JPS5942043U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS5942043U JPS5942043U JP13740882U JP13740882U JPS5942043U JP S5942043 U JPS5942043 U JP S5942043U JP 13740882 U JP13740882 U JP 13740882U JP 13740882 U JP13740882 U JP 13740882U JP S5942043 U JPS5942043 U JP S5942043U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin material
- resin
- encapsulated semiconductor
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の樹脂封止型半導体装置の断面図、第２図
は本考案の一実施例を示す樹脂封止型半導体装置の断面
図である。
１・・・端子、２・・・半導体装置、３・・・ケース、
４・・・第１の樹脂材、５・・・第２の樹脂材、６・・
・接着性樹脂材。FIG. 1 is a cross-sectional view of a conventional resin-sealed semiconductor device, and FIG. 2 is a cross-sectional view of a resin-sealed semiconductor device showing an embodiment of the present invention. 1...Terminal, 2...Semiconductor device, 3...Case,
4...First resin material, 5...Second resin material, 6...
・Adhesive resin material.
Claims (2)
ケースに、緩衝性を有する第１の樹脂材を半導体装置が
埋没するよう注入すると共に、第１の樹脂材上にケース
に対して接着良好かつ機械的強度が犬である第２の樹脂
材を注入したものにおいて、上記第１の樹脂材と第２の
樹脂材との間に接着性樹脂材を介在させたことを特徴と
する樹脂封止型半導体装置。(1) A first resin material having cushioning properties is injected into a case housing a semiconductor device with terminals protruding from the outside so that the semiconductor device is buried therein, and the first resin material is bonded to the case. A resin injected with a second resin material having good mechanical strength, characterized in that an adhesive resin material is interposed between the first resin material and the second resin material. Sealed semiconductor device.
て、接着性樹脂材がシリコンゴム系接着剤であることを
特徴とする樹脂封止型半導体装置。(2) Utility Model Registration The resin-sealed semiconductor device according to claim 1, wherein the adhesive resin material is a silicone rubber adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13740882U JPS5942043U (en) | 1982-09-10 | 1982-09-10 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13740882U JPS5942043U (en) | 1982-09-10 | 1982-09-10 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5942043U true JPS5942043U (en) | 1984-03-17 |
Family
ID=30308644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13740882U Pending JPS5942043U (en) | 1982-09-10 | 1982-09-10 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5942043U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH037161A (en) * | 1989-06-05 | 1991-01-14 | Fuji Iryoki:Kk | Massage machine |
| WO2021059549A1 (en) * | 2019-09-25 | 2021-04-01 | 株式会社ミツバ | Driver |
| JP2022008991A (en) * | 2016-01-13 | 2022-01-14 | テキサス インスツルメンツ インコーポレイテッド | Structure and method for packaging stress-sensitive mems |
-
1982
- 1982-09-10 JP JP13740882U patent/JPS5942043U/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH037161A (en) * | 1989-06-05 | 1991-01-14 | Fuji Iryoki:Kk | Massage machine |
| JPH0351428B2 (en) * | 1989-06-05 | 1991-08-06 | Fuji Iryoki Kk | |
| JP2022008991A (en) * | 2016-01-13 | 2022-01-14 | テキサス インスツルメンツ インコーポレイテッド | Structure and method for packaging stress-sensitive mems |
| WO2021059549A1 (en) * | 2019-09-25 | 2021-04-01 | 株式会社ミツバ | Driver |
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