JPH0376030B2 - - Google Patents

Info

Publication number
JPH0376030B2
JPH0376030B2 JP56144393A JP14439381A JPH0376030B2 JP H0376030 B2 JPH0376030 B2 JP H0376030B2 JP 56144393 A JP56144393 A JP 56144393A JP 14439381 A JP14439381 A JP 14439381A JP H0376030 B2 JPH0376030 B2 JP H0376030B2
Authority
JP
Japan
Prior art keywords
layer
electrode wiring
contact
thickness
intermediate layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56144393A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5844767A (ja
Inventor
Tooru Takeuchi
Ichiro Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56144393A priority Critical patent/JPS5844767A/ja
Publication of JPS5844767A publication Critical patent/JPS5844767A/ja
Publication of JPH0376030B2 publication Critical patent/JPH0376030B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/62—Electrodes ohmically coupled to a semiconductor

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP56144393A 1981-09-11 1981-09-11 半導体装置 Granted JPS5844767A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56144393A JPS5844767A (ja) 1981-09-11 1981-09-11 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56144393A JPS5844767A (ja) 1981-09-11 1981-09-11 半導体装置

Publications (2)

Publication Number Publication Date
JPS5844767A JPS5844767A (ja) 1983-03-15
JPH0376030B2 true JPH0376030B2 (enrdf_load_stackoverflow) 1991-12-04

Family

ID=15361100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56144393A Granted JPS5844767A (ja) 1981-09-11 1981-09-11 半導体装置

Country Status (1)

Country Link
JP (1) JPS5844767A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021261521A1 (ja) * 2020-06-26 2021-12-30 株式会社デンソー 半導体装置およびその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018121050A (ja) * 2017-01-24 2018-08-02 トヨタ自動車株式会社 半導体装置とその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5444866A (en) * 1977-09-16 1979-04-09 Nippon Telegr & Teleph Corp <Ntt> Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021261521A1 (ja) * 2020-06-26 2021-12-30 株式会社デンソー 半導体装置およびその製造方法
JP2022007763A (ja) * 2020-06-26 2022-01-13 株式会社デンソー 半導体装置およびその製造方法
CN115735264A (zh) * 2020-06-26 2023-03-03 株式会社电装 半导体装置及其制造方法

Also Published As

Publication number Publication date
JPS5844767A (ja) 1983-03-15

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