JPS6310542U - - Google Patents
Info
- Publication number
- JPS6310542U JPS6310542U JP10544886U JP10544886U JPS6310542U JP S6310542 U JPS6310542 U JP S6310542U JP 10544886 U JP10544886 U JP 10544886U JP 10544886 U JP10544886 U JP 10544886U JP S6310542 U JPS6310542 U JP S6310542U
- Authority
- JP
- Japan
- Prior art keywords
- view
- sectional
- resin
- electrode terminal
- sealed electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図はこの考案に係る樹脂封止形電子部品の
一実施例を示す断面図、第２図はその要部部分斜
視図、第３図及び第４図は保持バンドの取付け要
領を示す斜視図、第５図はこの考案の他の実施例
を示す断面図、第６図はその要部部分斜視図、第
７図は保持バンドの斜視図、第８図は取付時に保
持バンドを弾性変形したときの斜視図、第９図は
従来の樹脂封止形電子部品の断面図、第１０図乃
至第１３図は樹脂封止形電子部品の製造工程を示
すもので、第１０図はリードフレームの部分平面
図、第１１図は第１０図のＸ―Ｘ線に沿う断面図
、第１２図は樹脂モールド金型の部分断面図、第
１３図は外部リード部材折曲前の断面図である。
第１４図はコンデンサエレメントが浮上がつた接
着状態を示す図面、第１５図は乾燥治具の部分断
面図である。
１……コンデンサエレメント、２……第２の外
部リード部材、６……導電性接着材、１４，１５
……保持バンド。
Fig. 1 is a sectional view showing an embodiment of the resin-sealed electronic component according to this invention, Fig. 2 is a perspective view of the main part thereof, and Figs. 3 and 4 are perspective views showing how to attach the holding band. 5 is a sectional view showing another embodiment of this invention, FIG. 6 is a perspective view of the main part thereof, FIG. 7 is a perspective view of the holding band, and FIG. 8 is an elastic deformation of the holding band during installation. FIG. 9 is a cross-sectional view of a conventional resin-sealed electronic component, and FIGS. 10 to 13 show the manufacturing process of resin-sealed electronic components, and FIG. 10 is a lead frame. , FIG. 11 is a cross-sectional view taken along the line X--X in FIG. 10, FIG. 12 is a partial cross-sectional view of the resin mold, and FIG. 13 is a cross-sectional view of the external lead member before bending. .
FIG. 14 is a drawing showing the bonded state in which the capacitor element is floating, and FIG. 15 is a partial sectional view of the drying jig. DESCRIPTION OF SYMBOLS 1... Capacitor element, 2... Second external lead member, 6... Conductive adhesive, 14, 15
...Retention band.
Claims (1)
ウントしてなる樹脂封止形電子部品において、上
記素子と電極端子の外周部に保持バンドを嵌めた
ことを特徴とする電子部品。 A resin-sealed electronic component comprising a component element mounted on an electrode terminal via a conductive adhesive, characterized in that a holding band is fitted around the outer periphery of the element and the electrode terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10544886U JPS6310542U (en) | 1986-07-09 | 1986-07-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10544886U JPS6310542U (en) | 1986-07-09 | 1986-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6310542U true JPS6310542U (en) | 1988-01-23 |
Family
ID=30979889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10544886U Pending JPS6310542U (en) | 1986-07-09 | 1986-07-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6310542U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023153424A1 (en) * | 2022-02-09 | 2023-08-17 | 株式会社村田製作所 | Solid electrolytic capacitor, and solid electrolytic capacitor manufacturing method |
-
1986
- 1986-07-09 JP JP10544886U patent/JPS6310542U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023153424A1 (en) * | 2022-02-09 | 2023-08-17 | 株式会社村田製作所 | Solid electrolytic capacitor, and solid electrolytic capacitor manufacturing method |
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