JP2015136730A - heater chip polishing tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To polish a heater chip with an irregular shaped tip.SOLUTION: A heater chip polishing tool comprises: a jig 10 where a receiving surface facing an apical surface of a heater chip 1 has a shape that fits in the apical surface; and a polishing sheet 11 disposed between the heater chip 1 and the jig 10.

Description

  The present invention relates to a joining technique in which reflow soldering, thermocompression bonding, or the like is performed using a heater chip that heats an object to be joined while applying pressure, and particularly relates to a polishing tool that polishes the tip of a heater chip.

Conventionally, there has been a joining device that locally heats the object to be joined to perform thermocompression bonding of lead wires to thick film and thin film substrates and reflow soldering of IC leads to printed circuit boards. One method of local heating used in the apparatus is a pulse heat method.
In the pulse heat method, a pressure is applied to a workpiece by a heater chip made of a high resistance material such as molybdenum, a large pulse current is passed through the heater chip, and the workpiece is melted by Joule heat generated there. A bond is obtained. For example, the joining device detects the temperature of the heater chip with a thermocouple attached to the tip of the heater chip, and controls the current supplied to the heater chip so that the temperature becomes a preset temperature.

In such a joining apparatus, flux or the like adheres to the tip of the heater chip by repeated joining. If flux or the like adheres, the thermal conductivity is impaired, so it is necessary to periodically remove the deposits on the heater chip.
Conventionally, a heater chip polishing mechanism disclosed in Patent Document 1 has been proposed as means for polishing the tip of a heater chip. In the heater chip polishing mechanism disclosed in Patent Document 1, the wrapping paper is attached to a polishing stage provided in a part of the XY stage, the heater chip is lowered, and the XY table is brought into contact with the wrapping paper. The tip of the heater chip is polished by operating the.

Japanese Utility Model Publication No. 5-63040

  The heater chip polishing mechanism disclosed in Patent Document 1 corresponds to the case where the contact surface of the heater chip with the object to be joined is flat. However, the object to be joined is not necessarily flat. For example, as shown in FIG. 6, when the wires 102 are soldered to a plurality of pads 101 on the substrate 100 one by one, an object to be joined including the solder, the pads 101, and the wires 102 becomes a convex portion on the substrate 100. Therefore, in order to press and solder this object to be bonded, it is necessary to provide the recess 2 on the contact surface (lower surface) of the heater chip 1 with the object to be bonded. Thus, in the case of the heater chip 1 whose contact surface with the object to be joined is not flat, the heater chip polishing mechanism disclosed in Patent Document 1 cannot cope with it, and it is possible to remove the flux and the like attached to the recess 2 Can not.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a heater chip polishing tool capable of polishing a heater chip having an uneven tip.

The present invention is a heater chip polishing tool for polishing a heater chip provided with unevenness to hold an object to be joined on a tip surface, wherein a receiving surface facing the tip surface of the heater chip is fitted to the tip surface. It is comprised from a certain jig | tool and the polishing sheet arrange | positioned between the front end surface of the said heater chip | tip, and the receiving surface of the said jig | tool.
Moreover, one structural example of the heater chip polishing tool of the present invention further includes a fixing mechanism for fixing the polishing sheet to the jig.

In addition, one configuration example of the heater chip polishing tool of the present invention further includes a vertical mechanism capable of moving the heater chip in the vertical direction, a tip surface of the heater chip, and the tip surface of the heater chip with the polishing sheet interposed therebetween. And a stage capable of moving the jig in a direction perpendicular to the moving direction of the heater chip in a state where the receiving surface of the jig is fitted.
In addition, one configuration example of the heater chip polishing tool of the present invention further includes a displacement detection unit that detects a displacement amount in the height direction of the heater chip when the objects to be bonded are bonded by heating with the heater chip, When the amount of displacement detected by the displacement detector is below a predetermined threshold value, the top and bottom mechanisms and the stage are controlled so that the tip of the heater chip is sandwiched between the polishing sheets. And a controller that starts polishing of the tip surface of the heater chip by fitting the surface and the receiving surface of the jig and moving the jig.

In addition, according to one configuration example of the heater chip polishing tool of the present invention, a vertical mechanism capable of moving the heater chip in the vertical direction, and the jig is moved in a direction perpendicular to the moving direction of the heater chip. The polishing sheet is perpendicular to the moving direction of the heater chip in a state in which the stage, the tip surface of the heater chip, and the receiving surface of the jig are fitted with the polishing sheet interposed therebetween. And a transport mechanism that can be moved in any direction.
In addition, one configuration example of the heater chip polishing tool of the present invention further includes a displacement detection unit that detects a displacement amount in the height direction of the heater chip when the objects to be bonded are bonded by heating with the heater chip, When the amount of displacement detected by the displacement detector is below a predetermined threshold value, the top and bottom mechanisms and the stage are controlled so that the tip of the heater chip is sandwiched between the polishing sheets. And a controller that starts the polishing of the front end surface of the heater chip by fitting the surface and the receiving surface of the jig and moving the polishing sheet.

