JPH0377028B2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention is applicable to, for example, a flat package type LSI.
This invention relates to an electrical component lead pin soldering device for soldering lead pins of electrical components.

[Background technology and its problems]

A flat package type LSI has a plurality of lead pins protruding from two or four sides of the flat package, and these lead pins are usually soldered to connected parts of a printed circuit board. By the way, conventionally, this soldering method is carried out manually using a soldering iron, or soldering is carried out by simultaneously pressing the lead pins on each of the two or four sides using a square frame-shaped heating plate. There is.

However, in the former method of manual soldering, the positioning process takes a very long time, resulting in poor workability. In addition, there were cases in which lead pins were lifted onto the solder, bridging, and poor strength occurred.

Further, in the latter type of heating plate, since the heating plate is constantly heated, the flux is stuck to the heating plate, and it is inefficient to remove the flux from time to time. Furthermore, since the heating plate is in the shape of a square frame, it is difficult to take measures to securely hold the package in advance, and when the heating plate is pressed against the lead pins, there is a drawback that it tends to shift from the connected portion. Furthermore, since all the lead pins are pressed down at the same time by the integrally formed frame-shaped heating plate, it is impossible to press them down evenly all over, and as a result of the uneven pressing force, the lead pins may float on the solder. The reliability was poor due to the occurrence of cracks, bridging, and weak connection strength in some parts.

[Purpose of the invention]

The present invention has been made focusing on the above circumstances,
The purpose is to provide an apparatus for soldering lead pins of electrical components that can efficiently and reliably connect lead pins of electrical components and improve reliability.

[Summary of the invention]

The present invention provides a lead pin soldering apparatus for an electrical component that solders lead pins protruding from at least two sides of an electrical component to a connected part. a plurality of heater chips for heating the lead pins on the sides by pressing them against the connected portion; a moving operation holder device supporting the tip end surfaces of the respective heater chips so that they can be independently suspended at least when pressed against the connected portion; a feeding device for horizontally moving and positioning the tip end surface of each of the plurality of heater chips with respect to the corresponding lead pin on each side so as to face a predetermined position of the corresponding lead pin on each side; electrically connected to the heater chip, and connected so that when each of the plurality of heater chips is pressed against the corresponding lead pin on each side, the pressed heater chip is energized and the temperature can be adjusted for each of the plurality of energized heater chips; An object of the present invention is to provide an apparatus for soldering lead pins of electrical components, which is characterized by having a energizing circuit.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described based on the drawings.

In the figure, reference numerals 1 and 1 are chip stands to which two heater chips 2 and 2 are individually attached, respectively, and these chip stands 1 and 1 are incorporated into a holder device 3. Each of the chip stands 1, 1 is composed of a pair of left and right heat sinks 4, 5, which are fastened together with screws 7 with an electrical insulating material 6 interposed therebetween. Each of the heat sinks 4 and 5 is made of a metal material as a conductor. Furthermore, each heat sink 4, 5
Conductive support arms 8 and 9 are respectively protruded from the lower ends of the support arms 8 and 9, and a plate-shaped heater chip 2 is installed between the support arms 8 and 9. This heater chip 2 is made of tungsten (W), molybdenum (Mo), or stainless steel (SUS), and is designed to generate heat by being energized by an energizing circuit to be described later. Also,
The respective heater chips 2, 2 are supported in a parallel state with their plate surfaces facing each other. Further, each of the chip stands 1, 1 is supported by a rail stand 12 of the holder device 3, and guided and moved in the same horizontal direction. That is, it is moved forward and backward by a feed screw (feed device) 13 provided on the rail base 12 side, and is fixed at its adjusted position by a set screw 14. By adjusting the movement of the chip stands 1, 1 in this manner, the gap and position of the opposing heater chips 2, 2 can be selected.

Further, support arms 15, 15 are provided on each of the rail stands 12, 12, respectively, and each of the support arms 15, 15 penetrates the frame 16 of the holder device 3 and projects upward. Each support arm 15, 15 is guided only in the vertical direction without rotating by a bearing (not shown) formed within the frame 16. Support rods 17, 17 are attached and fixed to the frame 16, and a seesaw plate 18 is pivotally supported at the upper ends of the support rods 17, 17. Engagement grooves 19, 19 are formed at both ends of the seesaw plate 18, and rollers 21, 21 provided at the tips of the support arms 15, 15 are fitted into these engagement grooves 19, 19, respectively. It is deeply engaged. Thus, the support arms 15, 15 are alternately raised and lowered in opposite directions via the seesaw plate 18. In addition,
22 in FIG. 2 are plates for stabilizing the support arms 15, 15.

Moving operation holder device 3 configured in this way
is adapted to be driven up and down by a lift drive device (not shown) via a connecting rod 23 protruding from the frame 16.

