JPH0370198A - Cooling mechanism for electronic device - Google Patents

Cooling mechanism for electronic device

Info

Publication number
JPH0370198A
JPH0370198A JP20612689A JP20612689A JPH0370198A JP H0370198 A JPH0370198 A JP H0370198A JP 20612689 A JP20612689 A JP 20612689A JP 20612689 A JP20612689 A JP 20612689A JP H0370198 A JPH0370198 A JP H0370198A
Authority
JP
Japan
Prior art keywords
cooling
electronic device
cam
cooling unit
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20612689A
Other languages
Japanese (ja)
Inventor
Takahiro Arai
孝博 荒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Communication Systems Ltd
Original Assignee
NEC Communication Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Communication Systems Ltd filed Critical NEC Communication Systems Ltd
Priority to JP20612689A priority Critical patent/JPH0370198A/en
Publication of JPH0370198A publication Critical patent/JPH0370198A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To enable an electronic device to be taken out of a cooling frame easily by providing a spring means for leaving from an electronic device side against press force of cam part to the frame at the cooling part. CONSTITUTION:The position of a cam 53 is set to a position which is in contact with a cooling paint 1 at the lowest point. In this state, an electronic circuit package 14 is inserted into a guide groove 55 of the electronic circuit package 14 of a cooling part frame 2. The electronic circuit package 14 is slid so that a multi-chip IC 12 may be positioned at the front of the cooling part 1. The cam 53 is rotated pressing the cooling part 1 from the rear and the front of the cooling part 1 is adhered to the multi-chip IC 12 on the electronic circuit package 14. In this state, the rotation of the cam 53 is stopped and water is allowed to flow to a water pipe 50 for cooling at the cooling part. When cooling of the multi-chip IC 12 is completed. water is stopped, the cam 53 is allowed to rotate in reverse direction, and a spring means 3 releases the cooling part 1 from the multichip IC 12.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電子装置用冷却機構に係り、特に印刷回路配
線板に実装されたマルチチップICの冷却に好適な電子
装置用冷却機構に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a cooling mechanism for electronic devices, and particularly to a cooling mechanism for electronic devices suitable for cooling multi-chip ICs mounted on printed circuit wiring boards. It is.

〔従来の技術〕[Conventional technology]

第2図に、従来における電子装置用冷却機構を示す。 FIG. 2 shows a conventional cooling mechanism for electronic devices.

この第2図に示す従来例では、1または2本以上の冷却
用水管50を装備し、電子装置51に接触して当該電子
装置5Iを冷却する冷却部52と、この冷却部52を電
子装置51に接触せしめるカム部53と、冷却部52お
よびカム部53を内包するとともに電子装置51を着脱
可能に固定する冷却部フレーム54とを有している(第
2図(A))。
In the conventional example shown in FIG. 2, a cooling unit 52 is equipped with one or more cooling water pipes 50 and contacts an electronic device 51 to cool the electronic device 5I, and a cooling unit 52 is provided with one or more cooling water pipes 50 to cool the electronic device 51. 51, and a cooling unit frame 54 that encloses the cooling unit 52 and the cam unit 53 and removably fixes the electronic device 51 (FIG. 2(A)).

冷却される電子装置51は、冷却部フレーム54に設け
られている電子回路パッケージ溝55にその両端を嵌め
込んで、スライドすることによって冷却部52の正面に
配設されるようになっている。
The electronic device 51 to be cooled is disposed in front of the cooling unit 52 by fitting its ends into electronic circuit package grooves 55 provided in the cooling unit frame 54 and sliding.

カム部53では、同期回転する二つのカム53A、53
Bを有し、図示しない外力によって回転駆動される。そ
して、カム(53)の回転(第2図(A)中A方向)に
伴ってカム(53)が冷却部52を第2図の左方から押
すが、カム(53)の最も高い部分が冷却部52を押し
た時に冷却部52の冷却面(第2図中右端面)が電子装
置51に密着するようになっている(第2図(B))。
In the cam portion 53, two cams 53A, 53 rotate synchronously.
B, and is rotationally driven by an external force (not shown). As the cam (53) rotates (direction A in Figure 2 (A)), the cam (53) pushes the cooling part 52 from the left side in Figure 2, but the highest part of the cam (53) When the cooling section 52 is pressed, the cooling surface (the right end surface in FIG. 2) of the cooling section 52 comes into close contact with the electronic device 51 (FIG. 2(B)).

