JPH036324U

JPH036324U -

Info

Publication number: JPH036324U
Application number: JP6696689U
Authority: JP
Priority date: 1989-06-08
Filing date: 1989-06-08
Publication date: 1991-01-22

Description

[Brief explanation of the drawing]

第１図は本考案に係る高周波回路装置の要部を
示す斜視図、第２図はその−線による断面図
、第３図は本考案の第１変形例を示す図面、第４
図は本考案の第２変形例を示す図面である。第５
図は高周波回路装置の一般的な組付け構造を示す
分解斜視図、第６図はその組付け状態を示す斜視
図、第７図は従来例を示す要部の斜視図、第８図
ａ，ｂは第７図の平面図、側面断面図、第９図は
従来例の不具合を示す側面断面図、第１０図ａ，
ｂは従来例の不具合を解消する一手段として考え
られる技術を示す側面断面図である。１……シールドフレーム、１０……シールドプ
レート、２……回路基板、２０……アースランド
、３……リアーシールド、３０……半田付け片、
４……半田、ｇ……隙間。 FIG. 1 is a perspective view showing the main parts of a high-frequency circuit device according to the present invention, FIG. 2 is a cross-sectional view taken along the - line, FIG.
The figure shows a second modification of the present invention. Fifth
The figure is an exploded perspective view showing a general assembly structure of a high frequency circuit device, FIG. 6 is a perspective view showing the assembled state, FIG. 7 is a perspective view of main parts showing a conventional example, and FIGS. b is a plan view and a side sectional view of Fig. 7, Fig. 9 is a side sectional view showing defects in the conventional example, and Fig. 10a,
b is a side sectional view showing a technique considered as a means for solving the problems of the conventional example. 1... Shield frame, 10... Shield plate, 2... Circuit board, 20... Earth land, 3... Rear shield, 30... Soldering piece,
4...Solder, g...Gap.

Claims

[Claims for Utility Model Registration] A circuit board in which a high frequency circuit is incorporated is held in a shield frame, and is divided into a plurality of sections corresponding to each high frequency circuit part by a shield plate provided on the shield frame, and the shield frame or In a high frequency circuit device in which a soldering piece connected to a rear shield installed on the inner surface of a shield plate is soldered to a ground land provided on a circuit board, the soldering piece has a protrusion that contacts the surface of the ground land. A high frequency circuit device characterized in that a gap is provided between the surface of the ground land and the part excluding the protrusion to allow solder to enter.