JPH0376798B2 - - Google Patents

Info

Publication number
JPH0376798B2
JPH0376798B2 JP60095539A JP9553985A JPH0376798B2 JP H0376798 B2 JPH0376798 B2 JP H0376798B2 JP 60095539 A JP60095539 A JP 60095539A JP 9553985 A JP9553985 A JP 9553985A JP H0376798 B2 JPH0376798 B2 JP H0376798B2
Authority
JP
Japan
Prior art keywords
copper foil
zinc
molybdenum
printed circuits
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60095539A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61253886A (ja
Inventor
Kazuyoshi Aso
Yasuyuki Suzuki
Takeshi Yamagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Denkai Co Ltd
Original Assignee
Nippon Denkai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Denkai Co Ltd filed Critical Nippon Denkai Co Ltd
Priority to JP9553985A priority Critical patent/JPS61253886A/ja
Publication of JPS61253886A publication Critical patent/JPS61253886A/ja
Publication of JPH0376798B2 publication Critical patent/JPH0376798B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
JP9553985A 1985-05-07 1985-05-07 プリント回路用銅箔 Granted JPS61253886A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9553985A JPS61253886A (ja) 1985-05-07 1985-05-07 プリント回路用銅箔

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9553985A JPS61253886A (ja) 1985-05-07 1985-05-07 プリント回路用銅箔

Publications (2)

Publication Number Publication Date
JPS61253886A JPS61253886A (ja) 1986-11-11
JPH0376798B2 true JPH0376798B2 (enExample) 1991-12-06

Family

ID=14140365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9553985A Granted JPS61253886A (ja) 1985-05-07 1985-05-07 プリント回路用銅箔

Country Status (1)

Country Link
JP (1) JPS61253886A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63187684A (ja) * 1987-01-30 1988-08-03 株式会社東芝 回路基板
US6852427B1 (en) * 2003-09-02 2005-02-08 Olin Corporation Chromium-free antitarnish adhesion promoting treatment composition
JP6111017B2 (ja) * 2012-02-03 2017-04-05 Ｊｘ金属株式会社 プリント配線板用銅箔及びそれを用いた積層体、プリント配線板及び電子部品

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6014895B2 (ja) * 1979-07-28 1985-04-16 三菱重工業株式会社 ディ−ゼル機関の給気装置

Also Published As

Publication number Publication date
JPS61253886A (ja) 1986-11-11

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