カム(53)によって押し出された冷却部52の前面が
電子装置51に密着するとカム(53)はその位置で停
止し、冷却部52の中に装備されている冷却用水管50
に水を流し、冷却部52に伝わって来る電子装置51の
熱を水に逃がすことによって電子装置51を冷却する。
When the front surface of the cooling unit 52 pushed out by the cam (53) comes into close contact with the electronic device 51, the cam (53) stops at that position, and the cooling water pipe 50 installed in the cooling unit 52 closes.
The electronic device 51 is cooled by causing water to flow through the cooling section 52 and dissipating the heat of the electronic device 51 transmitted to the cooling section 52 into the water.

電子装置51の冷却が完了すると、カム(53)を逆方
向(第2図中右端向)に回転させて、冷却部52を電子
装置51に押し付けることを停止しく第2図(C))、
電子装置51を冷却フレームから取り出す。
When the cooling of the electronic device 51 is completed, the cam (53) is rotated in the opposite direction (toward the right end in FIG. 2) to stop pressing the cooling unit 52 against the electronic device 51 (FIG. 2(C)).
The electronic device 51 is removed from the cooling frame.

〔発明が解決しようとする課題〕 しかしながら、上記従来例においては、第2図(C)に
示されるように、冷却が完了するとカムを逆方向(図中
C方向)に回転させて、冷却部を電子装置から離脱させ
て電子装置を冷却フレームから取り出すが、この際に、
冷却部が電子装置に密着したままの状態となり、電子装
置を取り出すことが困難な場合が発生するという不都合
が生じていた。
[Problem to be Solved by the Invention] However, in the above conventional example, as shown in FIG. 2(C), when cooling is completed, the cam is rotated in the opposite direction (direction C in the figure) to is removed from the electronic device and the electronic device is taken out from the cooling frame, but at this time,
The cooling unit remains in close contact with the electronic device, causing an inconvenience in that it may be difficult to take out the electronic device.

〔発明の目的] 本発明の目的は、このような従来例にみられる不都合を
改善し、電子装置を冷却フレームから容易に取り出すこ
とのできる電子装置用冷却機構を提供することにある。
[Object of the Invention] An object of the present invention is to provide a cooling mechanism for an electronic device that can improve the disadvantages seen in the conventional example and allow the electronic device to be easily taken out from the cooling frame.

〔課題を解決するための手段〕[Means to solve the problem]

本発明では、1または2本以上の冷却用水管を装備し、
電子装置に接触して当該電子装置を冷却する冷却部と、
この冷却部を電子装置側に移送せしめるカム部と、冷却
部およびカム部を内包するとともに電子装置を着脱可能
に固定する冷却部フレームとを有している。そして、冷
却部をカム部の押圧力に抗して電子装置側から離脱せし
めるバネ手段を冷却部フレームに装備するという手法を
採っている。これによって、前述した目的を達成しよう
とするものである。
The present invention is equipped with one or more cooling water pipes,
a cooling unit that cools the electronic device by contacting the electronic device;
It has a cam part that transfers the cooling part to the electronic device side, and a cooling part frame that encloses the cooling part and the cam part and fixes the electronic device in a detachable manner. Then, a method is adopted in which the cooling unit frame is equipped with a spring means for separating the cooling unit from the electronic device side against the pressing force of the cam unit. This aims to achieve the above-mentioned purpose.

〔作  用〕[For production]

冷却する電子装置を冷却フレームにセットして、冷却部
の正面に位置するように移動させる。カムを所定の方向
に回転させて、冷却部を電子装置に密着させる。冷却部
に内装されている冷却用水管に水を流し、電子装置を冷
却する。冷却が完了すると、再びカムを回転させ、この
ガムの回転に伴って、冷却部と冷却部フレームとの間に
装備されたバネ手段によって冷却部を電子装置から離脱
せしめる。冷却部が電子装置から離れると電子装置を取
り出す。
The electronic device to be cooled is set in the cooling frame and moved so that it is positioned in front of the cooling unit. Rotate the cam in a predetermined direction to bring the cooling unit into close contact with the electronic device. Water flows through the cooling water pipes built into the cooling section to cool the electronic devices. When cooling is completed, the cam is rotated again, and as the gum rotates, the cooling unit is separated from the electronic device by a spring means installed between the cooling unit and the cooling unit frame. When the cooling unit is separated from the electronic device, the electronic device is removed.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の一実施例を第1図に基づいて説明する。 Hereinafter, one embodiment of the present invention will be described based on FIG.

ここで、前述した従来例と同一の構成部材については同
一の符号を用いることとする。
Here, the same reference numerals are used for the same constituent members as in the conventional example described above.

この第1図に示す実施例においては、■または2本以上
の冷却用水管50を装備し、電子装置51に接触して当
該電子装置51を冷却する冷却部1と、この冷却部lを
電子装置51側に移送せしメルカム部53と、冷却部1
およびカム部53を内包するとともに、電子装251を
着脱可能に固定する冷却部フレーム2とを備えている。
In the embodiment shown in FIG. The Mercum section 53 and the cooling section 1 are transferred to the device 51 side.
and a cooling unit frame 2 which encloses the cam part 53 and fixes the electronic device 251 in a removable manner.

そして、冷却部1をカム部53の押圧力に抗して電子装
置51から離脱せしめるバネ手段3を冷却部フレーム2
に装備している。
The spring means 3 for separating the cooling unit 1 from the electronic device 51 against the pressing force of the cam unit 53 is attached to the cooling unit frame 2.
is equipped with.

ここでは、電子装置51としてセラミック等の基板10
に複数のLSIおよびIC等の電子デバイス11を取り
付けたマルチチップIC12が印刷回路配線板13に実
装された電子回路パッケージ14を取り扱っている。そ
して、この電子回路パッケージ14上のマルチチップI
C12を冷却する。
Here, as the electronic device 51, a substrate 10 made of ceramic or the like is used.
The company handles electronic circuit packages 14 in which a multi-chip IC 12 to which a plurality of electronic devices 11 such as LSIs and ICs are attached is mounted on a printed circuit wiring board 13. Then, the multi-chip I on this electronic circuit package 14
Cool C12.

また、冷却部フレーム2には、上述の電子回路パッケー
ジ14を冷却部1に案内する電子回路パッケージ溝55
が上下に設けられている。さらに、冷却部フレーム2と
冷却部1との間にはバネ手段3が設けられており、常に
冷却部lを電子回路パッケージ14上のマルチチップI
C12から遠ざける方向(第11m (A)中A方向)
にバネの力が作用している。
The cooling unit frame 2 also has an electronic circuit package groove 55 for guiding the electronic circuit package 14 to the cooling unit 1.
are provided at the top and bottom. Further, a spring means 3 is provided between the cooling unit frame 2 and the cooling unit 1, so that the cooling unit 1 is always connected to the multi-chip I on the electronic circuit package 14.
Direction away from C12 (A direction in 11th m (A))
The force of the spring is acting on the .

カム部53としては、本実施例では二つの全く同一のカ
ム(53)が装備されて、外力によって回転駆動される
。このカム(53)の大きさおよび形状は、冷却部1の
厚さ、マルチチップICI2の厚さおよびそれらの取付
は位置によって変化するが、カム(53)の最高地点が
冷却部1の背後に接っしているときに冷却部1の前面が
丁度マルチチップIC12に密着するように設定するの
がもっとも良い。
In this embodiment, two identical cams (53) are provided as the cam portion 53, and are rotationally driven by an external force. The size and shape of this cam (53) vary depending on the thickness of the cooling section 1, the thickness of the multi-chip ICI 2, and their mounting positions, but the highest point of the cam (53) is located behind the cooling section 1. It is best to set the cooling unit 1 so that the front surface of the cooling unit 1 is in close contact with the multichip IC 12 when the cooling unit 1 is in contact with the multichip IC 12.

次に、動作説明をする。Next, the operation will be explained.

まず、第1図(A)に示されるように、カム(53)の
位置をその最下点で冷却部1に接する位置に設定する。
First, as shown in FIG. 1(A), the position of the cam (53) is set so that its lowest point contacts the cooling part 1.

この状態で電子回路パッケージ14を冷却部フレーム2
の電子回路パッケージ14ガイド溝55に挿入する。 
電子回路パッケージ14上のマルチチップIC12が丁
度冷却部1の正面に位置するように電子回路パッケージ
14をスライドさせる。カム(53)を回転させて(第
1図(A)a方向)、冷却部1を背後から押しく第1図
(A)B方向)、冷却部1の前面を電子回路パッケージ
14上のマルチチップIC12に密着させる(第1図(
B))。この状態でカム(53)の回転を停止させ、冷
却部1の冷却用水管50に水を流す。
In this state, the electronic circuit package 14 is attached to the cooling section frame 2.
into the guide groove 55 of the electronic circuit package 14.
The electronic circuit package 14 is slid so that the multichip IC 12 on the electronic circuit package 14 is positioned exactly in front of the cooling section 1. Rotate the cam (53) (direction a in FIG. 1A) to push the cooling unit 1 from behind (direction B in FIG. Bring it into close contact with the chip IC12 (Fig. 1 (
B)). In this state, the rotation of the cam (53) is stopped and water is allowed to flow through the cooling water pipe 50 of the cooling section 1.

マルチチップIC12の冷却が完了すると、冷却用水管
50の水を止め、カム(53)を逆方向(第1図(B)
b方向)に回転させるか、若しくは、さらに正方向(第
1図(B)a方向)に回転させることにより、バネ手段
3が冷却部1をマルチチップIC12から離脱せしめる
(第1図(A))。
When cooling of the multi-chip IC 12 is completed, the water in the cooling water pipe 50 is stopped and the cam (53) is turned in the opposite direction (Fig. 1 (B)).
b direction) or further in the positive direction (FIG. 1(B) direction a), the spring means 3 causes the cooling unit 1 to separate from the multi-chip IC 12 (FIG. 1(A)). ).

なお、上記実施例では、バネ手段3として圧縮バネを使
用する場合を例示したが、本発明は必ずしもこれに限定
するものではなく、同等に機能するもめであれば、例え
ば1または2以上の引っ張りバネや板バネを使用したも
のであってもよい。
In the above embodiment, a compression spring is used as the spring means 3, but the present invention is not necessarily limited to this, and as long as it functions equally well, for example, one or more tension springs can be used. A spring or a plate spring may be used.

また、上記実施例では、2個の圧縮バネを使用する場合
を例示したが、冷却部フレームの構造によっては1個で
あっても、また3個以上であってもよい。
Further, in the above embodiment, two compression springs are used, but depending on the structure of the cooling unit frame, the number may be one or three or more.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明では、冷却用水管を装備し
電子装置に接触してこの電子装置を冷却する冷却部をカ
ムの回転によって電子装置に接触せしめるとともに、こ
の冷却部を電子装置から離脱せしめるバネ手段を冷却部
と冷却部フレームとの間に配設している。これによって
、冷却部を容易に電子装置から離脱させることができ、
このため、電子装置の取り出しが容易に行われるという
従来にない優れた電子装置用冷却機構を提供することが
できる。
As explained above, in the present invention, the cooling section that is equipped with a cooling water pipe and contacts the electronic device to cool the electronic device is brought into contact with the electronic device by the rotation of the cam, and the cooling section is separated from the electronic device. Spring means for biasing the cooling unit is disposed between the cooling unit and the cooling unit frame. This allows the cooling unit to be easily removed from the electronic device.
Therefore, it is possible to provide an unprecedented and excellent cooling mechanism for an electronic device in which the electronic device can be easily taken out.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(A)は本発明の一実施例における電子装置装填
時および冷却完了時の状態を表す断面図、第1図(B)
は第1図(A)に示す実施例における電子装置冷却時の
状態を表す断面図、第2図(A)は従来例における電子
装置装填時の状態を表す断面図、第2図(B)は従来例
における電子装置冷却時の状態を表す断面図、第2図(
C)は従来例における電子装置冷却完了時の状態を表す
断面図である。 1・・・・・・冷却部、2・・・・・・冷却部フレーム
、3・・・・・・バネ手段、50・・・・・・冷却用水
管、51・・・・・・電子装置、53・・・・・・カム
部。 第 f 図 (B> 第2図 (A) (B) にイ
FIG. 1(A) is a cross-sectional view showing the state when an electronic device is loaded and cooling is completed in one embodiment of the present invention, and FIG. 1(B)
is a sectional view showing the state when the electronic device is cooled in the embodiment shown in FIG. 1(A), FIG. 2(A) is a sectional view showing the state when the electronic device is loaded in the conventional example, and FIG. 2(B) is a cross-sectional view showing the state during cooling of an electronic device in a conventional example, and FIG.
C) is a cross-sectional view showing the state at the completion of cooling of the electronic device in the conventional example. DESCRIPTION OF SYMBOLS 1...Cooling part, 2...Cooling part frame, 3...Spring means, 50...Cooling water pipe, 51...Electronic Device, 53...Cam section. Figure f (B> Figure 2 (A) (B)

