CN113579392A - Hot-pressing backflow device and method for micro-space LED chip welding - Google Patents

Hot-pressing backflow device and method for micro-space LED chip welding Download PDF

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Publication number
CN113579392A
CN113579392A CN202110974253.9A CN202110974253A CN113579392A CN 113579392 A CN113579392 A CN 113579392A CN 202110974253 A CN202110974253 A CN 202110974253A CN 113579392 A CN113579392 A CN 113579392A
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CN
China
Prior art keywords
conveyor belt
flexible conveyor
hot
pressing
control device
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CN202110974253.9A
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Chinese (zh)
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徐朴
王思远
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Shenzhen Fitech Co ltd
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Shenzhen Fitech Co ltd
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Priority to CN202110974253.9A priority Critical patent/CN113579392A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G23/00—Driving gear for endless conveyors; Belt- or chain-tensioning arrangements
    • B65G23/44—Belt or chain tensioning arrangements

Abstract

In the hot-pressing reflow soldering device and the method for soldering the micro-space LED chip, an upper hot-pressing assembly and a lower hot-pressing assembly are arranged oppositely and at intervals; the upper hot pressing assembly is arranged above the upper flexible conveying belt; the lower hot pressing assembly is arranged below the lower flexible conveying belt; the upper flexible conveyor belt control device is connected with the upper flexible conveyor belt and controls the upper flexible conveyor belt to rotate circularly; the lower flexible conveyor belt control device is connected with the lower flexible conveyor belt and controls the lower flexible conveyor belt to rotate circularly; the upper flexible conveyor belt and the lower flexible conveyor belt are oppositely arranged at intervals; the upper flexible conveying belt and the lower flexible conveying belt clamp the welded main body in the movement together, so that the welded main body passes through a space between the upper hot pressing assembly and the lower hot pressing assembly. The upper surface and the lower surface of the welded main body can be directly conducted with heat conduction, the heat conduction efficiency in welding is improved, the welding heating time is shortened, and the welding yield is improved.

Description

Hot-pressing backflow device and method for micro-space LED chip welding
Technical Field
The invention relates to the technical field of microelectronic and semiconductor chip packaging technology and equipment, in particular to a micro-space LED chip packaging or welding device and method, and particularly relates to a hot-pressing backflow device and method for micro-space LED chip packaging or welding.
Background
With the development of micro-photoelectric display technology in recent years, most of LED chips applied to micro-space direct-display light sources adopt an inverted packaging mode, a solder paste and a flux or a solder material applying method of chip electrode tinning and flux are adopted, and a reflow heating process mode is adopted, so that the LED chips and a COB or COG board are welded after being melted to realize metallurgical connection of electrodes, and the purposes of electric conduction and heat conduction are achieved.
Due to the fine pitch LED chips, they are small in size, usually 0408 chips, and even 0203, 0102 chips. 0408 chip means that its size is 4mil by 8 mil; 0203 chip means its size is 2mil by 3 mil; 0102 chips means that they have dimensions of 1mil by 2mil, where mils are thousandths of an inch and the thicknesses are all within the micrometer range; in the traditional SMT reflow soldering, a soldered object is not constrained in the reflow soldering process generally, the soldered object is heated through hot plate conduction at the lower part or convection heat transfer or radiation conduction to complete the soldering process, a tiny chip floats on solder, and the chip is uneven after soldering, so that the light efficiency is affected. Such a heat transfer process is disadvantageous for the soldering of the flip-chip LED chip; because the energy of the lower hot plate needs to be transferred to the bonding point of the inverted LED chip through a COB (chip On Board) or COG (chip On glass) plate, the heat conduction efficiency is low, and the rapid fusion welding of the bonding point cannot be realized. The uniformity and stability of the thermal field generated by convective heat transfer or by radiative heat transfer is also strongly related to the source and the manner of conduction. In the micro-spacing LED chip welding process, the micron-sized welding spot spacing enlarges the influence of the uniformity and stability of a thermal field on the welding effect; one point of the thermal field fluctuates and is unevenly distributed, so that the welding temperature difference of different welding points can be caused, and the welding effect difference of different welding points can be caused. The temperature range endured by the soldering of the LED chip also needs to be kept within a certain range, so that the soldering manner can cause a large defective rate of soldering.
The traditional reflow soldering process cannot meet the requirement of micro-space LED flip-chip soldering, and industrial and technical pain points with low yield and high repair cost appear. Because the welding area is small, and tens of thousands of welding spots are often integrated on one micro-space display unit, the traditional reflow soldering device can not ensure that each spot can obtain reliable welding effect for the dense welding spots. The condition of insufficient soldering or poor soldering is easy to occur, and in the subsequent process and the using process of the micro-space display unit, the soldering point can be separated from failure due to the change of thermal stress in the LED display unit caused by the influence of environmental working heat energy. There is a pressing need for improved conventional reflow soldering apparatus and method to improve the soldering quality and efficiency of fine pitch LED flip chips.
Chinese patent application publication No. CN112333932A proposes a multi-press head hot-pressing reflow apparatus and an operation method thereof, and proposes a constrained reflow process of COB or COG assembly of a micro-pitch LED flip chip that uses a plurality of hot-pressing apparatuses to work simultaneously, but this apparatus is complicated, belongs to an intermittent operation, and has the disadvantages of low efficiency and inconsistent soldering effect of finished products due to non-uniform temperature among a plurality of hot-pressing plates.
In the present application, the micro-pitch LED chip refers to a mini or micro LED chip having a chip size of < 100 micrometers (width) × 200 micrometers (length), and a pitch of LED light emitting points of <0.9 micrometers.
Disclosure of Invention
The technical scheme of the invention overcomes the defects of the prior art, designs the welding device and the method which can vertically clamp the welded main body in motion and enable the welded main body to directly and uniformly conduct double-sided heat conduction, so that the upper surface and the lower surface of the welded main body can directly and uniformly conduct heat conduction, the heat conduction efficiency in welding is improved, the welding heating time can be shortened, and the welding yield is improved; each welding spot on the welded main body can be heated more uniformly, the flatness and consistency of the chip are better, and the welding yield can be greatly improved; and the welded main body can be automatically and periodically sent in sequence, the defect that the traditional double-sided hot pressing is interrupted is avoided, and the production efficiency can be greatly improved.
In the present application, a technical solution for solving the above technical problems is a hot-press reflow soldering device for soldering a micro-spaced LED chip, including a reflow soldering device main body, an upper flexible conveyor belt control device, an upper flexible conveyor belt, an upper hot-pressing assembly, a lower flexible conveyor belt control device, a lower flexible conveyor belt, and a lower hot-pressing assembly; the upper hot pressing assembly and the lower hot pressing assembly are respectively fixedly connected with the reflow soldering device main body; the upper hot-pressing assembly and the lower hot-pressing assembly are arranged oppositely and at intervals; the upper hot pressing assembly is arranged above the upper flexible conveying belt; the lower hot pressing assembly is arranged below the lower flexible conveying belt; the upper flexible conveyor belt control device is connected with the upper flexible conveyor belt and controls the upper flexible conveyor belt to rotate circularly; the lower flexible conveyor belt control device is connected with the lower flexible conveyor belt and controls the lower flexible conveyor belt to rotate circularly; the upper flexible conveyor belt and the lower flexible conveyor belt are oppositely arranged at intervals; the upper flexible conveying belt and the lower flexible conveying belt clamp the welded main body in the movement together, so that the welded main body moves to penetrate through the space between the upper hot pressing assembly and the lower hot pressing assembly.
The distance between the upper hot-pressing assembly and the lower hot-pressing assembly can be adjusted; or the distance between the upper hot-pressing assembly and the lower hot-pressing assembly is set to be less than 10 mm.
The upper hot-pressing assembly comprises an upper hot-pressing temperature control device and an upper hot-pressing main body; the upper hot-pressing temperature control device is connected with the upper hot-pressing main body, outputs heat energy to the upper hot-pressing main body and controls the temperature of the upper hot-pressing main body; the temperature of the upper hot-pressing assembly is set between 50 and 500 ℃.
The lower hot-pressing assembly comprises a lower hot-pressing temperature control device and a lower hot-pressing main body; the lower hot-pressing temperature control device is connected with the lower hot-pressing main body and outputs heat energy to the lower hot-pressing main body and controls the temperature of the lower hot-pressing main body; the temperature of the lower hot-pressing assembly is set between 50 and 500 ℃.
The upper hot-pressing assembly also comprises an upper hot-pressing pressure control device; the upper hot-pressing pressure control device is connected with the upper hot-pressing main body, the upper hot-pressing pressure control device outputs downward acting force to the upper hot-pressing main body, and the downward pressure range of the acting force is 0.5-5 MPa; the upper hot-pressing pressure control device controls the distance between the upper hot-pressing main body and the lower hot-pressing main body.
