JPH0373497U - - Google Patents
Info
- Publication number
- JPH0373497U JPH0373497U JP13437089U JP13437089U JPH0373497U JP H0373497 U JPH0373497 U JP H0373497U JP 13437089 U JP13437089 U JP 13437089U JP 13437089 U JP13437089 U JP 13437089U JP H0373497 U JPH0373497 U JP H0373497U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- acoustic wave
- wave filter
- surface acoustic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案に係る表面弾性波フイルタのシ
ールド構造の一実施例を示す断面図、第２図は第
１図の要部を示す分解斜視図、第３図は第２図の
半田付けを行つた場合の裏面側を示す斜視図、第
４図は第１図の構造を用いた映像及び音声中間周
波処理回路の周波数特性を説明する説明図、第５
図は従来の表面弾性波フイルタの取付け構造を示
す分解斜視図、第６図は第５図を組立てた状態の
裏面を示す斜視図、第７図は第６図にシールドカ
バーを被せた状態の側面から見た断面図である。
４１……印刷配線板、４３，４４，４６……端
子挿入孔、６３……入力配線パターン、６４……
出力配線パターン、６７，７７……アースパター
ン、８１……シールドカバー、９１……表面弾性
波フイルタ、９３……入力端子、９４……出力端
子、９６……アース端子。
Fig. 1 is a sectional view showing an embodiment of the shield structure of the surface acoustic wave filter according to the present invention, Fig. 2 is an exploded perspective view showing the main parts of Fig. 1, and Fig. 3 is the soldering shown in Fig. 2. FIG. 4 is an explanatory diagram illustrating the frequency characteristics of the video and audio intermediate frequency processing circuit using the structure of FIG. 1, and FIG.
The figure is an exploded perspective view showing the mounting structure of a conventional surface acoustic wave filter, Figure 6 is a perspective view showing the back of Figure 5 in an assembled state, and Figure 7 is the same as Figure 6 with a shield cover attached. It is a sectional view seen from the side. 41... Printed wiring board, 43, 44, 46... Terminal insertion hole, 63... Input wiring pattern, 64...
Output wiring pattern, 67, 77...Earth pattern, 81...Shield cover, 91...Surface acoustic wave filter, 93...Input terminal, 94...Output terminal, 96...Earth terminal.
Claims (1)
この印刷配線板を外部から遮蔽するシールドカバ
ーと、 前記印刷配線板の第１の面に形成され、前記表
面弾性波フイルタの入力端子と接続した入力配線
パターンと、 前記印刷配線板の第２の面に形成され、前記表
面弾性波フイルタの出力端子と接続した出力配線
パターンと、 前記印刷配線板の第２の面で前記入力配線パタ
ーンに対向して形成され、前記シールドカバーに
接続した第１のアースパターンと、 前記印刷配線板の第１の面で前記出力配線パタ
ーンに対向して形成され、前記シールドカバーに
接続した前記出力配線パターンをシールドする第
２のアースパターンと、 前記印刷配線板に設けられ、表面弾性波フイル
タのアース端子を挿入して半田付け固定すると共
に、第１のアースパターンと第２のアースパター
ンを接続するスルーホールとを具備したことを特
徴とする表面弾性波フイルタのシールド構造。[Scope of claim for utility model registration] A printed wiring board equipped with a surface acoustic wave filter,
a shield cover that shields the printed wiring board from the outside; an input wiring pattern formed on the first surface of the printed wiring board and connected to the input terminal of the surface acoustic wave filter; and a second wiring pattern of the printed wiring board. an output wiring pattern formed on a surface of the printed wiring board and connected to the output terminal of the surface acoustic wave filter; and a first wiring pattern formed on a second surface of the printed wiring board opposite to the input wiring pattern and connected to the shield cover. a second ground pattern formed on the first surface of the printed wiring board to face the output wiring pattern and shielding the output wiring pattern connected to the shield cover; and the printed wiring board. A surface acoustic wave filter, characterized in that the surface acoustic wave filter is provided with a through hole for inserting and fixing a ground terminal of the surface acoustic wave filter by soldering, and for connecting a first ground pattern and a second ground pattern. shield structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13437089U JPH0373497U (en) | 1989-11-21 | 1989-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13437089U JPH0373497U (en) | 1989-11-21 | 1989-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0373497U true JPH0373497U (en) | 1991-07-24 |
Family
ID=31681710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13437089U Pending JPH0373497U (en) | 1989-11-21 | 1989-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0373497U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009141326A (en) * | 2007-12-07 | 2009-06-25 | Samsung Electro Mech Co Ltd | Electromagnetic bandgap structure and printed circuit board |
-
1989
- 1989-11-21 JP JP13437089U patent/JPH0373497U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009141326A (en) * | 2007-12-07 | 2009-06-25 | Samsung Electro Mech Co Ltd | Electromagnetic bandgap structure and printed circuit board |
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