Claims (3)

【特許請求の範囲】[Claims] (1).1または2本以上の冷却用水管を装備し、電子
装置に接触して当該電子装置を冷却する冷却部と、この
冷却部を前記電子装置側に移送せしめるカム部と、前記
冷却部およびカム部を内包するとともに前記電子装置を
着脱可能に固定する冷却部フレームとを有して成る電子
装置用冷却機構において、 前記冷却部を前記カム部の押圧力に抗して前記電子装置
側から離脱せしめるバネ手段を冷却部フレームに装備し
たことを特徴とする電子装置用冷却機構。
(1). A cooling unit equipped with one or more cooling water pipes and contacting an electronic device to cool the electronic device, a cam unit transferring the cooling unit to the electronic device side, and the cooling unit and the cam unit. In the cooling mechanism for an electronic device, the cooling mechanism includes a cooling unit frame that includes a cooling unit and removably fixes the electronic device, the cooling unit being detached from the electronic device side against the pressing force of the cam unit. A cooling mechanism for an electronic device, characterized in that a spring means is installed in a cooling unit frame.
(2).前記バネ手段として圧縮バネを用いたことを特
徴とする請求項1記載の電子装置用冷却機構。
(2). 2. The cooling mechanism for an electronic device according to claim 1, wherein a compression spring is used as the spring means.
(3).前記圧縮バネを前記冷却部フレームの少なくと
も二ケ所に装備したことを特徴とする請求項1記載の電
子装置用冷却機構。
(3). 2. The cooling mechanism for an electronic device according to claim 1, wherein the compression spring is provided at at least two locations on the cooling unit frame.
JP20612689A 1989-08-09 1989-08-09 Cooling mechanism for electronic device Pending JPH0370198A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20612689A JPH0370198A (en) 1989-08-09 1989-08-09 Cooling mechanism for electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20612689A JPH0370198A (en) 1989-08-09 1989-08-09 Cooling mechanism for electronic device

Publications (1)

Publication Number Publication Date
JPH0370198A true JPH0370198A (en) 1991-03-26

Family

ID=16518220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20612689A Pending JPH0370198A (en) 1989-08-09 1989-08-09 Cooling mechanism for electronic device

Country Status (1)

Country Link
JP (1) JPH0370198A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8000103B2 (en) * 2007-12-19 2011-08-16 Clustered Systems Company Cooling system for contact cooled electronic modules
JP2014160192A (en) * 2013-02-20 2014-09-04 Hitachi Metals Ltd Signal transmission device
JP2014160191A (en) * 2013-02-20 2014-09-04 Hitachi Metals Ltd Signal transmission device and communication modules

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8000103B2 (en) * 2007-12-19 2011-08-16 Clustered Systems Company Cooling system for contact cooled electronic modules
JP2014160192A (en) * 2013-02-20 2014-09-04 Hitachi Metals Ltd Signal transmission device
JP2014160191A (en) * 2013-02-20 2014-09-04 Hitachi Metals Ltd Signal transmission device and communication modules

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