The lower hot-pressing assembly also comprises a lower hot-pressing pressure control device; the lower hot-pressing pressure control device is connected with the lower hot-pressing main body and outputs an upward acting force to the lower hot-pressing main body, and the upward pressure range of the acting force is 0.5-5 MPa; the lower hot-pressing pressure control device controls the distance between the lower hot-pressing main body and the upper hot-pressing main body; or the lower hot-pressing pressure control device and the upper hot-pressing pressure control device jointly control the distance between the lower hot-pressing main body and the upper hot-pressing main body.
The upper hot-pressing main body is a flat-plate type hot-pressing plate; the lower hot-pressing main body is a flat-plate type hot-pressing plate;
the upper hot-pressing pressure control device can press the upper flexible conveyor belt down after adjusting the distance between the upper hot-pressing assembly and the lower hot-pressing assembly, so that when the upper flexible conveyor belt passes through the distance between the upper hot-pressing assembly and the lower hot-pressing assembly, the upper flexible conveyor belt has less than or equal to 5 relative to the horizontal directionoThe included angle of (a).
The hot-pressing reflow soldering device for soldering the micro-space LED chip also comprises two first thickness gauges and two second thickness gauges; two ends of one side of the upper hot pressing assembly, which is opposite to the lower hot pressing assembly, are respectively connected through a first thickness gauge; the vertical distance between one side of the upper hot-pressing assembly and the corresponding side of the lower hot-pressing assembly is called as a first distance; the two first thickness gauges are used for adjusting the size of the first distance and limiting the thickness of the first distance; two ends of the opposite sides of the upper hot pressing assembly and the lower hot pressing assembly are respectively connected through a second thickness gauge; the vertical distance between the other side of the upper hot-pressing assembly and the other side of the lower hot-pressing assembly is called as a second distance; the two second thickness gauges are used for adjusting the size of the second distance and limiting the thickness of the second distance; the adjustment range of the first and second pitches is 0.100-10.000 mm.
The width of the upper flexible conveyor belt and the width of the lower flexible conveyor belt are set between 100 mm and 1000mm, and the thickness of the upper flexible conveyor belt and the thickness of the lower flexible conveyor belt are set between 1mm and 3 mm.
The upper flexible conveyor belt control device comprises an upper flexible conveyor belt driving roller, an upper flexible conveyor belt tensioning roller and an upper flexible conveyor belt tensioning device; two ends of an upper flexible conveyor belt which is closed into a ring shape are respectively sleeved on an upper flexible conveyor belt driving roller and an upper flexible conveyor belt tensioning roller; the upper flexible conveyor belt driving roller drives the upper flexible conveyor belt to move when being driven to rotate; the upper flexible conveyor belt tensioning device controls an upper flexible conveyor belt tensioning roller, and the tensioning state of the upper flexible conveyor belt is adjusted by the upper flexible conveyor belt tensioning roller; the lower flexible conveyor belt control device comprises a lower flexible conveyor belt driving roller, a lower flexible conveyor belt tensioning roller and a lower flexible conveyor belt tensioning device; two ends of a lower flexible conveyor belt which is closed into a ring shape are respectively sleeved on a lower flexible conveyor belt driving roller and a lower flexible conveyor belt tensioning roller; the lower flexible conveyor belt driving roller drives the lower flexible conveyor belt to move when being driven to rotate; the lower flexible conveyor belt tensioning device controls the lower flexible conveyor belt tensioning roller, and the tensioning state of the lower flexible conveyor belt is adjusted by the lower flexible conveyor belt tensioning roller.
The hot-pressing reflow soldering device for welding the micro-space LED chips is also provided with an upper flexible conveyor belt driving roller heating temperature control device and an upper flexible conveyor belt tensioning roller heating temperature control device; the upper flexible conveyor belt drives the roller heating temperature control device to output heat energy to the upper flexible conveyor belt driving roller and control the temperature of the upper flexible conveyor belt driving roller; the upper flexible conveyor belt tensioning roller heating temperature control device outputs heat energy to the upper flexible conveyor belt tensioning roller and controls the temperature of the upper flexible conveyor belt tensioning roller; two ends of the upper flexible conveyor belt are respectively sleeved with the upper flexible conveyor belt driving roller and the upper flexible conveyor belt tensioning roller, and heat energy is obtained from the upper flexible conveyor belt driving roller and the upper flexible conveyor belt tensioning roller.
The hot-pressing reflow soldering device for welding the micro-space LED chips is also provided with a lower flexible conveyor belt driving roller heating temperature control device and a lower flexible conveyor belt tensioning roller heating temperature control device; the lower flexible conveyor belt driving roller heating temperature control device outputs heat energy to the lower flexible conveyor belt driving roller and controls the temperature of the lower flexible conveyor belt driving roller; the lower flexible conveyor belt tensioning roller heating temperature control device outputs heat energy to the lower flexible conveyor belt tensioning roller and controls the temperature of the lower flexible conveyor belt tensioning roller; two ends of the lower flexible conveyor belt are respectively sleeved with the lower flexible conveyor belt driving roller and the lower flexible conveyor belt tensioning roller, and heat energy is obtained from the lower flexible conveyor belt driving roller and the lower flexible conveyor belt tensioning roller.
The temperatures of the upper flexible conveyor belt and the lower flexible conveyor belt are respectively set between 50 ℃ and 500 ℃.
In this application, a technical solution for solving the above technical problem may also be a thermal compression reflow soldering method for soldering a micro-spaced LED chip, including step a: the upper flexible conveyor belt and the lower flexible conveyor belt which rotate continuously in the same direction are oppositely arranged at intervals; and B: the upper hot-pressing assembly and the lower hot-pressing assembly are oppositely arranged at intervals; the upper hot pressing assembly is arranged above the upper flexible conveying belt; the lower hot pressing assembly is arranged below the lower flexible conveying belt; and C: the welded main body is clamped between the upper flexible conveying belt and the lower flexible conveying belt in motion, and reflow welding capable of realizing double-sided direct hot-pressing heat conduction is carried out through the space between the upper hot-pressing assembly and the lower hot-pressing assembly.
In the step B: the distance between the upper hot pressing assembly and the lower hot pressing assembly is adjustable; or the distance between the upper hot-pressing assembly and the lower hot-pressing assembly is set to be less than 10 mm.
In the step B: the upper hot-pressing assembly comprises an upper hot-pressing temperature control device and an upper hot-pressing main body; the upper hot-pressing temperature control device is connected with the upper hot-pressing main body, outputs heat energy to the upper hot-pressing main body and controls the temperature of the upper hot-pressing main body; the temperature of the upper hot-pressing assembly is set between 50 and 500 ℃.
In the step B: the lower hot-pressing assembly comprises a lower hot-pressing temperature control device and a lower hot-pressing main body; the lower hot-pressing temperature control device is connected with the lower hot-pressing main body and outputs heat energy to the lower hot-pressing main body and controls the temperature of the lower hot-pressing main body; the temperature of the lower hot-pressing assembly is set between 50 and 500 ℃.
The upper hot-pressing assembly also comprises an upper hot-pressing pressure control device; the upper hot pressing pressure control device is connected with the upper hot pressing main body, outputs a downward acting force to the upper hot pressing main body, and controls the distance between the upper hot pressing main body and the lower hot pressing main body.
The lower hot-pressing assembly also comprises a lower hot-pressing pressure control device; the lower hot-pressing pressure control device is connected with the lower hot-pressing main body, outputs upward acting force to the lower hot-pressing main body and controls the distance between the lower hot-pressing main body and the upper hot-pressing main body; or the lower hot-pressing pressure control device and the upper hot-pressing pressure control device jointly control the distance between the lower hot-pressing main body and the upper hot-pressing main body.
In the step B: the method also comprises the step of adjusting the distance between the upper hot-pressing assembly and the lower hot-pressing assembly by utilizing the first thickness gauge and the second thickness gauge; two ends of one side of the upper hot pressing assembly, which is opposite to the lower hot pressing assembly, are respectively connected through a first thickness gauge; the vertical distance between one side of the upper hot-pressing assembly and the corresponding side of the lower hot-pressing assembly is called as a first distance; the two first thickness gauges are used for adjusting the size of the first distance and limiting the thickness of the first distance; two ends of the opposite sides of the upper hot pressing assembly and the lower hot pressing assembly are respectively connected through a second thickness gauge; the vertical distance between the other side of the upper hot-pressing assembly and the other side of the lower hot-pressing assembly is called as a second distance; the two second thickness gauges are used for adjusting the size of the second distance and limiting the thickness of the second distance; the adjustment range of the first and second pitches is 0.100-10.000 mm.
In the step A, the width of the upper flexible conveyor belt and the width of the lower flexible conveyor belt are set to be 50-1000mm, and the thickness of the upper flexible conveyor belt and the thickness of the lower flexible conveyor belt are set to be 1-3 mm.
In the step A, a step of heating the upper flexible conveyor belt by utilizing an upper flexible conveyor belt driving roller heating temperature control device and an upper flexible conveyor belt tensioning roller heating temperature control device is also included; the upper flexible conveyor belt drives the roller heating temperature control device to output heat energy to the upper flexible conveyor belt driving roller and control the temperature of the upper flexible conveyor belt driving roller; the upper flexible conveyor belt tensioning roller heating temperature control device outputs heat energy to the upper flexible conveyor belt tensioning roller and controls the temperature of the upper flexible conveyor belt tensioning roller; two ends of an upper flexible conveyor belt which is closed into a ring shape are respectively sleeved with an upper flexible conveyor belt driving roller and an upper flexible conveyor belt tensioning roller, and heat energy is obtained from the upper flexible conveyor belt driving roller and the upper flexible conveyor belt tensioning roller; the temperature of the upper flexible conveyor belt is set between 50-500 ℃.
In the step A, a step of heating the lower flexible conveyor belt by utilizing a lower flexible conveyor belt driving roller heating temperature control device and a lower flexible conveyor belt tensioning roller heating temperature control device is also included; the lower flexible conveyor belt driving roller heating temperature control device outputs heat energy to the lower flexible conveyor belt driving roller and controls the temperature of the lower flexible conveyor belt driving roller; the lower flexible conveyor belt tensioning roller heating temperature control device outputs heat energy to the lower flexible conveyor belt tensioning roller and controls the temperature of the lower flexible conveyor belt tensioning roller; two ends of a lower flexible conveyor belt which is closed into a ring shape are respectively sleeved with a lower flexible conveyor belt driving roller and a lower flexible conveyor belt tensioning roller, and heat energy is obtained from the lower flexible conveyor belt driving roller and the lower flexible conveyor belt tensioning roller; the temperature of the lower flexible conveyor belt is set between 50-500 ℃.
Compared with the prior art, the invention has one of the following beneficial effects: upper and lower flexible conveyer belt and upper and lower hot pressing component mutually cooperate and form the centre gripping in the motion and by the welding main part, make by two upper and lower surfaces of welding main part can both directly carry out heat-conduction, improved the heat conduction efficiency in the welding, can let by the welding main part upper and lower two sides be heated simultaneously, shorten the welding time of being heated, improve the welded yields.
Compared with the prior art, the invention has the following two beneficial effects: the welded main body passes through the welding heating area in a manner of being clamped and contacting the upper hot pressing assembly and the lower hot pressing assembly in the uniform motion, the welding heating time can be further shortened in the uniform motion manner, and the welding yield is improved.
Compared with the prior art, the invention has the third beneficial effect: the welded main body is clamped in the uniform motion and contacts the upper and lower hot pressing components; the upper and lower hot pressing assembly and the upper and lower flexible conveyor belts are all in a state of preheating to a target welding temperature, and the upper and lower hot pressing assembly and the upper and lower flexible conveyor belts are wholly in a reflow soldering background, the temperature of the whole welding atmosphere is maintained to play a role in temperature balance and stability by the heating of radiation and convection modes, each welding point on the welded main body can be in a more uniform heat conduction environment by the mode of motion and direct contact heat conduction, each welding point is heated more uniformly, the chip flatness is better, the consistency is better, and the welding yield can be greatly improved.
Compared with the prior art, the invention has the following beneficial effects: the welded main body is clamped by the upper flexible conveying belt and the lower flexible conveying belt, can be sequentially and automatically periodically sent into the space between the upper hot pressing assembly and the lower hot pressing assembly for welding, does not need to be interrupted, and can greatly improve the production efficiency. The defect that the traditional double-sided hot pressing needs to be interrupted is avoided.
Drawings
FIG. 1 is a schematic cross-sectional view of a first preferred embodiment of a thermal compression reflow soldering apparatus for soldering a micro-spaced LED chip;
FIG. 2 is a schematic top view of a first preferred embodiment of a thermal compression reflow soldering apparatus for soldering micro-spaced LED chips;
FIG. 3 is a schematic cross-sectional view of a second preferred embodiment of a thermal compression reflow soldering apparatus for soldering a micro-spaced LED chip;
FIG. 4 is a schematic top view of a second preferred embodiment of a thermal compression reflow soldering apparatus for soldering micro-spaced LED chips;
FIG. 5 is a schematic cross-sectional view of a third preferred embodiment of a thermal compression reflow soldering apparatus for soldering a micro-spaced LED chip;
FIG. 6 is a schematic top view of a third preferred embodiment of a thermal compression reflow soldering apparatus for soldering a fine-pitch LED chip.
Detailed Description
The present invention will be described in more detail with reference to the accompanying drawings.
As shown in fig. 1 to 4, the embodiment of the thermal compression reflow soldering apparatus for soldering the micro-pitch LED chip includes an upper flexible conveyor belt control device, an upper flexible conveyor belt 12, an upper thermal compression assembly 14, a lower flexible conveyor belt control device, a lower flexible conveyor belt 13, and a lower thermal compression assembly 15; the upper hot pressing assembly 14 and the lower hot pressing assembly 15 are respectively fixedly connected with the reflow soldering device main body; the upper hot-pressing assembly 14 and the lower hot-pressing assembly 15 are oppositely arranged at intervals; an upper press assembly 14 is disposed above the upper flexible conveyor belt 12; a lower hot pressing assembly 15 is disposed below the lower flexible conveyor belt 13; the upper flexible conveyor belt control device is connected with the upper flexible conveyor belt 12 and controls the upper flexible conveyor belt 12 to rotate circularly; the lower flexible conveyor belt control device is connected with the lower flexible conveyor belt 13 and controls the lower flexible conveyor belt 13 to rotate circularly; the upper flexible conveyor belt 12 and the lower flexible conveyor belt 13 are oppositely arranged at intervals; the upper flexible conveyor belt and the lower flexible conveyor belt jointly clamp the welded body in motion, so that the welded body passes through a space between the upper hot pressing assembly 14 and the lower hot pressing assembly 15. Even though the welded body passes through the space between the upper and lower thermo-compression assemblies 14 and 15 in such a manner as to be sandwiched and contacted with the upper and lower flexible belts 12 and 13 in the same-direction movement of the upper and lower flexible belts 12 and 13. The reflow soldering apparatus main body is not shown in fig. 1 to 2, and the first and second main body holders 25 and 26 in fig. 3 and 4 are part of the reflow soldering apparatus main body.
In the embodiment shown in fig. 1 and 3, the upper press assembly 14 forms an upper heating zone in contact with and abutting against the upper flexible conveyor belt 12; the lower hot pressing assembly 15 is contacted and attached with the lower flexible conveyor belt 13 to form a lower heating area; the upper heating area and the lower heating area are opposite to form a hot-pressing backflow area; the direct contact conduction heating mode is adopted, the welded main body can be in contact heating in a restrained mode, the flip chip obtains heat energy required by welding or curing in a short time, and an effective welding point or a device for adhering joints is formed. The upper flexible conveyor belt 12, the upper thermocompression assembly 14, the lower flexible conveyor belt 13, the lower thermocompression assembly 15 and the body to be soldered may be in a conventional reflow soldering atmosphere; the hot-pressing reflow soldering device for soldering the micro-interval LED chip can inherit the soldering temperature atmosphere of the traditional reflow soldering. Of course, in some cases, it is not necessary that the upper flexible conveyor belt 12, the upper thermocompression assembly 14, the lower flexible conveyor belt 13, the lower thermocompression assembly 15, and the body to be soldered be in a conventional reflow soldering atmosphere.
In the embodiment shown in fig. 1 and 3, the body to be soldered is a fine pitch LED chip; the micro-pitch LED chip includes an LED chip 99, a solder 92, and a substrate 91 in soldering; the solder 92 is coated between the LED chip 99 and the substrate 91; the upper surface of the LED chip 99 is in contact with the lower surface of the upper flexible conveyor belt 12; the lower bottom surface of the substrate 91 is in contact with the upper surface of the lower flexible conveyor belt 13; i.e. the welded body is clamped between the lower surface of the upper flexible conveyor belt 12 and the upper surface of the lower flexible conveyor belt 13. The upper flexible conveyor belt 12 and the lower flexible conveyor belt 13 jointly clamp the welded body in motion, so that when the welded body passes through the space between the upper hot pressing assembly 14 and the lower hot pressing assembly 15, the upper hot pressing assembly 14 is in contact with the upper surface of the upper flexible conveyor belt 12. Most of the heat on the upper press assembly 14 is conducted directly to the upper flexible conveyor belt 12, and the heat on the upper flexible conveyor belt 12 is conducted directly to the upper surface of the device on the body being soldered in contact with the upper flexible conveyor belt. Of course, a small portion of the heat from the upper thermocompressive assembly 14 can also be transferred to the body being welded by convection or radiation. The substrate 91 includes a COB plate or a COG plate.
