JPH0375631B2 - - Google Patents

Info

Publication number
JPH0375631B2
JPH0375631B2 JP59272245A JP27224584A JPH0375631B2 JP H0375631 B2 JPH0375631 B2 JP H0375631B2 JP 59272245 A JP59272245 A JP 59272245A JP 27224584 A JP27224584 A JP 27224584A JP H0375631 B2 JPH0375631 B2 JP H0375631B2
Authority
JP
Japan
Prior art keywords
sputtering
chamber
chambers
wafer
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59272245A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61149476A (ja
Inventor
Riichiro Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP27224584A priority Critical patent/JPS61149476A/ja
Publication of JPS61149476A publication Critical patent/JPS61149476A/ja
Publication of JPH0375631B2 publication Critical patent/JPH0375631B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP27224584A 1984-12-24 1984-12-24 スパツタリング装置 Granted JPS61149476A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27224584A JPS61149476A (ja) 1984-12-24 1984-12-24 スパツタリング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27224584A JPS61149476A (ja) 1984-12-24 1984-12-24 スパツタリング装置

Publications (2)

Publication Number Publication Date
JPS61149476A JPS61149476A (ja) 1986-07-08
JPH0375631B2 true JPH0375631B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-12-02

Family

ID=17511153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27224584A Granted JPS61149476A (ja) 1984-12-24 1984-12-24 スパツタリング装置

Country Status (1)

Country Link
JP (1) JPS61149476A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6280265A (ja) * 1985-10-04 1987-04-13 Toshiba Corp 真空処理装置
US5618388A (en) * 1988-02-08 1997-04-08 Optical Coating Laboratory, Inc. Geometries and configurations for magnetron sputtering apparatus
US4851095A (en) * 1988-02-08 1989-07-25 Optical Coating Laboratory, Inc. Magnetron sputtering apparatus and process
JP2730796B2 (ja) * 1990-11-08 1998-03-25 シャープ株式会社 スパッタリング装置
JPH0874028A (ja) * 1994-09-01 1996-03-19 Matsushita Electric Ind Co Ltd 薄膜形成装置および薄膜形成方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54153740A (en) * 1978-05-25 1979-12-04 Ulvac Corp Continuous vacuum treatment apparatus
JPS609102B2 (ja) * 1980-08-27 1985-03-07 株式会社日立製作所 連続真空処理装置
JPS61112312A (ja) * 1984-11-07 1986-05-30 Hitachi Ltd 真空連続処理装置

Also Published As

Publication number Publication date
JPS61149476A (ja) 1986-07-08

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees