JPH03294059A - Soldering device - Google Patents

Abstract

PURPOSE:To stably execute soldering without giving any damage by vertically shifting a soldering iron with a cylinder, adjusting this shifting distance with a stopper and bringing only solder layer formed at tip part of the soldering iron into contact with a member to be soldered. CONSTITUTION:The soldering iron 1 composed of metal having good heat conductivity is connected with the cylinder 9 through a supporting plate 10 and this shifting distance is adjusted with the stopper 11. On the above soldering iron 1, plating layer 2 for preventing oxidation is arranged and also at the tip part thereof, the solder layer 3 is formed. At the time of executing the soldering to an integrated circuit substrate 4 with a soldering apparatus, the tip part of soldering iron 1 is not brought into contact with the substrate 4 for member to be soldered, but only the above solder layer 3 is made to contact. By this method, ths soldering with high reliability is executed without damaging the substrate 4 and the service life at the tip part of soldering iron is prolonged.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is an apparatus for automatically soldering a lead frame onto an electric board coated with cream solder in a hybrid integrated circuit board, etc. Soldering that does not cause damage and is effective in extending the life of the soldering iron tip is related to equipment.

2. Description of the Related Art Conventionally, this type of soldering is performed by printing on electrodes 23 provided on the upper surface of an integrated circuit board 22 on which electronic components 21 are mounted, as shown in FIGS. 3 and 4. Place the lead frame 25 on the solder cream solder 24,
Liquid flux 26 is applied and soldered.

Also, Figure 6 and W! In the conventional soldering device shown in FIG. 6, 27 is a cylinder, 28 is a heater block, and the heater block 28 is directly connected to the cylinder 27 by a support plate 29. A soldering iron tip of 3° is attached to both ends of this heater block 28. A stopper 31 is configured to adjust the amount of movement of the soldering iron tip 30.

Next, its operation will be explained. As shown in FIG. 5, the pressure of the cylinder 27 is applied to the soldering iron tip 3o by the support plate 29, so if an excessive force of the arrow of the cylinder 27 is applied to the cream solder 24, the electrode 23 may peel off. There is a possibility that cracks or chips may occur in the integrated circuit board 22.

The stopper 31 stops the electric FM 2 when the force of the arrow from the cylinder 27 is applied to the electrode 23 via the cream solder 24.
This is provided to prevent 3 from being cut.

Problems to be Solved by the Invention However, in the above configuration, the cream solder 2
Due to variations in the amount of the soldering iron tip 3° and improper attachment of the soldering iron tip 3°, the force is not necessarily uniformly applied to the integrated circuit board 22, and even if the soldering iron tip 31 is provided, the force applied to the electrode 23 There was a risk that peeling, chipping, cracking, etc. of the integrated circuit board 22 would occur.

In order to prevent this, the integrated circuit board 22 is
Considerations were made to control the parallelism of the solder tip 3o and to change the material of the solder tip 3o, but issues such as thermal conductivity and wear remained.

The present invention solves these problems, and aims to guarantee the quality of integrated circuit boards and improve the reliability of soldering.
It also aims to extend the life of the soldering iron tip.

Means for Solving the Problems In order to solve the above problems, the present invention provides a soldering iron made of a metal with good thermal conductivity connected by a cylinder and a support plate, and a stopper for adjusting the amount of movement of the soldering iron. A solder layer is formed on the tip of the soldering iron, and when soldering, the tip of the soldering iron does not contact the component to be soldered, but only the solder layer contacts the component. It is configured as follows.

Therefore, according to the present invention, the metal constituting the soldering iron and the lead frame do not come into direct contact with each other, so that there is no damage to the members being soldered. Further, since only the solder layer contacts the component to be soldered, good soldering can be achieved even if the amount of cream solder applied varies, and precision in mounting the soldering iron is not required. Furthermore, since a soldering iron with excellent thermal conductivity and a large heat capacity is used, the solder spreads well onto the components to be soldered, and stable soldering can be performed. As a result, no force is applied to tW and the substrate, resulting in cracks in the electrode and substrate.

This is something that can prevent such problems.

EXAMPLE Hereinafter, an example of the present invention will be described based on the drawings.

In Figures 1 and 2 (al, (b)), 1 is a soldering iron made of a metal with good thermal conductivity, and 2 is a plating layer provided on the entire surface of the soldering iron 1 to prevent oxidation. ,
3 is a solder layer formed on the tip of the soldering iron 1 from above the plating layer 2, 4 is an integrated circuit board, 5 is an electrode, 6 is cream solder printed on one pole 6, 7 is an electronic component, 8 is a lead frame that is placed on cream solder e and soldered, 9
is the cylinder that drives the soldering iron 1, and 1o is the cylinder 9
A support plate 11 connecting the soldering iron 1 and the soldering iron 1 is a stopper for preventing the tip of the soldering iron 1 from coming into contact with the lead frame 8.

Next, its operation will be explained.

The soldering iron 1 is driven vertically by a cylinder 9 via a support plate 1o. The position of the bottom dead center of the handle 1 is fixed by a stopper 11 with a gap of about 0.6H equal to the thickness of the lead frame 8 from above [i5].

In addition, when the soldering iron 1 is at the bottom dead center position of the support plate 1o,
The solder tip 1 and the cylinder 9 are provided so that they are not connected. Therefore, soldering is sometimes
Since only the solder layer 3 formed at the tip of the solder tip 1 contacts the lead frame 8 and is soldered without contacting the electrode 5 or the integrated circuit board 4, the thrust of the cylinder 9 is not affected. It is possible to reliably perform stable soldering.

As described above, according to this embodiment, stable soldering can be performed without being affected by variations in the cream solder 6, and therefore the soldering iron 1 can be accurately parallel to the integrated circuit board 4. There is no need to install it.

Note that since there is no contact between the soldering iron 1 and the lead frame 8, the life of the soldering iron 1 can be maintained for a long time.

Furthermore, since the solder layer 3 has excellent thermal conductivity, the solder layer 3
If the applied amount of the cream solder 6 printed on the top is small, it is replenished, and if it is large, it is sucked up to the solder layer 3, so that soldering can always be performed under constant conditions.
Soldering has the effect of reducing defects.

Effects of the Invention As described above, according to the present invention, the tip of the soldering iron is prevented from coming into contact with the t-pole and the integrated circuit board, so that the soldering iron is not affected by the thrust of the cylinder and is reliably stabilized. Soldering can be performed, electrical connections and integrated circuit boards can be prevented from being cut, chipped or cracked, and the life of the soldering iron can be extended.

Furthermore, because the heat capacity of the solder is large, it is possible to always solder under constant conditions, and when soldering objects such as electrodes on lead frames and integrated circuit boards, the solder surrounds the components better, making it easier to solder. This also has the effect of reducing defects.

[Brief explanation of drawings]

Fig. 1 shows a front view of the device for soldering in one embodiment of the present invention, Fig. 2(a) shows a perspective view of the soldering iron of the device, and Fig. 2(b) shows soldering in the same embodiment. and a cross-sectional view of the main parts of the integrated circuit board, tI! ! , 3 is an external perspective view showing the structure of an integrated circuit board and a lead frame, FIG. 4 is a side view of the same, FIG. 6 is a front view of a conventional soldering device, and FIG. 6 is a side view of the same.

Claims (1)

[Claims] It consists of a soldering iron made of a metal with good thermal conductivity connected by a cylinder and a support plate, and a stopper that adjusts the amount of movement of the soldering iron, and a solder layer is formed on the tip of the soldering iron. . A soldering device configured such that the tip of the soldering iron does not come into contact with the soldering object when soldering, and only the solder layer comes into contact with the soldering object.