The direct contact heat conduction mode has high heat transfer efficiency, particularly in the welding of the micro-space LED chip, each welding spot is very small, the heat conduction mode can quickly enable the welding spot to reach the melting temperature, and due to the heat conduction mode, as long as the temperature uniformity on the upper hot pressing assembly 14 is good, the temperature uniformity of each welding spot can be well controlled, so that the welding consistency of the high-density micro-space LED chip is greatly improved; the defective rate of welding of the high-density micro-space LED chip can be greatly reduced. Upper autoclave assembly 14 may be a unitary body in this application, or may be a unitary body formed from a plurality of components joined together.
In the prior art, when a reflow soldering device with a single-sided hot plate is adopted for soldering a micro-space LED chip; generally, only single-side heating or non-contact double-side heating can be performed, and even if double-side heating is performed, intermittent double-side heating is performed, so that automatic-circulation continuous welding cannot be realized. In the prior art, a single-surface hot plate heating mode is adopted, and the defective rate of micro-space LED chips caused by welding is about 0.1%. After the welding device in the application is adopted for welding, the defective rate of the micro-space LED chip caused by welding is reduced to about 0.01 percent. The production efficiency of intermittent double-sided heating is typically 0.2 square meters to 0.5 square meters per hour; the circulating speed of the upper and lower flexible conveyor belts 12 can be flexibly adjusted along with the welding requirement. The production efficiency is far greater than that of interval double-sided heating.
In the embodiment shown in fig. 1 to 6, the traveling speeds of the upper flexible conveyor belt 12 and the lower flexible conveyor belt 13 can be adjusted according to the welding requirements, so that the time of the welded body undergoing welding can be flexibly set; and this time may be related to the temperature of the upper and lower flexible conveyor belts 12, 13 and the upper and lower press assemblies 14, 15; the welding temperature and the welding speed can be adjusted to the optimal state, and the production efficiency is improved to the maximum.
In the embodiments shown in fig. 1 to 6, the temperature of the upper press assembly and the temperature of the lower press assembly may be set between 50-500 c, respectively. Such a temperature setting can accommodate most welding requirements; the temperature setting of the upper hot pressing assembly can be independent of the temperature setting of the lower hot pressing assembly, namely, the temperature of the upper hot pressing assembly and the temperature of the lower hot pressing assembly can be set to different temperatures so as to adapt to the welding positions contacted with the upper hot pressing assembly and the lower hot pressing assembly respectively. In the process of soldering the micro-space LED chip comprising the LED chip 99, the solder 92 and the substrate 91, the upper thermocompression assembly 14 is in contact with the upper flexible conveyor belt 12, and the upper flexible conveyor belt 12 is in contact with the LED chip 99, so that the temperature of the upper thermocompression assembly 14 can be set according to the soldering temperature requirement of the LED chip 99. The temperature of the lower autoclave assembly 15 may also be set according to the soldering temperature requirements of the substrate 91. The temperature of the upper hot press assembly 14 and the temperature of the lower hot press assembly 15 may be set in different temperature ranges, respectively, or may be set in the same temperature range.
In the embodiment shown in fig. 1-6, the spacing between upper and lower press assemblies 14 and 15 is adjustable; or the space between the upper and lower press assemblies 14 and 15 is set to 10mm or less. The distance between the upper hot pressing assembly 14 and the lower hot pressing assembly 15 can be adjusted according to the overall thickness of the welded body; in the micro-pitch LED chip bonding, the distance between the upper and lower thermocompression assemblies 14 and 15 can be set below 10mm to adapt to the thickness of different substrates and the thickness of different micro-pitch LED chips. The thickness of the micro-distance LED chip is 0.1mm-0.005mm, and the thickness of the substrate is 0.1-1 mm. Go up the interval adjustable or setting between hot pressing component 14 and the lower hot pressing component 15, can ensure to be welded the upper surface of main part and the lower surface contact of last flexible conveyor 12 to and the lower surface of main part can be welded the upper surface contact of flexible conveyor 13 down, thereby guarantee to be welded the main part can with last flexible conveyor 12, go up hot pressing component 14, flexible conveyor 13 down, hot pressing component 15 direct contact carries out heat-conduction down, thereby guarantee heat conduction efficiency. When the upper surface of the welding main body is contacted with the lower surface of the upper flexible conveyor belt, the pressure range born by the upper surface of the welding main body is 0.5-5 MPa; when the lower surface of the welding main body is contacted with the upper surface of the lower flexible conveyor belt, the pressure borne by the lower surface of the welding main body is in a pressure range of 0.5-5 MPa.
In the embodiment shown in fig. 1, 3 and 5, adjusting the spacing between upper press assembly 14 and lower press assembly 15 causes upper flexible conveyor belt 12 to be pressed downward such that upper flexible conveyor belt 12 traverses the spacing between upper press assembly 14 and lower press assembly 15, and upper flexible conveyor belt 12 is approximately 5 degrees f horizontaloThe included angle of (a).
In the embodiment shown in fig. 1 and 3, upper press assembly 14 includes an upper press temperature control device and an upper press body 141; the upper hot-pressing temperature control device is not shown in the figure; the upper hot-pressing temperature control device is connected with the upper hot-pressing main body 141, outputs heat energy to the upper hot-pressing main body 141 and controls the temperature of the upper hot-pressing main body 141; the lower hot-pressing assembly 15 comprises a lower hot-pressing temperature control device and a lower hot-pressing main body 151; the lower hot-pressing temperature control device is not shown in the figure; the lower hot-pressing temperature control device is connected to the lower hot-pressing main body 151, and the lower hot-pressing temperature control device outputs heat energy to the lower hot-pressing main body 151 and controls the temperature of the lower hot-pressing main body 151. The temperature of upper hot press assembly 14 can be controlled by an upper hot press temperature control device. The temperature of the lower hot-pressing assembly 15 can be controlled by a lower hot-pressing temperature control device. The temperature of the upper hot-press assembly 14 and the temperature of the lower hot-press assembly 15 can be independently controlled by corresponding heating temperature control devices. The upper hot-pressing temperature control device and the lower hot-pressing temperature control device comprise various heating control devices in the prior art, such as an electromagnetic heating temperature control device, a hot oil temperature control device and the like.
In the embodiment shown in fig. 1 and 3, upper press assembly 14 further includes an upper press pressure control device 142; the upper hot pressing pressure control device 142 is connected to the upper hot pressing body 141, the upper hot pressing pressure control device 142 outputs a downward acting force to the upper hot pressing body, and the upper hot pressing pressure control device 142 controls a distance between the upper hot pressing body 141 and the lower hot pressing body. The upper hot pressing pressure control unit 142 can control the downward force of the upper hot pressing body 141, so that the upper hot pressing pressure control unit 142 can also control the distance between the upper hot pressing body 141 and the lower hot pressing body. In the soldering of the fine-pitch LED chip including the LED chip 99, the solder 92 and the substrate 91, the pressure that the LED chip 99 and the substrate 91 can bear is different, and the pressure resistance of the materials of the upper and lower surfaces of the body to be soldered can be adjusted adaptively according to the difference.
In the embodiment shown in fig. 1 and 3, lower press assembly 15 further includes a lower press pressure control device 152; the lower hot pressing pressure control device 152 is connected with the lower hot pressing body 151, the lower hot pressing pressure control device 152 outputs an upward acting force to the lower hot pressing body 151, and the lower hot pressing pressure control device 152 controls the distance between the lower hot pressing body 151 and the upper hot pressing body 141; or the lower hot pressing pressure control means 152 controls the distance between the lower hot pressing body 151 and the upper hot pressing body 141 in combination with the upper hot pressing pressure control means 142. The lower hot pressing pressure control means 152 outputs an upward force to the lower hot pressing body 151, so that the lower hot pressing pressure control means 152 controls a distance between the lower hot pressing body 151 and the upper hot pressing body 141; in the soldering of the fine-pitch LED chip including the LED chip 99, the solder 92 and the substrate 91, the pressure that the LED chip 99 and the substrate 91 can bear is different, and the pressure resistance of the materials on the upper and lower surfaces of the soldered body can be adjusted adaptively according to the different pressure resistance conditions. Of course, the lower hot pressing pressure control device 152 and the upper hot pressing pressure control device 142 can jointly control the distance between the lower hot pressing main body and the upper hot pressing main body, and the distance is adjusted to the position suitable for the upper surface and the lower surface of the welded main body, so that the clamping force received by the upper surface and the lower surface of the welded main body is proper, the clamping state can be ensured to generate contact heat conduction, the clamping force can be ensured to be proper, and the parts on the welded main body cannot be damaged. The upper hot pressing pressure control device 142 and the lower hot pressing pressure control device 152 can respectively and independently adjust output pressure; the upper hot pressing pressure control device 142 and the lower hot pressing pressure control device 152 may also simultaneously adjust and output a uniform pressure.