On the other hand, each of the heater chips 2, 2 is supplied with power from a power source 24, 24 shown in FIG. In other words, each heat sink 4,5
Also, the heater chips 2, 2 can be energized through the support arms 8, 9. Further, this energizing operation is performed by the control section 26 when the front end surfaces of the heater chips 2, 2 press against the lead pins 28, 29, . . . of the flat package type LSI 27, as will be described later.

Further, the temperatures of the heater chips 11, 11 are detected by thermocouples 31, 31 as temperature detection sensors, respectively, and this signal is sent to the control section 26, which controls the strength of the current sent to each heater chip 2, 2. It's summery.

By the way, as shown in FIG. 1, the flat package type LSI 27 as an electrical component to be soldered has a large number of lead pins 28..., 29..., 34 on each of the four sides of its rectangular package 33.
..., 35... are provided protrudingly, and each lead pin 2
8..., 29..., 34..., 35... are designed to be soldered to electrode pads (not shown) as connected parts of the circuit board 36. Note that the lead pins 28..., 29..., 34..., 35... and the electrode butts are plated with Pb-Sn in advance.

Next, a soldering method using the lead pin soldering apparatus described above will be explained.

First, by moving the heat sinks 4 and 5 using the feed screw 13 and adjusting the distance and each position between the pair of heater chips 2 and 2, the lead pins 28 on opposite sides of the flat package type LSI 27 can be moved.
..., 29..., respectively. Then, the holder device 3 is lowered by operating the lifting drive device, and the lead pins 28 of the flat package type LSI 27, which have been previously installed on the circuit board 36, are lowered.
. . , 29 . . . and 29 . . . . Even if deviation occurs at this time, since each heater chip 2, 2 is supported in an independent suspension manner by the action of the seesaw plate 18 as described above, each heater chip 2, 2 is pressed against the lead pins 28..., 29... with a uniform load. Pressurize at ~5Kg. At the same time, the heater chips 2, 2 are energized and heated,
The temperature is detected by a thermocouple 31, and this is fed back to the control section 26, and the necessary current is supplied from the power supply 24 to heat at a predetermined temperature. Further, each temperature control is performed for each heater chip 2, 2.

Soldering is performed while pressing and heating in this manner.

Further, the remaining lead pins 34 and 35 of the flat package type LSI 27 are also rotated after the holder device 3 is evacuated or moved to another holder device 3.
Solder in the same way using

In addition, in the above embodiment, two heater chips 2,
2, when installing the flat package LSI 27 at a predetermined position on the circuit board 36, the gaps between the heater chips 2 and their support members can be used, for example, with a vacuum hand (not shown) for carrying in and installing the flat package LSI 27. ) can be used to hold it down during soldering work, preventing misalignment as much as possible.

Of course, the present invention is not limited to providing a pair of heater chips on two opposing sides as in the above embodiment, and it is also possible to simultaneously solder in three or four directions using three or four heater chips. It may be in the form of

〔Effect of the invention〕

As explained above, the present invention provides a plurality of heater chips corresponding to lead pins for each side of an electrical component, supports each heater chip in an independent suspension manner, and presses the lead pins for each side individually. Soldering can be performed while reliably holding each lead pin without shifting. Therefore, floating lead pins, bridging, and poor connections are significantly reduced, and the reliability of soldering can be improved. Further, since the heater chip is not heated all the time, but is heated by electricity when necessary for soldering, there is almost no flux sticking, and the work of removing flux can be greatly reduced, and work efficiency can be increased accordingly. moreover,
Since the temperature of each heater chip is individually adjusted when it is pressed against the lead pin, each heater chip can be used with the temperature adjusted to a predetermined temperature.
Therefore, the reliability of soldering can be further improved.

[Brief explanation of drawings]

The drawings show one embodiment of the present invention; FIG. 1 is a perspective view of the main parts thereof, FIG. 2 is a front view, and FIG. 3 is a side view. 2... Heater chip, 3... Holder device, 24
...Power source, 25...Power supply terminal, 26...Control unit,
27...Flat package type LSI, 28, 29
...Lead pin, 34...Lead pin, 35...
Lead pin, 13... Feeding screw (feeding device).

Claims (1)

[Claims] 1. In an electrical component lead pin soldering device that solders lead pins protruding from at least two sides of an electrical component to a connected part, the lead pins on each side are provided corresponding to the lead pins provided on each side. a plurality of heater chips for pressing against the connected portion for heating; a moving operation holder device supporting the distal end surfaces of each of the heater chips so that they can be independently suspended at least when pressed against the connected portion; a feeding device for horizontally moving and positioning the distal end surface of the lead pin on each side so as to face a corresponding predetermined position of the lead pin on each side; an energizing circuit connected to the plurality of heater chips so as to energize the pressed heater chips when each of the plurality of heater chips is pressed against the corresponding lead pins on each side, and to adjust the temperature of each of the plurality of heater chips to be energized; An apparatus for soldering lead pins of electrical components, comprising: