Sansei R & D:Kk 遊技機
JP2009010204A (ja) * 2007-06-28 2009-01-15 Nichia Corp 発光装置
CN104854648A (zh) * 2012-12-06 2015-08-19 株式会社电装 显示装置
WO2014087564A1 (ja) * 2012-12-06 2014-06-12 株式会社デンソー 表示装置
JP2014115345A (ja) * 2012-12-06 2014-06-26 Denso Corp 表示装置
WO2015015719A1 (ja) * 2013-07-30 2015-02-05 株式会社デンソー 表示装置
JP2015028435A (ja) * 2013-07-30 2015-02-12 株式会社デンソー 表示装置
CN105308419A (zh) * 2013-07-30 2016-02-03 株式会社电装 显示装置
US9776561B2 (en) 2013-07-30 2017-10-03 Denso Corporation Display apparatus
DE112014003496B4 (de) 2013-07-30 2021-08-19 Denso Corporation Anzeigevorrichtung
JP2021503184A (ja) * 2018-08-24 2021-02-04 ケーティー・アンド・ジー・コーポレーション 発光素子及びそれを含むエアロゾル生成装置

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