JPH0381126A - 集積回路素子ケーシングの射出成形装置 - Google Patents

集積回路素子ケーシングの射出成形装置

Info

Publication number
JPH0381126A
JPH0381126A JP18835890A JP18835890A JPH0381126A JP H0381126 A JPH0381126 A JP H0381126A JP 18835890 A JP18835890 A JP 18835890A JP 18835890 A JP18835890 A JP 18835890A JP H0381126 A JPH0381126 A JP H0381126A
Authority
JP
Japan
Prior art keywords
mold
lead frame
casing
cavity
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18835890A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0525655B2 (forum.php
Inventor
Mitsuhiro Obara
小原　光博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP18835890A priority Critical patent/JPH0381126A/ja
Publication of JPH0381126A publication Critical patent/JPH0381126A/ja
Publication of JPH0525655B2 publication Critical patent/JPH0525655B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP18835890A 1990-07-17 1990-07-17 集積回路素子ケーシングの射出成形装置 Granted JPH0381126A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18835890A JPH0381126A (ja) 1990-07-17 1990-07-17 集積回路素子ケーシングの射出成形装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18835890A JPH0381126A (ja) 1990-07-17 1990-07-17 集積回路素子ケーシングの射出成形装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP23172885A Division JPS6290213A (ja) 1985-10-17 1985-10-17 集積回路素子ケ−シングの射出成形による成形方法

Publications (2)

Publication Number Publication Date
JPH0381126A true JPH0381126A (ja) 1991-04-05
JPH0525655B2 JPH0525655B2 (forum.php) 1993-04-13

Family

ID=16222227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18835890A Granted JPH0381126A (ja) 1990-07-17 1990-07-17 集積回路素子ケーシングの射出成形装置

Country Status (1)

Country Link
JP (1) JPH0381126A (forum.php)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0688650A4 (en) * 1994-01-13 1997-06-11 Citizen Watch Co Ltd RESIN WELDING PROCESS OF SEMICONDUCTOR DEVICES
EP0783949A4 (en) * 1994-09-28 1998-07-08 Meiho Co Ltd INJECTION MOLDING DEVICE
WO2007147470A1 (de) * 2006-06-21 2007-12-27 Hansatronic Gmbh Verfahren zu herstellung eines spritzgussteils mit integrierter flexibler leiterplatte
WO2010099999A1 (de) * 2009-03-06 2010-09-10 Robert Bosch Gmbh Verfahren zum einbetten einer elektrischen baugruppe

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0688650A4 (en) * 1994-01-13 1997-06-11 Citizen Watch Co Ltd RESIN WELDING PROCESS OF SEMICONDUCTOR DEVICES
EP0783949A4 (en) * 1994-09-28 1998-07-08 Meiho Co Ltd INJECTION MOLDING DEVICE
WO2007147470A1 (de) * 2006-06-21 2007-12-27 Hansatronic Gmbh Verfahren zu herstellung eines spritzgussteils mit integrierter flexibler leiterplatte
WO2010099999A1 (de) * 2009-03-06 2010-09-10 Robert Bosch Gmbh Verfahren zum einbetten einer elektrischen baugruppe

Also Published As

Publication number Publication date
JPH0525655B2 (forum.php) 1993-04-13

Similar Documents

Publication Publication Date Title
US5038468A (en) Method of insert molding with web placed in the mold
EP2014450A3 (en) Injection compression molding method
JP2000153538A (ja) ３つ以上の半成形品からなる成形品の成形方法および成形用金型
JPH0751321B2 (ja) 微小部品の組立成形方法
JPH0381126A (ja) 集積回路素子ケーシングの射出成形装置
JP2002321247A (ja) メモリーカードの製造方法
JPS6290213A (ja) 集積回路素子ケ−シングの射出成形による成形方法
JP3665596B2 (ja) メモリーカードの製造方法
JP3398623B2 (ja) 電子部品の成形方法
JPH0353502Y2 (forum.php)
JP3350581B2 (ja) 金型内振動加工方法及び装置
JPH0356050Y2 (forum.php)
JP2976264B2 (ja) 三層構造成形品の射出成形方法およびその金型
JP3247005B2 (ja) 射出成形金型
JP3999438B2 (ja) 中空パッケージ型電子部品の製造方法並びにその成形金型及び製造装置
JPH08142145A (ja) 射出成形用金型及びそれを用いた射出圧縮成形法
JP2745261B2 (ja) 成形方法
JPH1110684A (ja) 射出成形用金型
JP2001024016A (ja) 半導体パッケージのための樹脂封止装置
JPH08142135A (ja) 射出成形用金型
JP2004322379A (ja) 薄肉成形品の製造方法、薄肉成形品及び成形金型
JPH04325221A (ja) 射出圧縮成形用金型
JP2002210787A (ja) 射出成形金型
JP4548966B2 (ja) 電子部品の樹脂封止装置
JPH1199540A (ja) 射出成形用金型