In the embodiment shown in fig. 1 and 3, two first thickness gauges 181 and two second thickness gauges 182 are further included; the two ends of the opposite sides of the upper hot pressing assembly 14 and the lower hot pressing assembly 15 are respectively connected through a first thickness gauge 181; the vertical distance between one side of the upper hot pressing assembly 14 and the corresponding side of the lower hot pressing assembly 15 is called a first distance; the two first thickness gauges 181 are used for adjusting the size of the first distance and limiting the thickness of the first distance. The two ends of the opposite sides of the upper hot-pressing assembly 14 and the lower hot-pressing assembly 15 are respectively connected through a second thickness gauge 182; the vertical distance between the other side of the upper hot pressing assembly 14 and the other side of the lower hot pressing assembly 15 is called as a second distance; two second thickness gauges 182 are used for adjusting the size of the second distance to limit the thickness of the second distance; the adjustment range of the first and second pitches is 0.100-10.000 mm. The first pitch and the second pitch may be the same or different in size. The first pitch may be greater than the second pitch; or the first pitch may be less than the second pitch; during reflow soldering, the soldered body enters the space between the upper and lower thermocompression assemblies, and optionally enters from a large space and moves from a small space. The height of the welded body before welding is slightly higher than that of the welded body after welding.
In the embodiment shown in fig. 1 to 4, the upper hot press body 141 is a flat plate type hot press plate; the lower hot press body 151 is a flat type hot press plate. The flat plate type hot press plate can uniformly clamp the welded main body and uniformly conduct heat. Each welding point on the welded main body can be stably and uniformly heated, and the welding yield of the micro-space LED chips is improved.
In the embodiment of the thermocompression reflow soldering apparatus for micro-pitch LED chip bonding shown in fig. 5 and 6, the upper thermocompression body 141 comprises an upper thermocompression plate 1411, an upper thermocompression roller set 1412, an upper bearing support 1413; the upper hot-pressing roller group 1412 comprises at least more than two hot-pressing rollers 14121; the upper supporting bearing support 1413 is fixedly connected with the upper hot-pressing plate 1411, a bearing in the upper hot-pressing roller 14121 is fixed at one end of the upper supporting bearing support 1413, and each upper hot-pressing roller 14121 can rotate independently; each upper heat press roller 14121 in the upper heat press roller set 1412 is in contact with the upper surface of the upper flexible conveyor belt 12.
In the embodiment of the thermal compression reflow soldering apparatus for soldering the fine pitch LED chips shown in fig. 5 and 6, the lower thermal compression main body 151 includes a lower thermal compression plate 1511, a lower thermal compression roller set 1512, and a lower support bearing 1513; the lower hot press roller set 1512 includes at least two lower hot press rollers 15121; the lower supporting bearing support 1513 is fixedly connected with the lower hot-pressing plate 1511, a bearing in the lower hot-pressing roller 15121 is fixed at one end of the lower supporting bearing support 1513, and each lower hot-pressing roller 15121 can rotate independently; each lower hot press roller 15121 in the lower hot press roller set 1512 is in contact with the lower surface of the lower flexible conveyor belt 13.
The upper hot pressing roller set 1412 can be in contact with the upper flexible conveyor belt 12 in a rotating manner, so that the heat of the upper hot pressing roller set 1412 can be quickly and uniformly heated to the upper flexible conveyor belt, and the temperature stability of the upper flexible conveyor belt 12 is ensured; similarly, the lower hot-pressing roller set 1512 can be in contact with the lower flexible conveyor belt 13 in a rotating manner, so that the heat of the lower hot-pressing roller set 1512 can be quickly and uniformly transferred to the lower flexible conveyor belt 13, and the temperature stability of the lower flexible conveyor belt 13 is ensured; the temperature stability of the upper flexible conveyor belt 12 and the lower flexible conveyor belt 13 guarantees the contact temperature of the welded main body during welding, and the welding uniformity and yield are improved.
In the embodiment shown in fig. 1 to 6, the width of the upper flexible conveyor belt and the lower flexible conveyor belt is set between 50 and 1000mm, and the thickness of the upper flexible conveyor belt and the lower flexible conveyor belt is set between 1 and 3 mm. The width of the upper flexible conveyor belt and the width of the lower flexible conveyor belt are set to be suitable for the size of the micro-space LED chips; the thickness of the upper flexible conveyor belt and the lower flexible conveyor belt enables the upper flexible conveyor belt and the lower flexible conveyor belt to have certain heat energy storage capacity. Meanwhile, the thickness setting also can have quick heat conduction capability, and heat energy on the upper hot pressing main body and the lower hot pressing main body can be quickly transferred to the welded main body through the upper flexible conveying belt and the lower flexible conveying belt.
In the embodiment shown in fig. 1, 3 and 5, the upper flexible conveyor control means comprises an upper flexible conveyor drive, an upper flexible conveyor drive roller 121, an upper flexible conveyor tensioning roller 125 and an upper flexible conveyor tensioning means. The two ends of the upper flexible conveyor belt 12 which is closed into a ring shape are respectively sleeved on the upper flexible conveyor belt driving roller 121 and the upper flexible conveyor belt tensioning roller 125; the upper flexible conveyor belt driving device drives the upper flexible conveyor belt driving roller 121 to rotate; the upper flexible conveyor belt driving roller 121 drives the upper flexible conveyor belt 12 to move when rotating; the upper flexible conveyor belt tensioner controls the upper flexible conveyor belt tensioning roller 125, and the upper flexible conveyor belt tensioner adjusts the tension of the upper flexible conveyor belt 12 through the upper flexible conveyor belt tensioning roller 125. The upper flexible belt drive and the upper flexible belt tensioner are not shown in the figures.
As in the embodiment shown in fig. 1, 3 and 5, the lower flexible conveyor control means comprises a lower flexible conveyor drive means, a lower flexible conveyor drive roller 131, a lower flexible conveyor tensioning roller 135 and a lower flexible conveyor tensioning means. The two ends of the lower flexible conveyor belt 13 which is closed into a ring shape are respectively sleeved on the lower flexible conveyor belt driving roller 131 and the lower flexible conveyor belt tensioning roller 135; the lower flexible conveyor belt driving device drives the lower flexible conveyor belt driving roller 131 to rotate; the lower flexible conveyor belt driving roller 131 drives the lower flexible conveyor belt 13 to move when rotating; the lower flexible conveyor belt tensioner controls the lower flexible conveyor belt tensioning roller 135 and adjusts the tension of the lower flexible conveyor belt 13 through the lower flexible conveyor belt tensioning roller 135. The lower flexible conveyor belt drive and the lower flexible conveyor belt tensioner are not shown in the figures.
The upper flexible conveyor belt tensioning device and the lower flexible conveyor belt tensioning device can respectively control the tensioning states of the upper flexible conveyor belt and the lower flexible conveyor belt, so that the distance between the upper flexible conveyor belt and the lower flexible conveyor belt can be conveniently adjusted; making the space adaptable to the size of the body to be welded and the upper hot-pressing body and
the space between the lower hot pressing bodies is sized.
The upper flexible conveyor belt driving device and the lower flexible conveyor belt driving device are two devices with the same structure, and can also be one device which is integrated together, and the rotating speeds of the upper flexible conveyor belt and the lower flexible conveyor belt are naturally synchronized. As in the embodiments shown in fig. 2, 4 and 6, one embodiment of an upper flexible conveyor belt drive and a lower flexible conveyor belt drive is shown; the upper flexible belt drive includes, in one embodiment, a drive motor 1211, a coupling 1212, and a drive shaft linkage gear 1213; the upper flexible conveyor belt driving roller 121 is connected with a coupling 1212, a driving motor 1211 is connected with the coupling 1212, and the flexible conveyor belt driving roller 121 is driven to rotate by the driving motor 1211.
The upper flexible conveyor belt tensioning device and the lower flexible conveyor belt tensioning device are devices with the same structure, and can also be integrated together, and the tensioning states of the upper flexible conveyor belt and the lower flexible conveyor belt are naturally synchronized; as in the embodiment shown in fig. 2, 4 and 6, an upper flexible belt tensioner 1251 and a lower flexible belt tensioner 1351 are included.
In the embodiment shown in fig. 1, 3 and 5, a first upper photosensor 1261, a second upper photosensor 1262, a first lower photosensor 1371 and a second lower photosensor 1372 are also included; the first upper photoelectric sensor 1261 and the second upper photoelectric sensor 1262 are respectively arranged at two ends above the upper flexible conveying belt 12 and used for detecting the temperature state of the upper flexible conveying belt 12; the first lower photosensor 1371 and the second lower photosensor 1372 are respectively disposed at both ends below the lower flexible conveyer 13, and are used for detecting a temperature state of the lower flexible conveyer 13.
