JPH0563040U - Heater chip polishing mechanism - Google Patents

Abstract

(57) [Abstract] [Purpose] Simplify and improve the quality of heater chips for thermocompression bonding, reduce costs, and improve accuracy. [Structure] The polishing stage 2 is installed on the existing XY stage 1 in parallel with the polishing surface of the heater chip 4, and the lapping paper 3 is attached onto the polishing stage 2. When polishing the heater chip 4, the XY table 1 is operated while the heater chip 4 is lowered and brought into contact with the lapping paper 3. Since the polishing can be performed under the optimum polishing conditions by changing the operation pattern, a good polished surface can be obtained. Also, since the structure is simple, the adjustment is easy and the cost can be further reduced.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a heater chip polishing mechanism for polishing a polishing surface of a heater chip for thermocompression bonding.

[0002]

[Prior Art]

 As shown in FIG. 2, a conventional heater chip polishing mechanism includes a polishing unit 6 having a belt conveyor-like rotating unit with a cloth file, a polishing waste storage unit 7, and a polishing unit pusher for moving the entire heater chip to a polishing position. The air cylinder 8 and the motor 9 for rotating the polishing section are provided.

Next, the operation will be described. The polishing section 6 and the polishing waste storage section 7 are normally in the retracted position as shown in FIG. When the lower end surface is polished because the heater chip 4 is soiled by the pressure bonding operation of the IC or the like, the polishing section pushing air cylinder 8 pushes the polishing section 6 to a position directly below the heater chip 4.

The heater chip 4 is lowered by the heater chip up-and-down cylinder 5 and comes into contact with the surface of the polishing section 6.

Here, the polishing section 6 is rotated by a polishing section rotation motor 9, and the lower end surface of the heater chip 4 is polished and smoothed by the surface cloth, and the polishing waste is stored in the polishing waste storage section 7. To be done.

[0006]

[Problems to be solved by the device]

 This conventional heater chip polishing mechanism has a problem in that a complicated polishing mechanism must be provided exclusively for polishing, which is expensive.

There is also a problem that the shape of the lower end surface of the heater chip cannot be smoothed unless the parallelism of the polishing portion with respect to the heater chip is correct.

An object of the present invention is to provide a heater chip polishing mechanism that has a simplified structure and has improved heater chip polishing accuracy.

[0009]

[Means for Solving the Problems]

 To achieve the above object, the heater chip polishing mechanism according to the present invention is a heater chip polishing mechanism having an XY stage, a polishing stage, and lapping paper, and the XY stage can be moved up and down. The object to be thermocompression-bonded by a different heater chip is supported and moved in two orthogonal directions to perform positioning. The polishing stage is arranged parallel to the polishing surface of the heater chip. -It is supported at a position avoiding the supporting surface of the processing object provided on the Y stage, and the wrapping paper is stuck on the polishing stage and linked with the movement of the XY stage. The polishing surface of the heater chip is polished.

[0010]

[Action]

 The heater chip is polished using an existing XY stage that supports the object to be processed and precisely positions the object.

[0011]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of the present invention.

In FIG. 1, when an IC or the like is thermocompression bonded to a printed circuit board or the like by a heater chip 4, an XY stage 1 that moves in two orthogonal axes is already installed. The XY stage 1 has a structure in which it is moved in two axial directions by orthogonal ball screws 1b and 1b and pulse motors 1a and 1a that rotationally drive the ball screw 1b, and precise positioning is performed.

In this embodiment, this XY stage 1 is used, and a polishing stage 2 and a lapping paper 3 are added.

The polishing stage 2 is arranged parallel to the lower polishing surface of the heater chip that can be moved up and down, and is located at a position avoiding the support surface of the processing object provided on the XY stage 1 (example It is supported in a position where it extends laterally).

The wrapping paper 3 is attached to the polishing stage 2 and polishes the polishing surface of the heater chip 4 in conjunction with the movement of the XY stage 1.

Next, the operation will be described. When polishing the heater chip 4, first, the XY stage 1 is moved to position the polishing stage 2 directly below the heater chip 4.

Next, the heater chip 4 is lowered by the cylinder 5, and the polishing surface of the heater chip 4 is brought into contact with the lapping paper 3 of the polishing stage 2.

In this state, the XY stage 1 is reciprocated in one direction, and the polished surface of the heater chip 4 is polished by the lapping paper 3.

By changing the operation direction of the XY stage 1, it is possible to adopt an optimum polishing method for the heater chip 4.

[0020]

[Effect of the device]

 As described above, the present invention can reduce the cost because the tip of the heater chip can be polished only by adding a simple structure. Also, since the structure is simple, the mounting accuracy is improved, and the polishing accuracy for the heater chip can be improved.

Further, by changing the operation direction of the XY stage, an optimum polishing method can be adopted, and a good polished surface at the tip of the heater chip can be obtained.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing a conventional heater chip polishing mechanism.

[Explanation of symbols]

 1 XY stage 1a Pulse motor 1b Ball screw 2 Polishing stage 3 Lapping paper 4 Heater chip 6 Polishing section 7 Polishing waste storage section

Claims (1)

[Scope of utility model registration request] 1. A heater chip polishing mechanism having an XY stage, a polishing stage, and wrapping paper, wherein the XY stage supports an object to be thermocompression-bonded by a vertically movable heater chip, Positioning is carried out by moving in two orthogonal directions, and the polishing stage is arranged parallel to the polishing surface of the heater chip, and the supporting surface of the processing object provided on the XY stage is placed on the supporting surface. The wrapping paper is attached to the polishing stage.
A heater chip polishing mechanism for polishing the polishing surface of a heater chip in conjunction with the movement of the XY stage.