JPH0370198A - Cooling mechanism for electronic device - Google Patents

Abstract

PURPOSE:To enable an electronic device to be taken out of a cooling frame easily by providing a spring means for leaving from an electronic device side against press force of cam part to the frame at the cooling part. CONSTITUTION:The position of a cam 53 is set to a position which is in contact with a cooling paint 1 at the lowest point. In this state, an electronic circuit package 14 is inserted into a guide groove 55 of the electronic circuit package 14 of a cooling part frame 2. The electronic circuit package 14 is slid so that a multi-chip IC 12 may be positioned at the front of the cooling part 1. The cam 53 is rotated pressing the cooling part 1 from the rear and the front of the cooling part 1 is adhered to the multi-chip IC 12 on the electronic circuit package 14. In this state, the rotation of the cam 53 is stopped and water is allowed to flow to a water pipe 50 for cooling at the cooling part. When cooling of the multi-chip IC 12 is completed. water is stopped, the cam 53 is allowed to rotate in reverse direction, and a spring means 3 releases the cooling part 1 from the multichip IC 12.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a cooling mechanism for electronic devices, and particularly to a cooling mechanism for electronic devices suitable for cooling multi-chip ICs mounted on printed circuit wiring boards. It is.

[Conventional technology]

FIG. 2 shows a conventional cooling mechanism for electronic devices.

In the conventional example shown in FIG. 2, a cooling unit 52 is equipped with one or more cooling water pipes 50 and contacts an electronic device 51 to cool the electronic device 5I, and a cooling unit 52 is provided with one or more cooling water pipes 50 to cool the electronic device 51. 51, and a cooling unit frame 54 that encloses the cooling unit 52 and the cam unit 53 and removably fixes the electronic device 51 (FIG. 2(A)).

The electronic device 51 to be cooled is disposed in front of the cooling unit 52 by fitting its ends into electronic circuit package grooves 55 provided in the cooling unit frame 54 and sliding.

In the cam portion 53, two cams 53A, 53 rotate synchronously.
B, and is rotationally driven by an external force (not shown). As the cam (53) rotates (direction A in Figure 2 (A)), the cam (53) pushes the cooling part 52 from the left side in Figure 2, but the highest part of the cam (53) When the cooling section 52 is pressed, the cooling surface (the right end surface in FIG. 2) of the cooling section 52 comes into close contact with the electronic device 51 (FIG. 2(B)).

When the front surface of the cooling unit 52 pushed out by the cam (53) comes into close contact with the electronic device 51, the cam (53) stops at that position, and the cooling water pipe 50 installed in the cooling unit 52 closes.
The electronic device 51 is cooled by causing water to flow through the cooling section 52 and dissipating the heat of the electronic device 51 transmitted to the cooling section 52 into the water.

When the cooling of the electronic device 51 is completed, the cam (53) is rotated in the opposite direction (toward the right end in FIG. 2) to stop pressing the cooling unit 52 against the electronic device 51 (FIG. 2(C)).
The electronic device 51 is removed from the cooling frame.

[Problem to be Solved by the Invention] However, in the above conventional example, as shown in FIG. 2(C), when cooling is completed, the cam is rotated in the opposite direction (direction C in the figure) to is removed from the electronic device and the electronic device is taken out from the cooling frame, but at this time,
The cooling unit remains in close contact with the electronic device, causing an inconvenience in that it may be difficult to take out the electronic device.

[Object of the Invention] An object of the present invention is to provide a cooling mechanism for an electronic device that can improve the disadvantages seen in the conventional example and allow the electronic device to be easily taken out from the cooling frame.

[Means to solve the problem]

The present invention is equipped with one or more cooling water pipes,
a cooling unit that cools the electronic device by contacting the electronic device;
It has a cam part that transfers the cooling part to the electronic device side, and a cooling part frame that encloses the cooling part and the cam part and fixes the electronic device in a detachable manner. Then, a method is adopted in which the cooling unit frame is equipped with a spring means for separating the cooling unit from the electronic device side against the pressing force of the cam unit. This aims to achieve the above-mentioned purpose.

[For production]

The electronic device to be cooled is set in the cooling frame and moved so that it is positioned in front of the cooling unit. Rotate the cam in a predetermined direction to bring the cooling unit into close contact with the electronic device. Water flows through the cooling water pipes built into the cooling section to cool the electronic devices. When cooling is completed, the cam is rotated again, and as the gum rotates, the cooling unit is separated from the electronic device by a spring means installed between the cooling unit and the cooling unit frame. When the cooling unit is separated from the electronic device, the electronic device is removed.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described based on FIG.

Here, the same reference numerals are used for the same constituent members as in the conventional example described above.

In the embodiment shown in FIG. The Mercum section 53 and the cooling section 1 are transferred to the device 51 side.
and a cooling unit frame 2 which encloses the cam part 53 and fixes the electronic device 251 in a removable manner.