  According to the present invention, the tip of the heater chip is attached by pressing the jig against the heater chip in a state where the polishing sheet is disposed between the tip surface of the heater chip and the receiving surface of the jig and moving the jig. The kimono can be removed.

  In the present invention, more reliable polishing can be performed by providing a fixing mechanism for fixing the polishing sheet to the jig.

  Further, in the present invention, by providing a stage that can move the jig in a direction perpendicular to the moving direction of the heater chip, the tip surface of the heater chip can be polished by moving the stage.

  Further, in the present invention, by providing a transport mechanism that can move the polishing sheet in a direction perpendicular to the moving direction of the heater chip, the front surface of the heater chip can be polished by moving the transport mechanism.

  Further, in the present invention, by providing the displacement detection unit and the control unit, it is possible to automatically start the polishing of the tip surface of the heater chip without depending on the instruction of the worker.

1 is a perspective view of a heater chip polishing tool according to a first embodiment of the present invention. It is a figure explaining the grinding | polishing method which concerns on the 1st Embodiment of this invention. It is a side view which shows the fixing mechanism of the polishing sheet which concerns on the 1st Embodiment of this invention. It is a block diagram which shows the structure of the heater chip | tip polishing tool which concerns on the 2nd Embodiment of this invention. It is a block diagram which shows the structure of the heater chip | tip polishing tool which concerns on the 3rd Embodiment of this invention. It is a figure explaining the problem of the conventional heater chip grinding | polishing mechanism.

[First Embodiment]
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a heater chip polishing tool according to a first embodiment of the present invention.
In the heater chip polishing tool of the present embodiment, the receiving surface (upper surface) opposite to the front end surface (the contact surface with the object to be joined and the lower surface) of the heater chip 1 is shaped to fit the front end surface. It comprises a tool 10 and a polishing sheet 11 disposed between the heater chip 1 and the jig 10.

As described with reference to FIG. 6, a plurality of recesses 2 for holding the objects to be joined are formed on the tip surface of the heater chip 1.
The receiving surface of the jig 10 is provided with the same number of convex portions 12 as the concave portions 2 corresponding to the concave portions 2 on the tip surface of the heater chip 1. In this way, the jig 10 is adapted to be fitted to the heater chip 1. The heater chip 1 and the jig 10 are fitted to each other so that the jig 10 can be moved along a direction (Y direction in FIG. 1) orthogonal to the arrangement direction of the recesses 2 (X direction in FIG. 1). Is provided.

When the heater chip 1 is manufactured, if the heater chip 1 is cut out from a molybdenum plate with a wire cutter, the remainder of the plate comes out. This remaining portion may be used as the jig 10. In this way, the jig 10 having a receiving surface with the concavity and convexity opposite to the tip surface of the heater chip 1 can be easily manufactured. The heater chip 1 differs in the size of the unevenness of the tip surface depending on the type of the object to be joined. However, according to the manufacturing method as described above, the jig 10 fitted to the heater chip 1 can be easily manufactured.
As the abrasive sheet 11, for example, a commercially available wrapping film having abrasive particles coated on the surface can be used.

  In order to polish the tip surface of the heater chip 1, the jig 10 is pressed against the heater chip 1 with the polishing sheet 11 placed between the heater chip 1 and the jig 10 as shown in FIG. The jig 10 is moved along a direction orthogonal to the arrangement direction (Y direction in FIG. 1). In this way, flux and the like attached to the recess 2 of the heater chip 1 can be removed.

  In the present embodiment, since the jig 10 is manufactured from a plate from which the heater chip 1 is cut, the thickness of the jig 10 (t in FIG. 1) is equal to the thickness of the heater chip 1 (for example, about 2 mm). Although it is the same, the present invention is not limited to this, and the jig 10 may be thicker than the heater chip 1. In the present embodiment, the jig 10 is made of the same metal as the heater chip 1, but the present invention is not limited to this, and a resin jig 10 may be used.

  Further, in the present embodiment, the polishing sheet 11 is merely sandwiched between the heater chip 1 and the jig 10, but in order to perform more reliable polishing, the polishing sheet 11 is fixed as shown in FIG. The fixing mechanism 13 may be provided on the jig 10. Thereby, the polishing sheet 11 can be reliably moved according to the movement of the jig 10, and more effective polishing can be performed. As the fixing mechanism 13, for example, a mechanism that fixes the polishing sheet 11 with the end thereof sandwiched, or an adhesive tape is conceivable.

