JPH0370197A - Cooling mechanism for electronic device - Google Patents

Cooling mechanism for electronic device

Info

Publication number
JPH0370197A
JPH0370197A JP20612589A JP20612589A JPH0370197A JP H0370197 A JPH0370197 A JP H0370197A JP 20612589 A JP20612589 A JP 20612589A JP 20612589 A JP20612589 A JP 20612589A JP H0370197 A JPH0370197 A JP H0370197A
Authority
JP
Japan
Prior art keywords
cooling
electronic device
cooling part
part
slanted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20612589A
Inventor
Takahiro Arai
Original Assignee
Nec Commun Syst Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Commun Syst Ltd filed Critical Nec Commun Syst Ltd
Priority to JP20612589A priority Critical patent/JPH0370197A/en
Publication of JPH0370197A publication Critical patent/JPH0370197A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To maximize contact area and improve cooling efficiency by mounting a cooling part to the inside of a cover at the cooling part using only spring means and by pressing the cooling part to an electronic device by revolution of a cam for contacting.
CONSTITUTION: An electronic device 51 to be cooled is set to a cooling frame 2 and is moved to the front of a cooling part 1. The cooling part 1 is pushed toward an electronic device 51 for adhesion. At this time, when the cooling part of the electronic device 51 is slanted, the cooling part 1 is slanted by deformation of a spring means which is provided between a cooling plate cover 3 and the cooling part 1 and is pressed toward the electronic device 51, thus enabling the cooling part 1 to contact with the entire surface of the cooling part of the electronic device 51. Water is allowed to flow to a water pipe for cooling 50 which is incorporated in the cooling art, thus cooling the electronic device 51. When cooling is completed, the cam 53 is allowed to rotate again, thus stopping pressing of the cooling part against the electronic device. The electronic device is taken out of the cooling frame and cooling is completed.
COPYRIGHT: (C)1991,JPO&Japio
JP20612589A 1989-08-09 1989-08-09 Cooling mechanism for electronic device Pending JPH0370197A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20612589A JPH0370197A (en) 1989-08-09 1989-08-09 Cooling mechanism for electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20612589A JPH0370197A (en) 1989-08-09 1989-08-09 Cooling mechanism for electronic device

Publications (1)

Publication Number Publication Date
JPH0370197A true JPH0370197A (en) 1991-03-26

Family

ID=16518207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20612589A Pending JPH0370197A (en) 1989-08-09 1989-08-09 Cooling mechanism for electronic device

Country Status (1)

Country Link
JP (1) JPH0370197A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5826643A (en) * 1996-06-07 1998-10-27 International Business Machines Corporation Method of cooling electronic devices using a tube in plate heat sink
WO2003071602A1 (en) * 2002-01-10 2003-08-28 Tyco Electronics Corporation Method and apparatus for mounting a lidless semiconductor device
JP2009536754A (en) * 2006-02-16 2009-10-15 クーリギー インコーポレイテッド Mounting device
US8000103B2 (en) * 2007-12-19 2011-08-16 Clustered Systems Company Cooling system for contact cooled electronic modules

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5826643A (en) * 1996-06-07 1998-10-27 International Business Machines Corporation Method of cooling electronic devices using a tube in plate heat sink
US6173759B1 (en) 1996-06-07 2001-01-16 International Business Machines Corporation Method of cooling electronic devices using a tube in plate heat sink
WO2003071602A1 (en) * 2002-01-10 2003-08-28 Tyco Electronics Corporation Method and apparatus for mounting a lidless semiconductor device
CN100343988C (en) * 2002-01-10 2007-10-17 蒂科电子公司 Method and apparatus for mounting a lidless semiconductor device
JP2009536754A (en) * 2006-02-16 2009-10-15 クーリギー インコーポレイテッド Mounting device
US8000103B2 (en) * 2007-12-19 2011-08-16 Clustered Systems Company Cooling system for contact cooled electronic modules

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