The spring means 3 for separating the cooling unit 1 from the electronic device 51 against the pressing force of the cam unit 53 is attached to the cooling unit frame 2.
is equipped with.

Here, as the electronic device 51, a substrate 10 made of ceramic or the like is used.
The company handles electronic circuit packages 14 in which a multi-chip IC 12 to which a plurality of electronic devices 11 such as LSIs and ICs are attached is mounted on a printed circuit wiring board 13. Then, the multi-chip I on this electronic circuit package 14
Cool C12.

The cooling unit frame 2 also has an electronic circuit package groove 55 for guiding the electronic circuit package 14 to the cooling unit 1.
are provided at the top and bottom. Further, a spring means 3 is provided between the cooling unit frame 2 and the cooling unit 1, so that the cooling unit 1 is always connected to the multi-chip I on the electronic circuit package 14.
Direction away from C12 (A direction in 11th m (A))
The force of the spring is acting on the .

In this embodiment, two identical cams (53) are provided as the cam portion 53, and are rotationally driven by an external force. The size and shape of this cam (53) vary depending on the thickness of the cooling section 1, the thickness of the multi-chip ICI 2, and their mounting positions, but the highest point of the cam (53) is located behind the cooling section 1. It is best to set the cooling unit 1 so that the front surface of the cooling unit 1 is in close contact with the multichip IC 12 when the cooling unit 1 is in contact with the multichip IC 12.

Next, the operation will be explained.

First, as shown in FIG. 1(A), the position of the cam (53) is set so that its lowest point contacts the cooling part 1.

In this state, the electronic circuit package 14 is attached to the cooling section frame 2.
into the guide groove 55 of the electronic circuit package 14.
The electronic circuit package 14 is slid so that the multichip IC 12 on the electronic circuit package 14 is positioned exactly in front of the cooling section 1. Rotate the cam (53) (direction a in FIG. 1A) to push the cooling unit 1 from behind (direction B in FIG. Bring it into close contact with the chip IC12 (Fig. 1 (
B)). In this state, the rotation of the cam (53) is stopped and water is allowed to flow through the cooling water pipe 50 of the cooling section 1.

When cooling of the multi-chip IC 12 is completed, the water in the cooling water pipe 50 is stopped and the cam (53) is turned in the opposite direction (Fig. 1 (B)).
b direction) or further in the positive direction (FIG. 1(B) direction a), the spring means 3 causes the cooling unit 1 to separate from the multi-chip IC 12 (FIG. 1(A)). ).

In the above embodiment, a compression spring is used as the spring means 3, but the present invention is not necessarily limited to this, and as long as it functions equally well, for example, one or more tension springs can be used. A spring or a plate spring may be used.

Further, in the above embodiment, two compression springs are used, but depending on the structure of the cooling unit frame, the number may be one or three or more.

〔Effect of the invention〕

As explained above, in the present invention, the cooling section that is equipped with a cooling water pipe and contacts the electronic device to cool the electronic device is brought into contact with the electronic device by the rotation of the cam, and the cooling section is separated from the electronic device. Spring means for biasing the cooling unit is disposed between the cooling unit and the cooling unit frame. This allows the cooling unit to be easily removed from the electronic device.
Therefore, it is possible to provide an unprecedented and excellent cooling mechanism for an electronic device in which the electronic device can be easily taken out.

[Brief explanation of drawings]

FIG. 1(A) is a cross-sectional view showing the state when an electronic device is loaded and cooling is completed in one embodiment of the present invention, and FIG. 1(B)
is a sectional view showing the state when the electronic device is cooled in the embodiment shown in FIG. 1(A), FIG. 2(A) is a sectional view showing the state when the electronic device is loaded in the conventional example, and FIG. 2(B) is a cross-sectional view showing the state during cooling of an electronic device in a conventional example, and FIG.
C) is a cross-sectional view showing the state at the completion of cooling of the electronic device in the conventional example. DESCRIPTION OF SYMBOLS 1...Cooling part, 2...Cooling part frame, 3...Spring means, 50...Cooling water pipe, 51...Electronic Device, 53...Cam section. Figure f (B> Figure 2 (A) (B)

Claims (3)

[Claims] (1). A cooling unit equipped with one or more cooling water pipes and contacting an electronic device to cool the electronic device, a cam unit transferring the cooling unit to the electronic device side, and the cooling unit and the cam unit. In the cooling mechanism for an electronic device, the cooling mechanism includes a cooling unit frame that includes a cooling unit and removably fixes the electronic device, the cooling unit being detached from the electronic device side against the pressing force of the cam unit. A cooling mechanism for an electronic device, characterized in that a spring means is installed in a cooling unit frame. (2). 2. The cooling mechanism for an electronic device according to claim 1, wherein a compression spring is used as the spring means. (3). 2. The cooling mechanism for an electronic device according to claim 1, wherein the compression spring is provided at at least two locations on the cooling unit frame.