JPH03751Y2 - - Google Patents
Info
- Publication number
- JPH03751Y2 JPH03751Y2 JP12662682U JP12662682U JPH03751Y2 JP H03751 Y2 JPH03751 Y2 JP H03751Y2 JP 12662682 U JP12662682 U JP 12662682U JP 12662682 U JP12662682 U JP 12662682U JP H03751 Y2 JPH03751 Y2 JP H03751Y2
- Authority
- JP
- Japan
- Prior art keywords
- wave filter
- surface wave
- mounting plate
- cap
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案はテレビジヨン受像機、ラジオ受信機等
の映像機器、さらには通信機器等に利用される表
面波フイルタのパツケージに関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a surface wave filter package used in video equipment such as television receivers and radio receivers, as well as communication equipment.
従来例の構成とその問題点
従来、表面波フイルタのパツケージは第１図に
示すように、入出力端子４を植設した平板１の上
に表面波フイルタチツプ（図示せず）を取付け、
上記フイルタチツプの電極と入出力端子４を接続
した後、キヤツプ２を接着剤３で平板１に固定し
ていた。このように平板１の上に接着剤３でキヤ
ツプ２を固定していたため、特に接着面が狭い場
合、外部から高圧力がかかるとリークし易く、気
密性の確保が困難なものであつた。Conventional structure and problems thereof Conventionally, as shown in FIG. 1, a surface wave filter package has a surface wave filter chip (not shown) mounted on a flat plate 1 on which input/output terminals 4 are implanted.
After connecting the electrodes of the filter chip and the input/output terminals 4, the cap 2 was fixed to the flat plate 1 with an adhesive 3. Since the cap 2 was fixed on the flat plate 1 with the adhesive 3 in this way, it was easy to leak when high pressure was applied from the outside, especially when the adhesive surface was narrow, making it difficult to ensure airtightness.
考案の目的
本考案はこのような従来の欠点であつた気密性
を材料費、工数の増加を最小限にとどめて克服す
るように構成した表面波フイルタパツケージを提
供するものである。Purpose of the Invention The present invention provides a surface wave filter package configured to overcome the conventional drawback of airtightness while minimizing increases in material costs and man-hours.
考案の構成
本考案の表面波フイルタパツケージは、周囲に
凸状部をもつた取付板の凹部内に表面波フイルタ
チツプを取付け、その取付板の凹部にキヤツプを
被せ、さらにキヤツプと取付板の凸状部との間に
接着剤または樹脂を流し込んでなるものであり、
全体をモールドして気密性の向上を図るのと同じ
レベルの改善を工数、材料費等の増加をほとんど
なしで達成できるものである。Structure of the invention In the surface wave filter package of the invention, a surface wave filter chip is mounted in a concave part of a mounting plate having a convex part on the periphery, a cap is placed over the concave part of the mounting plate, and the convex part of the cap and the mounting plate is It is made by pouring adhesive or resin between the
The same level of improvement as molding the entire structure to improve airtightness can be achieved with almost no increase in man-hours, material costs, etc.
実施例の説明
以下、本考案の一実施例について第２図及び第
３図とともに説明する。図に示すように周囲に凸
状部５ａをもつた取付板５の凹部内に表面波フイ
ルタチツプ６を接着剤７で貼付け、上記取付板５
に植設された入出力端子８と上記フイルタチツプ
６の電極とを導電性ワイヤー９と導電性接着剤で
接続し、キヤツプ１０を接着剤１１で上記取付板
５の凹部に上記フイルタチツプ６等を覆うように
貼付けている。こうして表面波フイルタチツプ６
の表面は外力及び湿気から一応保護した構成とし
ている。そして、さらに気密性を向上させるため
に上記キヤツプ１０と取付板５の凸状部５ａとの
間に接着剤または樹脂１２を流し込み硬化させて
いる。こうすることにより外部とキヤツプ１０の
内部との間の距離が増し、気密性も向上した構成
としている。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 2 and 3. As shown in the figure, a surface wave filter chip 6 is pasted with adhesive 7 into the recessed part of the mounting plate 5 having a convex part 5a around the periphery, and the mounting plate 5 is
Connect the input/output terminal 8 implanted in the filter chip 6 to the electrode of the filter chip 6 using a conductive wire 9 and a conductive adhesive, and cover the filter chip 6, etc. with a cap 10 in the recess of the mounting plate 5 with adhesive 11. It is pasted like this. In this way, the surface wave filter chip 6
The surface is protected from external forces and moisture. In order to further improve airtightness, adhesive or resin 12 is poured between the cap 10 and the convex portion 5a of the mounting plate 5 and hardened. By doing so, the distance between the outside and the inside of the cap 10 is increased, and the airtightness is also improved.
考案の効果
本考案の表面波フイルタパツケージによれば、
材料費、工数の増加はほとんどなしに気密性が向
上し、信頼性が増した構成とすることができるも
のである。Effects of the invention According to the surface wave filter package of the invention,
It is possible to achieve a configuration with improved airtightness and increased reliability with almost no increase in material costs or man-hours.
第１図は従来の表面波フイルタパツケージを示
す斜視図、第２図は本考案に係る表面波フイルタ
パツケージの一実施例を示す断面図、第３図は同
拡大分解斜視図である。
５……取付板、５ａ……凸状部、６……表面波
フイルタチツプ、８……入出力端子、１０……キ
ヤツプ、１２……接着剤または樹脂。
FIG. 1 is a perspective view showing a conventional surface wave filter package, FIG. 2 is a sectional view showing an embodiment of the surface wave filter package according to the present invention, and FIG. 3 is an enlarged exploded perspective view of the same. 5... Mounting plate, 5a... Convex portion, 6... Surface wave filter chip, 8... Input/output terminal, 10... Cap, 12... Adhesive or resin.
Claims (1)
板の凹部内に表面波フイルタチツプを取付け、上
記取付板の凹部にキヤツプを被せ、さらに上記キ
ヤツプと上記取付板の凸状部との間に接着剤また
は樹脂を流し込んでなる表面波フイルタパツケー
ジ。 A surface wave filter chip is installed in a concave part of a mounting plate with an input/output terminal planted therein and a convex part around the periphery, a cap is placed over the concave part of the mounting plate, and the cap and the convex part of the mounting plate are connected. A surface wave filter package made by pouring adhesive or resin in between.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12662682U JPS5929828U (en) | 1982-08-20 | 1982-08-20 | surface wave filter package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12662682U JPS5929828U (en) | 1982-08-20 | 1982-08-20 | surface wave filter package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5929828U JPS5929828U (en) | 1984-02-24 |
| JPH03751Y2 true JPH03751Y2 (en) | 1991-01-11 |
Family
ID=30287869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12662682U Granted JPS5929828U (en) | 1982-08-20 | 1982-08-20 | surface wave filter package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5929828U (en) |
-
1982
- 1982-08-20 JP JP12662682U patent/JPS5929828U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5929828U (en) | 1984-02-24 |
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