[Second Embodiment]
Next, a second embodiment of the present invention will be described. In the first embodiment, the worker moves the jig 10, but the jig 10 may be installed on the stage to move the stage. FIG. 4 is a block diagram showing a configuration of a heater chip polishing tool according to the second embodiment of the present invention. The same reference numerals are given to the same configurations as those in FIGS.

  The jig 10 of the present embodiment is an XY stage that can move in the arrangement direction (X direction) of the recesses 2 of the heater chip 1 and in the direction orthogonal to the arrangement direction (direction perpendicular to the paper surface of FIG. 4, FIG. 1Y direction). 14 is provided. The XY stage 13 includes a motor as a drive source.

  When the front end surface of the heater chip 1 is polished, the control unit 15 of the bonding apparatus moves the XY stage 14 in accordance with an instruction from the worker to move the jig 10 to a position directly below the heater chip 1. The positioning of the heater chip 1 and the jig 10 can be realized by an existing positioning technique by moving the XY stage 14. Then, the control unit 15 lowers the heater chip 1 by the vertical mechanism 16. Thereby, the front end surface of the heater chip 1 and the receiving surface of the jig 10 are fitted with the polishing sheet 11 sandwiched therebetween, and the state shown in FIG. 2 is obtained. The controller 15 moves the XY stage 14 along the Y direction in such a state. Thus, in the present embodiment, the tip surface of the heater chip 1 can be polished using the power of the motor that moves the XY stage 14.

The movement of the XY stage 14 may be stopped according to an instruction from the worker, or the control unit 15 may automatically stop the polishing when the polishing is performed for a predetermined time.
In the present embodiment, since the jig 10 is moved by the XY stage 14, it is desirable that the thickness of the jig 10 (t in FIG. 1) is thicker than that of the heater chip 1. Further, as described in the first embodiment, it is desirable to provide the jig 10 with a fixing mechanism for fixing the polishing sheet 11.

In the present embodiment, when the front end surface of the heater chip 1 is polished, the XY stage 14 is moved in accordance with an instruction from the worker. However, the present invention is not limited to this. It is also possible to automatically detect the maintenance timing for polishing the tip surface and automatically start polishing.
A displacement sensor (not shown) is provided in the vertical mechanism 16 of the heater chip 1 so that the displacement amount in the height direction (Z direction in FIG. 4) of the heater chip 1 that is joining the workpieces can be converted into an electrical signal. ing. The displacement detector 17 detects the amount of displacement in the height direction of the heater chip 1 based on the output of the displacement sensor.

  When soldering an object to be bonded as shown in FIG. 6, the controller 15 of the bonding apparatus moves the XY stage 14 on which the object is mounted to move the object to be moved to a position directly below the heater chip 1. Let Then, the control unit 15 lowers the heater chip 1 by the up-and-down mechanism 16, and applies current to the heater chip 1 from the power source 18 while pressurizing the object to be joined by the heater chip 1 to melt the solder.

  When a predetermined end condition is satisfied, the control unit 15 ends the energization to the heater chip 1 and ends the joining. For example, the control unit 15 detects the temperature of the heater chip 1 with a thermocouple (not shown) attached to the heater chip 1, and supplies the current supplied to the heater chip 1 so that the temperature becomes a preset temperature. Control. Such energization control is performed for a certain period of time to complete the joining.

  At this time, since the height of the object to be joined changes due to the melting of the solder, the position in the height direction of the heater chip 1 holding the object to be joined also changes. The displacement detector 17 detects the amount of displacement in the height direction of the heater chip 1 being joined. When flux or the like adheres to the recess 2 of the heater chip 1, the heater chip 1 floats from the object to be bonded due to the thickness of the deposit, and the amount of displacement detected by the displacement detector 17 becomes small.

  Therefore, the control unit 15 determines that it is time to perform maintenance when the amount of displacement from the start of joining to the end of joining falls below a predetermined threshold, and moves the XY stage 14 as described above. Then, the jig 10 is moved to a position directly below the heater chip 1 to polish the front end surface of the heater chip 1. In this way, it is possible to automatically start polishing without the instruction of the worker.

[Third Embodiment]
Next, a third embodiment of the present invention will be described. In the first and second embodiments, the jig 10 or the XY stage 14 is moved to polish the tip surface of the heater chip 1, but the polishing sheet 11 may be moved. FIG. 5 is a block diagram showing a configuration of a heater chip polishing tool according to the third embodiment of the present invention, and the same reference numerals are given to the same configurations as those in FIGS.

