JPH0327125U - - Google Patents
Info
- Publication number
- JPH0327125U JPH0327125U JP8731989U JP8731989U JPH0327125U JP H0327125 U JPH0327125 U JP H0327125U JP 8731989 U JP8731989 U JP 8731989U JP 8731989 U JP8731989 U JP 8731989U JP H0327125 U JPH0327125 U JP H0327125U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- conductive pattern
- back side
- wave filter
- surface wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 2
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図ないし第４図は本考案の第１実施例を示
し、第１図はフイルタ実装状態の正面図、第２図
は第１図におけるＡ−Ａ断面図、第３図は側面図
、第４図は分解斜視図である。第５図及び第６図
は他の実施例を示し、第５図は分解斜視図、第６
図は実装状態の要部の拡大断面図である。
１…表面波フイルタ、２…ケース、３，４，５
…リード端子、６…回路基板、１３…ジヤンパー
ワイヤ（コ字形導体）。
1 to 4 show a first embodiment of the present invention, FIG. 1 is a front view of the filter mounted state, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIG. 3 is a side view. FIG. 4 is an exploded perspective view. Figures 5 and 6 show other embodiments, with Figure 5 being an exploded perspective view and Figure 6 being an exploded perspective view.
The figure is an enlarged sectional view of the main parts in a mounted state. 1...Surface wave filter, 2...Case, 3, 4, 5
...Lead terminal, 6...Circuit board, 13...Jumper wire (U-shaped conductor).
Claims (1)
に、表面波フイルタのリード端子を基板表面側か
ら挿通し、基板裏面側において各リード端子と対
応する導電パターンとを半田付け接続する表面波
フイルタの実装構造において、 前記回路基板表面のフイルタ装着部位に、入出
力リード端子用の両透孔の間を横切る状態にコ字
形導体を配備するとともに、このコ字形導体の脚
部を回路基板に形成した透孔に挿通し、前記脚部
と回路基板裏面のアース用導電パターンとを半田
接続したことを特徴とする表面波フイルタの実装
構造。[Claim for Utility Model Registration] Lead terminals of a surface wave filter are inserted from the front side of the board into the through holes of a circuit board with a conductive pattern formed on the back side, and a conductive pattern corresponding to each lead terminal is connected to the back side of the board. In the mounting structure of a surface wave filter that is connected by soldering, a U-shaped conductor is provided at the filter attachment site on the surface of the circuit board in a state that crosses between both through holes for input/output lead terminals, and the U-shaped conductor is 1. A mounting structure for a surface wave filter, characterized in that the legs are inserted into through holes formed in a circuit board, and the legs are connected to a grounding conductive pattern on the back side of the circuit board by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8731989U JPH0327125U (en) | 1989-07-25 | 1989-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8731989U JPH0327125U (en) | 1989-07-25 | 1989-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0327125U true JPH0327125U (en) | 1991-03-19 |
Family
ID=31636969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8731989U Pending JPH0327125U (en) | 1989-07-25 | 1989-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0327125U (en) |
-
1989
- 1989-07-25 JP JP8731989U patent/JPH0327125U/ja active Pending