JPH0373156B2 - - Google Patents

Info

Publication number
JPH0373156B2
JPH0373156B2 JP57062078A JP6207882A JPH0373156B2 JP H0373156 B2 JPH0373156 B2 JP H0373156B2 JP 57062078 A JP57062078 A JP 57062078A JP 6207882 A JP6207882 A JP 6207882A JP H0373156 B2 JPH0373156 B2 JP H0373156B2
Authority
JP
Japan
Prior art keywords
solder
soldering
molten solder
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57062078A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58178593A (ja
Inventor
Yatsuharu Yokota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOKOTA KIKAI KK
Original Assignee
YOKOTA KIKAI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOKOTA KIKAI KK filed Critical YOKOTA KIKAI KK
Priority to JP6207882A priority Critical patent/JPS58178593A/ja
Publication of JPS58178593A publication Critical patent/JPS58178593A/ja
Publication of JPH0373156B2 publication Critical patent/JPH0373156B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP6207882A 1982-04-13 1982-04-13 プリント基板の半田付け方法及び装置 Granted JPS58178593A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6207882A JPS58178593A (ja) 1982-04-13 1982-04-13 プリント基板の半田付け方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6207882A JPS58178593A (ja) 1982-04-13 1982-04-13 プリント基板の半田付け方法及び装置

Publications (2)

Publication Number Publication Date
JPS58178593A JPS58178593A (ja) 1983-10-19
JPH0373156B2 true JPH0373156B2 (enrdf_load_html_response) 1991-11-20

Family

ID=13189670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6207882A Granted JPS58178593A (ja) 1982-04-13 1982-04-13 プリント基板の半田付け方法及び装置

Country Status (1)

Country Link
JP (1) JPS58178593A (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7538473B2 (en) 2004-02-03 2009-05-26 S.C. Johnson & Son, Inc. Drive circuits and methods for ultrasonic piezoelectric actuators

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6513702B2 (en) 2000-10-23 2003-02-04 Senju Metal Industry Co., Ltd. Automatic wave soldering apparatus and method
JP4936097B2 (ja) * 2005-06-07 2012-05-23 広幸 井元 スピードカバー

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6040947B2 (ja) * 1980-12-29 1985-09-13 アルプス電気株式会社 半田付装置
JPS6051939B2 (ja) * 1981-06-02 1985-11-16 権士 近藤 噴流式はんだ槽

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7538473B2 (en) 2004-02-03 2009-05-26 S.C. Johnson & Son, Inc. Drive circuits and methods for ultrasonic piezoelectric actuators

Also Published As

Publication number Publication date
JPS58178593A (ja) 1983-10-19

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