In the present embodiment, a transport mechanism 19 that moves the polishing sheet 11 along a direction (Y direction) orthogonal to the arrangement direction of the recesses 2 of the heater chip 1 is provided. The transport mechanism 19 includes a motor as a drive source.
The jig 10 and the transport mechanism 19 are attached to the XY stage described in the second embodiment. When the front end surface of the heater chip 1 is polished, the control unit 15 of the bonding apparatus moves the XY stage 14 in accordance with an instruction from the worker to move the jig 10 to a position directly below the heater chip 1. Then, the control unit 15 lowers the heater chip 1 by the vertical mechanism 16. At this time, the control unit 15 adjusts the pressing force of the heater chip 1 so that a clearance that allows the polishing sheet 11 to slide between the heater chip 1 and the jig 10 is generated. The controller 15 moves the polishing sheet 11 along the Y direction by the transport mechanism 19 in such a state.

Thus, in the present embodiment, the tip surface of the heater chip 1 can be polished using the power of the motor that moves the transport mechanism 19. The movement of the polishing sheet 11 may be stopped according to an instruction from the worker, or the control unit 15 may automatically stop the polishing when the polishing is performed for a predetermined time.
In the case of this embodiment, the thickness of the jig 10 (t in FIG. 1) may be the same as the thickness of the heater chip 1 or may be thicker than the heater chip 1. Further, as described in the second embodiment, polishing may be automatically started according to the amount of displacement detected by the displacement detector 17.

  The control unit 15 described in the second and third embodiments can be realized by a computer having a CPU (Central Processing Unit), a storage device, and an interface, and a program for controlling these hardware resources. The CPU executes the processing described in the second and third embodiments according to the program stored in the storage device.

  The present invention can be applied to a technique for polishing the tip of a heater chip that heats an object to be bonded while applying pressure.

  DESCRIPTION OF SYMBOLS 1 ... Heater chip, 2 ... Concave part, 10 ... Jig, 11 ... Polishing sheet, 12 ... Convex part, 13 ... Fixing mechanism, 14 ... XY stage, 15 ... Control part, 16 ... Vertical mechanism, 17 ... Displacement detection part, 18 ... Power source, 19 ... Transport mechanism.

Claims (6)

A heater chip polishing tool for polishing a heater chip provided with unevenness to hold the object to be joined on the tip surface,
A jig whose receiving surface facing the tip surface of the heater chip fits the tip surface;
A heater chip polishing tool comprising a polishing sheet disposed between a tip surface of the heater chip and a receiving surface of the jig. The heater chip polishing tool according to claim 1,
The heater chip polishing tool further comprising a fixing mechanism for fixing the polishing sheet to the jig. In the heater chip polishing tool according to claim 1 or 2,
Furthermore, a vertical mechanism capable of moving the heater chip in the vertical direction;
The jig can be moved in a direction perpendicular to the moving direction of the heater chip in a state where the tip surface of the heater chip and the receiving surface of the jig are fitted with the polishing sheet interposed therebetween. A heater chip polishing tool, comprising a stage. In the heater chip polishing tool according to claim 3,
Furthermore, a displacement detector that detects the amount of displacement in the height direction of the heater chip when the object to be bonded is heated and bonded by the heater chip;
When the amount of displacement detected by the displacement detector is below a predetermined threshold value, the top and bottom mechanisms and the stage are controlled so that the tip of the heater chip is sandwiched between the polishing sheets. A heater chip polishing tool, comprising: a controller that engages a surface with a receiving surface of the jig and starts polishing of the tip surface of the heater chip by moving the jig. The heater chip polishing tool according to claim 1,
Furthermore, a vertical mechanism capable of moving the heater chip in the vertical direction;
A stage capable of moving the jig in a direction perpendicular to the moving direction of the heater chip;
The polishing sheet can be moved in a direction perpendicular to the moving direction of the heater chip in a state where the front end surface of the heater chip and the receiving surface of the jig are fitted with the polishing sheet interposed therebetween. A heater chip polishing tool comprising: The heater chip polishing tool according to claim 5,
Furthermore, a displacement detector that detects the amount of displacement in the height direction of the heater chip when the object to be bonded is heated and bonded by the heater chip;
When the amount of displacement detected by the displacement detector is below a predetermined threshold value, the top and bottom mechanisms and the stage are controlled so that the tip of the heater chip is sandwiched between the polishing sheets. A heater chip polishing tool, comprising: a controller that engages a surface with a receiving surface of the jig and starts polishing of a tip surface of the heater chip by moving the polishing sheet.

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