In the embodiment shown in fig. 3, a drive roller support frame 23 is also included; a first driving bearing seat 2321 and a first driving bearing seat adjusting device 2322 are arranged on the driving roller supporting frame 23; the upper flexible conveyor belt drive roller bearing 23121 is connected with a first drive bearing block 2321 for support; the first drive bearing block adjustment device 2322 is used to adjust the position of the first drive bearing block 2321 on the drive roller support frame 23, and thus the fixed position of the upper flexible conveyor belt drive roller 121 on the drive roller support frame 23. The driving roller support 23 is further provided with a second driving bearing seat 2324, and the lower flexible conveyor belt driving roller bearing 23131 is connected with the second driving bearing seat 2324 for support. The position of the first drive bearing block adjustment 2322 on the drive roller support 23 can be adjusted by means of the first adjusting screw 23221.
In the embodiment shown in fig. 3, a tensioner support bracket 27 is also included; a first tensioning bearing block 2728 and a second tensioning bearing block 2729 are arranged on the tensioning wheel support frame; the upper flexible conveyor belt tensioning roller bearing 27125 is connected to and supported by a first tensioning bearing block 2728; the lower flexible conveyor belt tensioning roller bearing 27135 is attached to support with a second tensioning bearing block 2729. The position of the first tensioning bearing block 2728 on the tensioning wheel support bracket 27 can be adjusted by the tensioning adjustment screw 27281.
In the embodiment shown in fig. 3, a first body support 25 and a second body support 26 are also included; the first main body bracket 25 is provided with a first upper hot pressing assembly fixing part 251 and a first lower hot pressing assembly fixing part 252; the second body bracket 26 is provided with a second upper hot press fixing part 261 and a second lower hot press fixing part 262; the upper thermal pressing assembly 14 is fixedly connected with the first main body bracket 25 and the second main body bracket 26 through the first upper thermal pressing assembly fixing part 251 and the second upper thermal pressing fixing part 261, respectively, in the horizontal direction; the lower thermal pressing assembly 15 is fixedly connected to the first and second main body frames 25 and 26 through the first and second lower thermal pressing assembly fixing portions 252 and 262, respectively, in the horizontal direction. The first body support 25 and the second body support 26 may be door-shaped supports, respectively, or may be combined together to form a door-shaped support.
In some embodiments not shown in the drawings, an upper flexible conveyor belt driving roller heating temperature control device and an upper flexible conveyor belt tensioning roller heating temperature control device are further arranged; the upper flexible conveyor belt drives the roller heating temperature control device to output heat energy to the upper flexible conveyor belt driving roller and control the temperature of the upper flexible conveyor belt driving roller; the upper flexible conveyor belt tensioning roller heating temperature control device outputs heat energy to the upper flexible conveyor belt tensioning roller and controls the temperature of the upper flexible conveyor belt tensioning roller; two ends of the upper flexible conveyor belt are respectively sleeved with the upper flexible conveyor belt driving roller and the upper flexible conveyor belt tensioning roller, and heat energy is obtained from the upper flexible conveyor belt driving roller and the upper flexible conveyor belt tensioning roller;
in some embodiments not shown in the drawings, a lower flexible conveyor belt driving roller heating temperature control device and a lower flexible conveyor belt tensioning roller heating temperature control device are further arranged; the lower flexible conveyor belt driving roller heating temperature control device outputs heat energy to the lower flexible conveyor belt driving roller and controls the temperature of the lower flexible conveyor belt driving roller; the lower flexible conveyor belt tensioning roller heating temperature control device outputs heat energy to the lower flexible conveyor belt tensioning roller and controls the temperature of the lower flexible conveyor belt tensioning roller; two ends of the lower flexible conveyor belt are respectively sleeved with the lower flexible conveyor belt driving roller and the lower flexible conveyor belt tensioning roller, and heat energy is obtained from the lower flexible conveyor belt driving roller and the lower flexible conveyor belt tensioning roller.
The upper flexible conveyor belt drives the roller heating temperature control device and the upper flexible conveyor belt tensioning roller heating temperature control device, so that the upper flexible conveyor belt can continuously and stably obtain energy input in the circulating motion, and the temperature stability of the upper flexible conveyor belt is kept. Similarly, the lower flexible conveyor belt drives the roller heating temperature control device and the lower flexible conveyor belt tensioning roller heating temperature control device, so that the lower flexible conveyor belt can continuously and stably obtain energy input in the circulating motion, and the temperature stability of the lower flexible conveyor belt is kept. The high temperature stability of the upper flexible conveyor belt and the lower flexible conveyor belt also means the temperature stability of the welded body during welding. The method is more beneficial to maintaining the welding temperature and keeping the uniformity and stability of each welding point.
The temperatures of the upper flexible conveyor belt and the lower flexible conveyor belt can be respectively set between 50 ℃ and 500 ℃. Such a temperature setting can accommodate most welding requirements; the temperature setting requirement of the upper flexible conveyor belt is consistent with the temperature setting requirement of the upper hot pressing assembly; the temperature setting requirement of the lower flexible conveyor belt is consistent with the temperature setting requirement of the lower hot-pressing assembly; the temperature setting of the upper flexible conveyor belt may be independent of the temperature setting of the lower flexible conveyor belt; namely, the temperature of the upper hot pressing assembly and the temperature of the lower hot pressing assembly can be set to different temperatures so as to adapt to the same welding positions contacted with the upper hot pressing assembly and the lower hot pressing assembly respectively; the temperature of the upper flexible conveyor belt and the temperature of the lower flexible conveyor belt may be set to different temperatures to accommodate the same weld sites with which they are in contact.
In some embodiments of a thermal compression reflow soldering method for soldering a micro-spaced LED chip, which are not shown in the drawings, the method comprises steps a, B and C.
In the step A, an upper flexible conveyor belt and an upper flexible conveyor belt which rotate continuously in the same direction are oppositely arranged at intervals. In the step A, the width of the upper flexible conveyor belt and the width of the lower flexible conveyor belt are set to be 50-1000mm, and the thickness of the upper flexible conveyor belt and the thickness of the lower flexible conveyor belt are set to be 1-3 mm. In the step A, a step of heating the upper flexible conveyor belt by utilizing an upper flexible conveyor belt driving roller heating temperature control device and an upper flexible conveyor belt tensioning roller heating temperature control device is also included; the upper flexible conveyor belt drives the roller heating temperature control device to output heat energy to the upper flexible conveyor belt driving roller and control the temperature of the upper flexible conveyor belt driving roller; the upper flexible conveyor belt tensioning roller heating temperature control device outputs heat energy to the upper flexible conveyor belt tensioning roller and controls the temperature of the upper flexible conveyor belt tensioning roller; two ends of the upper flexible conveyor belt are respectively sleeved with the upper flexible conveyor belt driving roller and the upper flexible conveyor belt tensioning roller, and heat energy is obtained from the upper flexible conveyor belt driving roller and the upper flexible conveyor belt tensioning roller.
In the step A, a step of heating the lower flexible conveyor belt by utilizing a lower flexible conveyor belt driving roller heating temperature control device and a lower flexible conveyor belt tensioning roller heating temperature control device is also included; the lower flexible conveyor belt driving roller heating temperature control device outputs heat energy to the lower flexible conveyor belt driving roller and controls the temperature of the lower flexible conveyor belt driving roller; the lower flexible conveyor belt tensioning roller heating temperature control device outputs heat energy to the lower flexible conveyor belt tensioning roller and controls the temperature of the lower flexible conveyor belt tensioning roller; two ends of the lower flexible conveyor belt are respectively sleeved with the lower flexible conveyor belt driving roller and the lower flexible conveyor belt tensioning roller, and heat energy is obtained from the lower flexible conveyor belt driving roller and the lower flexible conveyor belt tensioning roller.
The materials of the upper flexible conveyor belt and the lower flexible conveyor belt comprise flexible heat conduction materials such as metal, plastic and the like.
In the step B, an upper hot-pressing assembly and a lower hot-pressing assembly are oppositely arranged at intervals; the upper hot pressing assembly is arranged above the upper flexible conveying belt; the lower hot pressing assembly is arranged below the lower flexible conveying belt;
in the step B: the temperatures of the upper hot-pressing assembly and the lower hot-pressing assembly can be respectively set between 50 ℃ and 500 ℃. The distance between the upper hot-pressing assembly and the lower hot-pressing assembly can be adjusted; or the distance between the upper hot-pressing assembly and the lower hot-pressing assembly is set to be less than 10 mm.
In the step B: the upper hot-pressing assembly comprises an upper hot-pressing temperature control device and an upper hot-pressing main body; the upper hot-pressing temperature control device is connected with the upper hot-pressing main body, outputs heat energy to the upper hot-pressing main body and controls the temperature of the upper hot-pressing main body; the lower hot-pressing assembly comprises a lower hot-pressing temperature control device and a lower hot-pressing main body; the lower hot-pressing temperature control device is connected with the lower hot-pressing main body, outputs heat energy to the lower hot-pressing main body and controls the temperature of the lower hot-pressing main body.
