JPH0336195U - - Google Patents
Info
- Publication number
- JPH0336195U JPH0336195U JP9714489U JP9714489U JPH0336195U JP H0336195 U JPH0336195 U JP H0336195U JP 9714489 U JP9714489 U JP 9714489U JP 9714489 U JP9714489 U JP 9714489U JP H0336195 U JPH0336195 U JP H0336195U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- printed wiring
- shield plate
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims 3
- 238000005192 partition Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第1図は本考案に係るアース半田付け構造の一
実施例を示す分解斜視図、第2図は第1図のシー
ルドケース本体を展開した状態を示す斜視図、第
3図は第2図の接続部付近の拡大図、第4図は第
1図を組立てた状態の斜視図、第5図は第4図の
アース半田付け構造の半田付け後の側面図、第6
図は第5図の部分の拡大図、第7図は第6図の
J−J線断面図、第8図は第7図のアース半田付
け構造の半田付けランド付近を示す部分拡大図、
第9図は従来のアース半田付け構造を示す分解斜
視図、第10図は第9図のシールドケース本体の
部分拡大図、第11図は第10図の接続部を展開
した状態を示す部分拡大図、第12図は第9図を
組立てた状態の斜視図、第13図は第12図のア
ース半田付け構造の半田付け後の断面図、第14
図は第13図のC−C線断面図、第15図は他の
従来例のアース半田付け構造を示す斜視図、第1
6図は第15図のアース半田付け構造の半田付け
後の断面図、第17図はもう一つの他の従来例の
アース半田付け構造を示す分解斜視図、第18図
は第17図を組立てた状態の斜視図、第19図は
第18図のアース半田付け構造の半田付けを行つ
た後の断面図である。
31……印刷配線板、32……シールドケース
本体、33……シールド板、34……アース端子
、35a,35b……突起部、36,37……側
面板、36a,37a……貫通孔、41……端子
挿入孔。
Fig. 1 is an exploded perspective view showing one embodiment of the earth soldering structure according to the present invention, Fig. 2 is a perspective view showing the shield case main body of Fig. 1 in an expanded state, and Fig. 3 is the same as that of Fig. 2. An enlarged view of the vicinity of the connection part, Fig. 4 is a perspective view of the assembled state of Fig. 1, Fig. 5 is a side view of the ground soldering structure of Fig. 4 after soldering, Fig. 6
The figure is an enlarged view of the part shown in Fig. 5, Fig. 7 is a sectional view taken along line J-J in Fig. 6, and Fig. 8 is a partially enlarged view showing the vicinity of the soldering land of the ground soldering structure in Fig. 7.
Fig. 9 is an exploded perspective view showing a conventional ground soldering structure, Fig. 10 is a partially enlarged view of the shield case main body in Fig. 9, and Fig. 11 is a partially enlarged view showing the expanded state of the connection part in Fig. 10. 12 is a perspective view of the assembled state of FIG. 9, FIG. 13 is a sectional view of the ground soldering structure of FIG. 12 after soldering, and FIG.
The figure is a sectional view taken along the line CC in Fig. 13, Fig. 15 is a perspective view showing another conventional ground soldering structure, and Fig. 1
Figure 6 is a sectional view of the earth soldering structure shown in Figure 15 after soldering, Figure 17 is an exploded perspective view showing another conventional earth soldering structure, and Figure 18 is an assembled version of the earth soldering structure shown in Figure 17. FIG. 19 is a cross-sectional view of the ground soldering structure shown in FIG. 18 after soldering. 31... Printed wiring board, 32... Shield case body, 33... Shield plate, 34... Earth terminal, 35a, 35b... Projection, 36, 37... Side plate, 36a, 37a... Through hole, 41...Terminal insertion hole.
Claims (1)
部品装着面側には、金属筺体の内側に複数の区画
部を形成するようにして、内シールド板を設け、
これによつて、それぞれの区画内に位置する電子
部品の電気的シールドを行うと共に、前記印刷配
線板に貫通孔を形成し、この貫通孔に内シールド
板に設けたアース端子を嵌合し、該アース端子を
印刷配線板の配線パターン形成面に形成した半田
付けランドと半田槽を用いて半田付け接続するア
ース半田付け構造において、 前記金属筺体の側面と内シールド板を半田付け
すべく、前記金属筺体の側面に貫通孔を形成する
と共に、この貫通孔と嵌合する第2の突起部を内
シールド板に設けたことを特徴とするアース半田
付け構造。[Scope of Claim for Utility Model Registration] A printed wiring board is installed inside a metal casing, and an inner shield plate is provided on the component mounting side of the printed wiring board so as to form a plurality of partitions inside the metal casing. ,
As a result, electronic components located in each compartment are electrically shielded, a through hole is formed in the printed wiring board, and a ground terminal provided on the inner shield plate is fitted into this through hole, In a ground soldering structure in which the ground terminal is soldered and connected using a soldering land formed on a wiring pattern forming surface of a printed wiring board and a solder tank, A grounding soldering structure characterized in that a through hole is formed in a side surface of a metal casing, and a second protrusion that fits into the through hole is provided on an inner shield plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989097144U JPH0741197Y2 (en) | 1989-08-22 | 1989-08-22 | Ground soldering structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989097144U JPH0741197Y2 (en) | 1989-08-22 | 1989-08-22 | Ground soldering structure |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0336195U true JPH0336195U (en) | 1991-04-09 |
JPH0741197Y2 JPH0741197Y2 (en) | 1995-09-20 |
Family
ID=31646294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989097144U Expired - Lifetime JPH0741197Y2 (en) | 1989-08-22 | 1989-08-22 | Ground soldering structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0741197Y2 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5150904U (en) * | 1974-10-15 | 1976-04-17 | ||
JPS5933296U (en) * | 1982-08-26 | 1984-03-01 | 日本電気ホームエレクトロニクス株式会社 | shield case |
-
1989
- 1989-08-22 JP JP1989097144U patent/JPH0741197Y2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5150904U (en) * | 1974-10-15 | 1976-04-17 | ||
JPS5933296U (en) * | 1982-08-26 | 1984-03-01 | 日本電気ホームエレクトロニクス株式会社 | shield case |
Also Published As
Publication number | Publication date |
---|---|
JPH0741197Y2 (en) | 1995-09-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |