JPH0374035B2 - - Google Patents

Info

Publication number
JPH0374035B2
JPH0374035B2 JP58181286A JP18128683A JPH0374035B2 JP H0374035 B2 JPH0374035 B2 JP H0374035B2 JP 58181286 A JP58181286 A JP 58181286A JP 18128683 A JP18128683 A JP 18128683A JP H0374035 B2 JPH0374035 B2 JP H0374035B2
Authority
JP
Japan
Prior art keywords
electrodes
semiconductor element
electrode
connection terminal
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58181286A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6074462A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18128683A priority Critical patent/JPS6074462A/ja
Priority to EP19840110766 priority patent/EP0138048B1/en
Priority to DE84110766T priority patent/DE3486256T2/de
Priority to US06/650,107 priority patent/US4694322A/en
Publication of JPS6074462A publication Critical patent/JPS6074462A/ja
Publication of JPH0374035B2 publication Critical patent/JPH0374035B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP18128683A 1983-09-29 1983-09-29 半導体装置 Granted JPS6074462A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP18128683A JPS6074462A (ja) 1983-09-29 1983-09-29 半導体装置
EP19840110766 EP0138048B1 (en) 1983-09-29 1984-09-10 Press-packed semiconductor device
DE84110766T DE3486256T2 (de) 1983-09-29 1984-09-10 Halbleiteranordnung in Druckpackung.
US06/650,107 US4694322A (en) 1983-09-29 1984-09-13 Press-packed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18128683A JPS6074462A (ja) 1983-09-29 1983-09-29 半導体装置

Publications (2)

Publication Number Publication Date
JPS6074462A JPS6074462A (ja) 1985-04-26
JPH0374035B2 true JPH0374035B2 (enrdf_load_stackoverflow) 1991-11-25

Family

ID=16098031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18128683A Granted JPS6074462A (ja) 1983-09-29 1983-09-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS6074462A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006014582B4 (de) * 2006-03-29 2011-09-15 Infineon Technologies Ag Halbleitermodul
DE112016003856A5 (de) * 2015-08-25 2018-05-03 Infineon Technologies Bipolar Gmbh & Co. Kg Leistungshalbleiterbauelementmodul mit einer ein Becken ausbildenden Druckplatte

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52110342A (en) * 1976-03-11 1977-09-16 Nissan Motor Co Ltd Fuel-air ratio control device for internal-combustion engine
DE2617335A1 (de) * 1976-04-21 1977-11-03 Siemens Ag Halbleiterbauelement
DE2728313A1 (de) * 1977-06-23 1979-01-04 Siemens Ag Halbleiterbauelement
DE2942409A1 (de) * 1979-10-19 1981-04-23 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit mehreren halbleiterkoerpern
DE3005313C2 (de) * 1980-02-13 1986-05-28 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
JPS5724749U (enrdf_load_stackoverflow) * 1980-07-15 1982-02-08
DE3142576A1 (de) * 1981-10-27 1983-05-05 Siemens AG, 1000 Berlin und 8000 München Halbleiteranordnung mit durch druck kontaktierbaren halbleiterkoerpern

Also Published As

Publication number Publication date
JPS6074462A (ja) 1985-04-26

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