In the step B: the method also comprises the step of adjusting the distance between the upper hot-pressing assembly and the lower hot-pressing assembly by utilizing the first thickness gauge and the second thickness gauge; two ends of one side of the upper hot pressing assembly, which is opposite to the lower hot pressing assembly, are respectively connected through a first thickness gauge; the vertical distance between one side of the upper hot-pressing assembly and the corresponding side of the lower hot-pressing assembly is called as a first distance; the two first thickness gauges are used for adjusting the size of the first distance and limiting the thickness of the first distance; two ends of the opposite sides of the upper hot pressing assembly and the lower hot pressing assembly are respectively connected through a second thickness gauge; the vertical distance between the other side of the upper hot-pressing assembly and the other side of the lower hot-pressing assembly is called as a second distance; the two second thickness gauges are used for adjusting the size of the second distance and limiting the thickness of the second distance; the adjustment range of the first and second pitches is 0.100-10.000 mm.
In step C, the welded body is held between the upper flexible conveyor belt and the upper flexible conveyor belt in motion, and reflow welding of direct hot-pressing heat conduction is performed through a space between the upper hot-pressing assembly and the lower hot-pressing assembly.
In the hot-pressing reflow soldering device and the method for soldering the micro-space LED chip, an upper hot-pressing assembly and a lower hot-pressing assembly are arranged oppositely and at intervals; the upper hot pressing assembly is arranged above the upper flexible conveying belt; the lower hot pressing assembly is arranged below the lower flexible conveying belt; the upper flexible conveyor belt control device is connected with the upper flexible conveyor belt and controls the upper flexible conveyor belt to rotate circularly; the lower flexible conveyor belt control device is connected with the lower flexible conveyor belt and controls the lower flexible conveyor belt to rotate circularly; the upper flexible conveyor belt and the lower flexible conveyor belt are oppositely arranged at intervals; the upper flexible conveying belt and the lower flexible conveying belt clamp the welded main body in the movement together, so that the welded main body passes through a space between the upper hot pressing assembly and the lower hot pressing assembly. The upper surface and the lower surface of the welded main body can be directly conducted with heat conduction, the heat conduction efficiency in welding is improved, the welding heating time is shortened, and the welding yield is improved.
In the present application, the first and second names of the respective components are only for name distinction and do not represent temporal or spatial sequence relationships.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the contents of the specification and the drawings, or applied directly or indirectly to other related technical fields, are included in the scope of the present invention.

Claims (18)

1. A hot-pressing reflow soldering device for soldering a micro-space LED chip is characterized in that,
the reflow soldering device comprises a reflow soldering device main body, an upper flexible conveyor belt control device, an upper flexible conveyor belt, an upper hot pressing assembly, a lower flexible conveyor belt control device, a lower flexible conveyor belt and a lower hot pressing assembly;
the upper hot pressing assembly and the lower hot pressing assembly are respectively fixedly connected with the reflow soldering device main body;
the upper hot-pressing assembly and the lower hot-pressing assembly are arranged oppositely and at intervals;
the upper hot pressing assembly is arranged above the upper flexible conveying belt;
the lower hot pressing assembly is arranged below the lower flexible conveying belt;
the upper flexible conveyor belt control device is connected with the upper flexible conveyor belt and controls the upper flexible conveyor belt to rotate circularly;
the lower flexible conveyor belt control device is connected with the lower flexible conveyor belt and controls the lower flexible conveyor belt to rotate circularly;
the upper flexible conveyor belt and the lower flexible conveyor belt are oppositely arranged at intervals; the upper flexible conveying belt and the lower flexible conveying belt clamp the welded main body in the movement together, so that the welded main body moves to penetrate through the space between the upper hot pressing assembly and the lower hot pressing assembly.
2. The thermal compression reflow soldering apparatus for micro pitch LED chip soldering according to claim 1,
the distance between the upper hot-pressing assembly and the lower hot-pressing assembly can be adjusted;
or the distance between the upper hot-pressing assembly and the lower hot-pressing assembly is set to be less than 10 mm.
3. The thermal compression reflow soldering apparatus for micro pitch LED chip soldering according to claim 1,
the upper hot-pressing assembly comprises an upper hot-pressing temperature control device and an upper hot-pressing main body;
the upper hot-pressing temperature control device is connected with the upper hot-pressing main body, outputs heat energy to the upper hot-pressing main body and controls the temperature of the upper hot-pressing main body;
the temperature of the upper hot-pressing assembly is set between 50 and 500 ℃.
4. The thermal compression reflow soldering apparatus for micro pitch LED chip soldering according to claim 3,
the lower hot-pressing assembly comprises a lower hot-pressing temperature control device and a lower hot-pressing main body;
the lower hot-pressing temperature control device is connected with the lower hot-pressing main body and outputs heat energy to the lower hot-pressing main body and controls the temperature of the lower hot-pressing main body;
the temperature of the lower hot-pressing assembly is set between 50 and 500 ℃.
5. The thermal compression reflow soldering apparatus for micro pitch LED chip soldering according to claim 4,
the upper hot-pressing assembly also comprises an upper hot-pressing pressure control device;
the upper hot-pressing pressure control device is connected with the upper hot-pressing main body, the upper hot-pressing pressure control device outputs downward acting force to the upper hot-pressing main body, and the downward pressure range of the acting force is 0.5-5 MPa; the upper hot-pressing pressure control device controls the distance between the upper hot-pressing main body and the lower hot-pressing main body.
6. The thermal compression reflow soldering apparatus for micro pitch LED chip soldering according to claim 5,
the lower hot-pressing assembly also comprises a lower hot-pressing pressure control device;
the lower hot-pressing pressure control device is connected with the lower hot-pressing main body and outputs an upward acting force to the lower hot-pressing main body, and the upward pressure range of the acting force is 0.5-5 MPa; the lower hot-pressing pressure control device controls the distance between the lower hot-pressing main body and the upper hot-pressing main body;
or the lower hot-pressing pressure control device and the upper hot-pressing pressure control device jointly control the distance between the lower hot-pressing main body and the upper hot-pressing main body.
7. The thermal compression reflow soldering apparatus for micro pitch LED chip soldering according to claim 6,
the upper hot-pressing main body and/or the lower hot-pressing main body are flat-plate type hot-pressing plates;
the upper hot-pressing pressure control device can press the upper flexible conveyor belt down after adjusting the distance between the upper hot-pressing assembly and the lower hot-pressing assembly, so that when the upper flexible conveyor belt passes through the distance between the upper hot-pressing assembly and the lower hot-pressing assembly, the upper flexible conveyor belt has less than or equal to 5 relative to the horizontal directionoThe included angle of (a).
8. The thermal compression reflow soldering apparatus for micro pitch LED chip soldering according to claim 1,
the device also comprises two first thickness gauges and two second thickness gauges;
two ends of one side of the upper hot pressing assembly, which is opposite to the lower hot pressing assembly, are respectively connected through a first thickness gauge;
the vertical distance between one side of the upper hot-pressing assembly and the corresponding side of the lower hot-pressing assembly is called as a first distance; the two first thickness gauges are used for adjusting the size of the first distance and limiting the thickness of the first distance;
two ends of the opposite sides of the upper hot pressing assembly and the lower hot pressing assembly are respectively connected through a second thickness gauge;
the vertical distance between the other side of the upper hot-pressing assembly and the other side of the lower hot-pressing assembly is called as a second distance; the two second thickness gauges are used for adjusting the size of the second distance and limiting the thickness of the second distance;
the adjustment range of the first and second pitches is 0.100-10.000 mm.
9. The thermal compression reflow soldering apparatus for micro pitch LED chip soldering according to claim 1,
the width of the upper flexible conveyor belt and the width of the lower flexible conveyor belt are set between 50 mm and 1000 mm;
the thickness of the upper flexible conveyor belt and the lower flexible conveyor belt is set between 1mm and 3 mm.
10. The thermal compression reflow soldering apparatus for micro pitch LED chip soldering according to claim 1,
the upper flexible conveyor belt control device comprises an upper flexible conveyor belt driving roller, an upper flexible conveyor belt tensioning roller and an upper flexible conveyor belt tensioning device; two ends of an upper flexible conveyor belt which is closed into a ring shape are respectively sleeved on an upper flexible conveyor belt driving roller and an upper flexible conveyor belt tensioning roller; the upper flexible conveyor belt driving roller drives the upper flexible conveyor belt to move when being driven to rotate; the upper flexible conveyor belt tensioning device controls an upper flexible conveyor belt tensioning roller, and the tensioning state of the upper flexible conveyor belt is adjusted by the upper flexible conveyor belt tensioning roller;
the lower flexible conveyor belt control device comprises a lower flexible conveyor belt driving roller, a lower flexible conveyor belt tensioning roller and a lower flexible conveyor belt tensioning device; two ends of a lower flexible conveyor belt which is closed into a ring shape are respectively sleeved on a lower flexible conveyor belt driving roller and a lower flexible conveyor belt tensioning roller; the lower flexible conveyor belt driving roller drives the lower flexible conveyor belt to move when being driven to rotate; the lower flexible conveyor belt tensioning device controls the lower flexible conveyor belt tensioning roller, and the tensioning state of the lower flexible conveyor belt is adjusted by the lower flexible conveyor belt tensioning roller.
