JPH0334322U - - Google Patents
Info
- Publication number
- JPH0334322U JPH0334322U JP9508389U JP9508389U JPH0334322U JP H0334322 U JPH0334322 U JP H0334322U JP 9508389 U JP9508389 U JP 9508389U JP 9508389 U JP9508389 U JP 9508389U JP H0334322 U JPH0334322 U JP H0334322U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- surface wave
- back side
- wave filter
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図及び第２図は本考案の第１の実施例を示
し、第１図は縦断面図、第２図はその要部の斜視
図である。また、第３図は第２の実施例の縦断面
図、第４図はその要部の斜視図、第５図は第３の
実施例の縦断面図、第６図はその要部の斜視図、
更に、第７図は第４の実施例の縦断面図、第８図
はその要部の斜視図、第９図Ａ，Ｂは更に他の実
施例の斜視図である。
１……表面波フイルタ、４……回路基板、７…
…シールドフレーム、８……リアシールド、１１
……アース片。
1 and 2 show a first embodiment of the present invention, with FIG. 1 being a longitudinal sectional view and FIG. 2 being a perspective view of the main parts thereof. 3 is a longitudinal sectional view of the second embodiment, FIG. 4 is a perspective view of its main parts, FIG. 5 is a longitudinal sectional view of the third embodiment, and FIG. 6 is a perspective view of its main parts. figure,
Furthermore, FIG. 7 is a longitudinal cross-sectional view of the fourth embodiment, FIG. 8 is a perspective view of the main part thereof, and FIGS. 9A and 9B are perspective views of still another embodiment. 1...Surface wave filter, 4...Circuit board, 7...
...Shield frame, 8...Rear shield, 11
...Earth piece.
Claims (1)
に、表面波フイルタのリード端子を基板表面側か
ら挿通し、基板裏面側において各リード端子とこ
れに対応する導体パターンとを半田付け接続する
表面波フイルタの実装構造において、 前記回路基板を組み込むシールドフレーム内に
リアシールドを付設するとともに、このリアシー
ルドから上方に向けてアース片を片持ち状に折出
し形成し、回路基板には前記アース片の上向き遊
端部を裏面側より挿入する透孔を形成し、この透
孔に挿入されたアース片の遊端を表面波フイルの
ケースに半田付け接続したことを特徴とする表面
波フイルタの実装構造。[Claim for Utility Model Registration] Lead terminals of a surface wave filter are inserted from the front side of the board into the through holes of a circuit board with a conductor pattern formed on the back side, and each lead terminal and the corresponding conductor pattern are inserted on the back side of the board. In the mounting structure of the surface wave filter in which the circuit board is connected by soldering, a rear shield is attached to the shield frame in which the circuit board is installed, and a grounding piece is bent upward from the rear shield in a cantilever shape, The circuit board is characterized by forming a through hole into which the upward free end of the ground piece is inserted from the back side, and the free end of the ground piece inserted into the through hole is connected to the surface wave film case by soldering. Mounting structure of surface wave filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9508389U JPH0334322U (en) | 1989-08-10 | 1989-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9508389U JPH0334322U (en) | 1989-08-10 | 1989-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0334322U true JPH0334322U (en) | 1991-04-04 |
Family
ID=31644364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9508389U Pending JPH0334322U (en) | 1989-08-10 | 1989-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334322U (en) |
-
1989
- 1989-08-10 JP JP9508389U patent/JPH0334322U/ja active Pending