JPS61289968A - Multi-terminal simultaneous joining device for flat lead parts - Google Patents

Abstract

PURPOSE:To obtain an averaged temp. on the working surface of a heating chip by attaching plural pieces of thermocouples to the chip and by stopping the supply of electric power, detaching the chip from terminals and again repeating the previous operation when the temp. difference detected with each thermocouple is above the set value. CONSTITUTION:The thermocouples 11-13 are attached to the plural points of the chip 10 and the chip 10 is pressed onto the terminals 15 of multi-terminal parts to be joined to a printed circuit board 14. The current is supplied to the chip to heat the same when the prescribed pressure is attained. The conduction of the current to the chip 10 is stopped and after the chip 10 is once detached from the terminals to be connected, the previous operation is again repeated when the temp. differences of the thermocouples 11-13 are above the set values. The multiple terminals of the flat lead parts are thereby simultaneously and surely joined.

Description

[Detailed Description of the Invention] [Summary] When a large number of leads of an electronic component with flat leads are simultaneously pressure bonded and heated to a pattern on a printed circuit board, a plurality of thermocouples are attached to the heating chip, and each thermocouple is If the detected temperature difference is greater than the set value, the bonding quality can be improved by stopping heating, retrying, or correcting the tilt of the chip.

[Industrial application field]

The present invention relates to a multi-terminal simultaneous bonding device for simultaneously bonding a large number of leads of an electronic component with flat leads to patterns on a printed circuit board.

BACKGROUND ART Conventionally, for example, in the manufacturing process of electronic equipment, a flow-through method has been adopted in which an LSI is mounted on a printed circuit board and a large number of leads of the LSI are simultaneously thermally welded.

[Conventional technology]

In such a flow type, a bonding apparatus as shown in FIG. 5 is usually used. In this apparatus, a bonding head 3 consisting of a reflow chip 1 and a chip support rod 2 is raised or lowered by a control device (not shown), while the chip 1 is heated by applying electric power via a wire 4. A printed circuit board 5 is arranged below the chip 1, and this printed circuit board 5 is similarly supported on a support stand of a control device (not shown) and is driven and controlled in the X and Y directions.

For example, an LSI element 6 to be mounted on the printed circuit board 5 is placed on the printed wiring 7 with the LSI board 8 facing the printed circuit board 5. In the state shown in FIG. 5, the chip 1 descends onto the leads 8 and presses them, and at this time, for example, the solder that has been fixed on the leads 8 in advance melts and all the leads 8 are aligned.
are welded to the printed wiring 7 at the same time.

[Problem that the invention seeks to solve]

However, in general, the surface of the printed circuit board 5 is not uniformly flat, and therefore the lower surface of the chip and the surface of the printed circuit board facing it are not necessarily parallel. There was a problem in that when the chips were pressed together, part of the chip did not come into contact with the leads, making it difficult to heat all the leads uniformly.

The present invention was created in view of these points.
The object of the present invention is to provide a multi-terminal simultaneous bonding device for flat lead components that can uniformly heat and connect all leads.

Means for Solving Problem c] For this reason, the present invention includes a head that has a chip equipped with a thermocouple for temperature feedback and that makes the pressing force of the chip variable, and a head that is provided with a resistive heating current to the chip. In this multi-terminal simultaneous bonding device, thermocouples 11 are installed at multiple locations on the chip 10.
, 12.13, press the chip 10 to the terminal to be connected, and calculate the temperature difference between each thermocouple while supplying current to the chip lO and heating it, and if the difference is greater than the set value. If so, the current supply to the chip 10 is stopped, the chip 10 is once removed from the terminal, and then the above operation is repeated again.

The present invention also provides a head having a tip equipped with a thermocouple for temperature feedback and variable pressing force on the tip, and a head capable of supplying current for resistive heating to the tip, and controlling the temperature and heating time of the tip. In a multi-terminal simultaneous bonding device consisting of a power supply device equipped with a control device capable of controlling arbitrary set values, thermocouples 11, 1 are installed at multiple locations on the chip IO.
2. Attach 13, press the chip 10 to the terminal to be connected, and calculate the temperature difference between each thermocouple while supplying current to the chip 10 and heating it, and if the difference is greater than the set value. Another feature is that the tilt of the chip 10 is adjusted.

[For production]

When the temperature difference between thermocouples attached to multiple locations on the chip exceeds the set value, turn off the power, move the chip away from the terminal to which it should be connected, and then try again, or adjust the tilt of the chip. An average temperature can be obtained over the entire chip working surface, making it possible to improve the quality of simultaneous multi-terminal bonding.

〔Example〕

1 and 2 are diagrams for explaining a first embodiment of the present invention, in which FIG. 1 is a configuration diagram and FIG. 2 is a flowchart diagram for explaining the operation.