11. The thermal compression reflow soldering apparatus for micro pitch LED chip soldering according to claim 10,
the device is also provided with an upper flexible conveyor belt driving roller heating temperature control device, an upper flexible conveyor belt tensioning roller heating temperature control device, a lower flexible conveyor belt driving roller heating temperature control device and a lower flexible conveyor belt tensioning roller heating temperature control device;
the upper flexible conveyor belt drives the roller heating temperature control device to output heat energy to the upper flexible conveyor belt driving roller and control the temperature of the upper flexible conveyor belt driving roller; the upper flexible conveyor belt tensioning roller heating temperature control device outputs heat energy to the upper flexible conveyor belt tensioning roller and controls the temperature of the upper flexible conveyor belt tensioning roller; two ends of the upper flexible conveyor belt are respectively sleeved with the upper flexible conveyor belt driving roller and the upper flexible conveyor belt tensioning roller, and heat energy is obtained from the upper flexible conveyor belt driving roller and the upper flexible conveyor belt tensioning roller;
the lower flexible conveyor belt driving roller heating temperature control device outputs heat energy to the lower flexible conveyor belt driving roller and controls the temperature of the lower flexible conveyor belt driving roller; the lower flexible conveyor belt tensioning roller heating temperature control device outputs heat energy to the lower flexible conveyor belt tensioning roller and controls the temperature of the lower flexible conveyor belt tensioning roller; two ends of the lower flexible conveyor belt are respectively sleeved with a lower flexible conveyor belt driving roller and a lower flexible conveyor belt tensioning roller, and heat energy is obtained from the lower flexible conveyor belt driving roller and the lower flexible conveyor belt tensioning roller;
the temperatures of the upper flexible conveyor belt and the lower flexible conveyor belt are respectively set between 50 ℃ and 500 ℃.
12. A hot-pressing reflow soldering method for soldering a micro-space LED chip is characterized by comprising the following steps,
step A: the upper flexible conveyor belt and the lower flexible conveyor belt which rotate continuously in the same direction are oppositely arranged at intervals;
and B: the upper hot-pressing assembly and the lower hot-pressing assembly are oppositely arranged at intervals; the upper hot pressing assembly is arranged above the upper flexible conveying belt; the lower hot pressing assembly is arranged below the lower flexible conveying belt;
and C: the welded main body is clamped between the upper flexible conveying belt and the lower flexible conveying belt in motion, and reflow welding capable of realizing double-sided direct hot-pressing heat conduction is carried out through the space between the upper hot-pressing assembly and the lower hot-pressing assembly.
13. The thermal compression reflow soldering method for micro pitch LED chip soldering according to claim 12,
in the step B: the distance between the upper hot pressing assembly and the lower hot pressing assembly is adjustable;
or the distance between the upper hot-pressing assembly and the lower hot-pressing assembly is set to be less than 10 mm.
14. The thermal compression reflow soldering method for micro pitch LED chip soldering according to claim 12,
in the step B:
the upper hot-pressing assembly comprises an upper hot-pressing temperature control device and an upper hot-pressing main body;
the upper hot-pressing temperature control device is connected with the upper hot-pressing main body, outputs heat energy to the upper hot-pressing main body and controls the temperature of the upper hot-pressing main body; the temperature of the upper hot-pressing assembly is set between 50 and 500 ℃;
the lower hot-pressing assembly comprises a lower hot-pressing temperature control device and a lower hot-pressing main body;
the lower hot-pressing temperature control device is connected with the lower hot-pressing main body and outputs heat energy to the lower hot-pressing main body and controls the temperature of the lower hot-pressing main body;
the temperature of the lower hot-pressing assembly is set between 50 and 500 ℃.
15. The thermal compression reflow soldering method for micro pitch LED chip soldering according to claim 14,
the upper hot-pressing assembly also comprises an upper hot-pressing pressure control device;
the upper hot pressing pressure control device is connected with the upper hot pressing main body, outputs a downward acting force to the upper hot pressing main body, and controls the distance between the upper hot pressing main body and the lower hot pressing main body.
16. The thermal compression reflow soldering method for micro pitch LED chip soldering according to claim 15,
the lower hot-pressing assembly also comprises a lower hot-pressing pressure control device;
the lower hot-pressing pressure control device is connected with the lower hot-pressing main body, outputs upward acting force to the lower hot-pressing main body and controls the distance between the lower hot-pressing main body and the upper hot-pressing main body;
or the lower hot-pressing pressure control device and the upper hot-pressing pressure control device jointly control the distance between the lower hot-pressing main body and the upper hot-pressing main body.
17. The thermal compression reflow soldering method for micro pitch LED chip soldering according to claim 15,
in the step B: the method also comprises the step of adjusting the distance between the upper hot-pressing assembly and the lower hot-pressing assembly by utilizing the first thickness gauge and the second thickness gauge;
two ends of one side of the upper hot pressing assembly, which is opposite to the lower hot pressing assembly, are respectively connected through a first thickness gauge; the vertical distance between one side of the upper hot-pressing assembly and the corresponding side of the lower hot-pressing assembly is called as a first distance; the two first thickness gauges are used for adjusting the size of the first distance and limiting the thickness of the first distance;
two ends of the opposite sides of the upper hot pressing assembly and the lower hot pressing assembly are respectively connected through a second thickness gauge;
the vertical distance between the other side of the upper hot-pressing assembly and the other side of the lower hot-pressing assembly is called as a second distance; the two second thickness gauges are used for adjusting the size of the second distance and limiting the thickness of the second distance;
the adjustment range of the first and second pitches is 0.100-10.000 mm.
18. The thermal compression reflow soldering method for micro pitch LED chip soldering according to claim 12,
in the step A, the width of the upper flexible conveyor belt and the width of the lower flexible conveyor belt are set between 50 mm and 1000mm, and the thickness of the upper flexible conveyor belt and the thickness of the lower flexible conveyor belt are set between 1mm and 3 mm;
in the step A, a step of heating the upper flexible conveyor belt by utilizing an upper flexible conveyor belt driving roller heating temperature control device and an upper flexible conveyor belt tensioning roller heating temperature control device is also included;
the upper flexible conveyor belt drives the roller heating temperature control device to output heat energy to the upper flexible conveyor belt driving roller and control the temperature of the upper flexible conveyor belt driving roller; the upper flexible conveyor belt tensioning roller heating temperature control device outputs heat energy to the upper flexible conveyor belt tensioning roller and controls the temperature of the upper flexible conveyor belt tensioning roller; two ends of an upper flexible conveyor belt which is closed into a ring shape are respectively sleeved with an upper flexible conveyor belt driving roller and an upper flexible conveyor belt tensioning roller, and heat energy is obtained from the upper flexible conveyor belt driving roller and the upper flexible conveyor belt tensioning roller;
the temperature of the upper flexible conveyor belt is set between 50 and 500 ℃;
in the step A, a step of heating the lower flexible conveyor belt by utilizing a lower flexible conveyor belt driving roller heating temperature control device and a lower flexible conveyor belt tensioning roller heating temperature control device is also included;
the lower flexible conveyor belt driving roller heating temperature control device outputs heat energy to the lower flexible conveyor belt driving roller and controls the temperature of the lower flexible conveyor belt driving roller; the lower flexible conveyor belt tensioning roller heating temperature control device outputs heat energy to the lower flexible conveyor belt tensioning roller and controls the temperature of the lower flexible conveyor belt tensioning roller; two ends of a lower flexible conveyor belt which is closed into a ring shape are respectively sleeved with a lower flexible conveyor belt driving roller and a lower flexible conveyor belt tensioning roller, and heat energy is obtained from the lower flexible conveyor belt driving roller and the lower flexible conveyor belt tensioning roller;
the temperature of the lower flexible conveyor belt is set between 50-500 ℃.
CN202110974253.9A 2021-08-24 2021-08-24 Hot-pressing backflow device and method for micro-space LED chip welding Pending CN113579392A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114986193A (en) * 2022-08-03 2022-09-02 佳辰地板常州有限公司 Production line of grid floor for microcomputer room

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114986193A (en) * 2022-08-03 2022-09-02 佳辰地板常州有限公司 Production line of grid floor for microcomputer room
CN114986193B (en) * 2022-08-03 2022-12-09 佳辰地板常州有限公司 Gridding floor production line for microcomputer room

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