JPH037152B2 - - Google Patents

Info

Publication number
JPH037152B2
JPH037152B2 JP57089625A JP8962582A JPH037152B2 JP H037152 B2 JPH037152 B2 JP H037152B2 JP 57089625 A JP57089625 A JP 57089625A JP 8962582 A JP8962582 A JP 8962582A JP H037152 B2 JPH037152 B2 JP H037152B2
Authority
JP
Japan
Prior art keywords
submount
semiconductor laser
laser element
stem
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57089625A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58207689A (ja
Inventor
Makoto Shimaoka
Toshihiro Yamada
Tatsuji Sakamoto
Atsushi Sasayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57089625A priority Critical patent/JPS58207689A/ja
Publication of JPS58207689A publication Critical patent/JPS58207689A/ja
Publication of JPH037152B2 publication Critical patent/JPH037152B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)
  • Die Bonding (AREA)
JP57089625A 1982-05-28 1982-05-28 半導体レ−ザ装置 Granted JPS58207689A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57089625A JPS58207689A (ja) 1982-05-28 1982-05-28 半導体レ−ザ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57089625A JPS58207689A (ja) 1982-05-28 1982-05-28 半導体レ−ザ装置

Publications (2)

Publication Number Publication Date
JPS58207689A JPS58207689A (ja) 1983-12-03
JPH037152B2 true JPH037152B2 (enrdf_load_stackoverflow) 1991-01-31

Family

ID=13975927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57089625A Granted JPS58207689A (ja) 1982-05-28 1982-05-28 半導体レ−ザ装置

Country Status (1)

Country Link
JP (1) JPS58207689A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2600646B2 (ja) * 1985-07-29 1997-04-16 三菱電機株式会社 光学ヘツド装置
EP0210582B1 (en) * 1985-07-29 1991-02-27 Mitsubishi Denki Kabushiki Kaisha Optical head apparatus
US5576752A (en) * 1993-11-22 1996-11-19 Xerox Corporation Offset mounting of nonmonolithic multiwavelength lasers
DE19536463C2 (de) * 1995-09-29 2002-02-07 Infineon Technologies Ag Verfahren zum Herstellen einer Mehrzahl von Laserdiodenbauelementen
JP7091640B2 (ja) * 2017-12-06 2022-06-28 セイコーエプソン株式会社 発光装置および発光装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5474070U (enrdf_load_stackoverflow) * 1977-11-02 1979-05-26
JPS56161690A (en) * 1980-05-16 1981-12-12 Fujitsu Ltd Manufacture of semiconductor laser device

Also Published As

Publication number Publication date
JPS58207689A (ja) 1983-12-03

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