JPS6074462A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6074462A
JPS6074462A JP18128683A JP18128683A JPS6074462A JP S6074462 A JPS6074462 A JP S6074462A JP 18128683 A JP18128683 A JP 18128683A JP 18128683 A JP18128683 A JP 18128683A JP S6074462 A JPS6074462 A JP S6074462A
Authority
JP
Japan
Prior art keywords
semiconductor element
common
element structure
common electrode
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18128683A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0374035B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Sakurai
桜井　坦
Masami Iwasaki
岩崎　政美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP18128683A priority Critical patent/JPS6074462A/ja
Priority to EP19840110766 priority patent/EP0138048B1/en
Priority to DE84110766T priority patent/DE3486256T2/de
Priority to US06/650,107 priority patent/US4694322A/en
Publication of JPS6074462A publication Critical patent/JPS6074462A/ja
Publication of JPH0374035B2 publication Critical patent/JPH0374035B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP18128683A 1983-09-29 1983-09-29 半導体装置 Granted JPS6074462A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP18128683A JPS6074462A (ja) 1983-09-29 1983-09-29 半導体装置
EP19840110766 EP0138048B1 (en) 1983-09-29 1984-09-10 Press-packed semiconductor device
DE84110766T DE3486256T2 (de) 1983-09-29 1984-09-10 Halbleiteranordnung in Druckpackung.
US06/650,107 US4694322A (en) 1983-09-29 1984-09-13 Press-packed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18128683A JPS6074462A (ja) 1983-09-29 1983-09-29 半導体装置

Publications (2)

Publication Number Publication Date
JPS6074462A true JPS6074462A (ja) 1985-04-26
JPH0374035B2 JPH0374035B2 (enrdf_load_stackoverflow) 1991-11-25

Family

ID=16098031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18128683A Granted JPS6074462A (ja) 1983-09-29 1983-09-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS6074462A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266608A (ja) * 2006-03-29 2007-10-11 Infineon Technologies Ag 半導体モジュール
WO2017032356A1 (de) * 2015-08-25 2017-03-02 Infineon Technologies Bipolar Gmbh & Co Kg Leistungshalbleiterbauelementmodul mit einer ein becken ausbildenden druckplatte

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52110342A (en) * 1976-03-11 1977-09-16 Nissan Motor Co Ltd Fuel-air ratio control device for internal-combustion engine
JPS52129378A (en) * 1976-04-21 1977-10-29 Siemens Ag Semiconductor device
JPS5410672A (en) * 1977-06-23 1979-01-26 Siemens Ag Semiconductor
JPS5666049A (en) * 1979-10-19 1981-06-04 Siemens Ag Semiconductor device
JPS56130958A (en) * 1980-02-13 1981-10-14 Semikron Gleichrichterbau Semiconductor forming unit
JPS5724749U (enrdf_load_stackoverflow) * 1980-07-15 1982-02-08
JPS5884451A (ja) * 1981-10-27 1983-05-20 シ−メンス・アクチエンゲゼルシヤフト 半導体装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52110342A (en) * 1976-03-11 1977-09-16 Nissan Motor Co Ltd Fuel-air ratio control device for internal-combustion engine
JPS52129378A (en) * 1976-04-21 1977-10-29 Siemens Ag Semiconductor device
JPS5410672A (en) * 1977-06-23 1979-01-26 Siemens Ag Semiconductor
JPS5666049A (en) * 1979-10-19 1981-06-04 Siemens Ag Semiconductor device
JPS56130958A (en) * 1980-02-13 1981-10-14 Semikron Gleichrichterbau Semiconductor forming unit
JPS5724749U (enrdf_load_stackoverflow) * 1980-07-15 1982-02-08
JPS5884451A (ja) * 1981-10-27 1983-05-20 シ−メンス・アクチエンゲゼルシヤフト 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266608A (ja) * 2006-03-29 2007-10-11 Infineon Technologies Ag 半導体モジュール
WO2017032356A1 (de) * 2015-08-25 2017-03-02 Infineon Technologies Bipolar Gmbh & Co Kg Leistungshalbleiterbauelementmodul mit einer ein becken ausbildenden druckplatte

Also Published As

Publication number Publication date
JPH0374035B2 (enrdf_load_stackoverflow) 1991-11-25

Similar Documents

Publication Publication Date Title
JP4569473B2 (ja) 樹脂封止型パワー半導体モジュール
US6881071B2 (en) Power semiconductor module with pressure contact means
JP3225457B2 (ja) 半導体装置
US6836006B2 (en) Semiconductor module
US4694322A (en) Press-packed semiconductor device
US20100134979A1 (en) Power semiconductor apparatus
US20070257343A1 (en) Die-on-leadframe (dol) with high voltage isolation
JPS63205935A (ja) 放熱板付樹脂封止型半導体装置
JPH1093017A (ja) 多層構造方式での高実装密度の半導体パワーモジュール
KR20130006368A (ko) 냉각장치를 포함하는 전력 전자 시스템
JP2008258547A (ja) 半導体装置およびその製造方法
JP2002314038A (ja) パワー半導体モジュール
WO2005119896A1 (ja) インバータ装置
US20230238297A1 (en) Semiconductor package and method of fabricating the same
US20230187311A1 (en) Semiconductor device and manufacturing method thereof
JP2017123360A (ja) 半導体モジュール
USRE37416E1 (en) Method for manufacturing a modular semiconductor power device
JPS6146061B2 (enrdf_load_stackoverflow)
US12166339B2 (en) Circuit structure
US20240178094A1 (en) Semiconductor package
JPS6050354B2 (ja) 樹脂封止型半導体装置
JPS6074462A (ja) 半導体装置
JPS622587A (ja) ハイパワ−用混成集積回路
JP4915907B2 (ja) Ｉｐｍ搭載の太陽光インバータとその製造方法
WO2023047451A1 (ja) 電力用半導体装置および電力用半導体装置の製造方法