JPH038110B2 - - Google Patents

Info

Publication number
JPH038110B2
JPH038110B2 JP60155261A JP15526185A JPH038110B2 JP H038110 B2 JPH038110 B2 JP H038110B2 JP 60155261 A JP60155261 A JP 60155261A JP 15526185 A JP15526185 A JP 15526185A JP H038110 B2 JPH038110 B2 JP H038110B2
Authority
JP
Japan
Prior art keywords
integrated circuit
card
circuit chips
circuit chip
wiring module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60155261A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6216535A (ja
Inventor
Hideo Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP15526185A priority Critical patent/JPS6216535A/ja
Publication of JPS6216535A publication Critical patent/JPS6216535A/ja
Publication of JPH038110B2 publication Critical patent/JPH038110B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP15526185A 1985-07-16 1985-07-16 電子装置 Granted JPS6216535A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15526185A JPS6216535A (ja) 1985-07-16 1985-07-16 電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15526185A JPS6216535A (ja) 1985-07-16 1985-07-16 電子装置

Publications (2)

Publication Number Publication Date
JPS6216535A JPS6216535A (ja) 1987-01-24
JPH038110B2 true JPH038110B2 (cs) 1991-02-05

Family

ID=15602047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15526185A Granted JPS6216535A (ja) 1985-07-16 1985-07-16 電子装置

Country Status (1)

Country Link
JP (1) JPS6216535A (cs)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0715969B2 (ja) * 1991-09-30 1995-02-22 インターナショナル・ビジネス・マシーンズ・コーポレイション マルチチツプ集積回路パツケージ及びそのシステム
US5362986A (en) * 1993-08-19 1994-11-08 International Business Machines Corporation Vertical chip mount memory package with packaging substrate and memory chip pairs
US5502667A (en) * 1993-09-13 1996-03-26 International Business Machines Corporation Integrated multichip memory module structure
US5561622A (en) * 1993-09-13 1996-10-01 International Business Machines Corporation Integrated memory cube structure
US6573460B2 (en) 2001-09-20 2003-06-03 Dpac Technologies Corp Post in ring interconnect using for 3-D stacking
US6573461B2 (en) 2001-09-20 2003-06-03 Dpac Technologies Corp Retaining ring interconnect used for 3-D stacking
US6856010B2 (en) 2002-12-05 2005-02-15 Staktek Group L.P. Thin scale outline package
US8703543B2 (en) 2009-07-14 2014-04-22 Honeywell International Inc. Vertical sensor assembly method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5625256Y2 (cs) * 1977-07-20 1981-06-15
JPS5684385U (cs) * 1979-11-30 1981-07-07

Also Published As

Publication number Publication date
JPS6216535A (ja) 1987-01-24

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term