In this embodiment, as shown in FIG.
Attach thermocouples 11, 12.13 to the terminals (three locations in the figure), calculate the temperature difference between these thermocouples 11, 12, 13 when connecting the terminals, and if the value exceeds the set value, send the temperature to the chip 10. Turn off the power and keep it away from the terminal to be connected.
．． The structure is such that the joining operation is performed again after the bonding process has been completed (approximately 1 to 0.5 times).

The operation of this embodiment configured in this way is illustrated in FIGS. 1 to 3.
This will be explained using figures.

First, as shown in FIG. 1, the chip 10 is pressed onto the terminal 15 of the multi-terminal component to be bonded to the printed board 14. When a predetermined pressure is reached, the chip 10 is pressed through the current supply 1116.
Current is supplied to 0. At this time, the temperature of the chip 10 is
As shown in FIG. 3, each thermocouple 11, 12, 13 may have a different temperature. In this case, when the temperature difference T1 or T2 exceeds the set value, turn off the power to the chip 10 and remove it from the terminal 15, and perform the above operation again until the temperature difference T+, Tz becomes within the set value. Repeat. (
However, if the temperature difference condition is not satisfied even after repeating the process several times, an alarm is raised and the device is stopped because there is another problem. ) In this way, simultaneous multi-terminal bonding can be performed reliably.

FIG. 4 is a diagram for explaining a second embodiment of the present invention, in which a is a front view and b is a cross-sectional view taken along line bb in diagram a.

In this embodiment, thermocouples 11°, 12,
13 is the same as in the previous embodiment, and furthermore, the chip 10 is supported by the rotating shaft 20, and the chip 10 is
It is made rotatable by a pair of wires 21 and 22 fixed on the left and right sides of the thermocouple, and the temperature difference between the thermocouples lL12.
When the value exceeds the set value, wire 21.22
The structure is such that the tilt of the chip can be adjusted by driving.

Next, the operation of this embodiment will be explained.

First, as shown in FIG. 4, a chip 10 is pressed onto a terminal 15 of a multi-terminal component to be bonded to a printed board 14, and when a predetermined pressing force is reached, a current is supplied and the chip is heated. At this time, if the temperature difference between the thermocouples 11, 12, and 13 exceeds the set value, the wires 21 and 22 are driven after stopping the power supply to the chip 10, or the wires 21 and 22 are driven while they are being supplied.
The inclination of the tip 10 is adjusted so that the tip 10 contacts the tip 5 uniformly.

In this way, simultaneous multi-terminal bonding can be performed reliably.

〔Effect of the invention〕

As described above, according to the present invention, simultaneous multi-terminal bonding of flat lead components can be reliably performed with an extremely simple configuration, and is extremely useful in practice.

[Brief explanation of the drawing]

Fig. 1 is a configuration diagram showing a first embodiment of the present invention, Fig. 2 is a flow chart diagram of the first embodiment of the present invention, and Fig. 3 is a temperature one-hour curve diagram of a chip according to an embodiment of the present invention. FIG. 4 is a diagram for explaining a second embodiment of the present invention, and FIG. 5 is a diagram showing a conventional bonding apparatus used in a beam-flow one-way type. In FIGS. 1 and 4, 10 is a chip, 11, 12, and 13 are thermocouples, 14 is a printed board, 15 is a terminal, 16 is a current supply line, 20 is a rotating shaft, and 21.22 is a wire. Figure 3 (a) (b) Temperature one-hour curve diagram of the chip according to the embodiment of the present invention (b) Figure 4 for explaining the second embodiment of the present invention 10... Chip + Ij2j3... Thermocouple 14... Printed board 15... 1 terminal... H1 shaft suspension> - tV----μs officer to Goda Fart Tsunematsu

Claims (1)

[Scope of Claims] 1. A head having a chip equipped with a thermocouple for temperature feedback and capable of varying the pressing force of the chip, and a head capable of supplying current for resistance heating to the chip and controlling the temperature of the chip. In a multi-terminal simultaneous bonding device consisting of a power supply device equipped with a controller and a control device capable of controlling the heating time to an arbitrary set value, thermocouples (11, 12, 13
), press the chip (10) to the terminal to be connected, and calculate the temperature difference between each thermocouple while supplying current to the chip (10) and heating it, and if the difference is greater than the set value. If so, then the current supply to the chip (10) is stopped, the chip (10) is once separated from the terminal, and then the above operation is repeated again. Device. 2. A head that has a chip equipped with a thermocouple for temperature feedback and can vary the pressing force of the chip, and a head that can supply resistance heating current to the chip and that can set the temperature and heating time of the chip as desired. In a multi-terminal simultaneous bonding device consisting of a power supply device equipped with a control device that can control the set value, thermocouples (11, 12, 13) are installed at multiple locations on the chip (10).
), press the chip (10) to the terminal to be connected, and calculate the temperature difference between each thermocouple while supplying current to the chip (10) and heating it, and if the difference is greater than the set value. A multi-terminal simultaneous bonding device for flat lead components, characterized in that the device is configured to adjust the inclination of the chip (10).