JPH0364452U - - Google Patents
Info
- Publication number
- JPH0364452U JPH0364452U JP12524489U JP12524489U JPH0364452U JP H0364452 U JPH0364452 U JP H0364452U JP 12524489 U JP12524489 U JP 12524489U JP 12524489 U JP12524489 U JP 12524489U JP H0364452 U JPH0364452 U JP H0364452U
- Authority
- JP
- Japan
- Prior art keywords
- reed switch
- switch
- temperature
- tip
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000014676 Phragmites communis Nutrition 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000696 magnetic material Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
Description
第１図は、本考案による封止成形型温度スイツ
チの一実施例による端子部品に、リードスイツチ
のリード部を接続した部分を示す斜視図。第２図
は、本考案による封止成形型温度スイツチの端子
部品の斜視図。第３図は、従来の封止成形型温度
スイツチの封止樹脂により、封止成形する前の温
度スイツチの斜視図。第４図は、従来の封止成形
型温度スイツチの端子部品の拡大斜視図。
１……リードスイツチ、１ａ……リード部、１
ｂ……ガラス封着部、２……感温磁性体、３……
永久磁石、５，７……端子部品、６……封止樹脂
、７ａ……孔、７ｂ……溝。
FIG. 1 is a perspective view showing a portion where a lead portion of a reed switch is connected to a terminal component according to an embodiment of the sealing mold temperature switch according to the present invention. FIG. 2 is a perspective view of the terminal component of the sealed molded temperature switch according to the present invention. FIG. 3 is a perspective view of a temperature switch before being sealed with a sealing resin of a conventional sealing mold temperature switch. FIG. 4 is an enlarged perspective view of a terminal component of a conventional sealing mold temperature switch. 1...Reed switch, 1a...Reed part, 1
b...Glass sealed part, 2...Temperature-sensitive magnetic material, 3...
Permanent magnet, 5, 7...terminal component, 6...sealing resin, 7a...hole, 7b...groove.
Claims (1)
配置された感温磁性体、及び永久磁石と、前記リ
ードスイツチのリード部に接続された端子部品と
を、温度スイツチを構成する部品の熱膨張係数に
近似する熱膨張係数を有する熱可塑性、又は熱硬
化性の封止樹脂により封止成形し、設定された温
度で前記リードスイツチを開閉するように構成し
た封止成形型温度スイツチに於いて、リードスイ
ツチのリード部先端を鈎状に成形し、端子部品に
リードスイツチの鈎形に形成したリード部先端を
挿通する孔と、孔と端子部品端面の間の板面に溝
を設け、鈎状のリード部先端を端子部品の孔へ挿
通し、リード部を溝に沿わせ固定するよう構成し
たことを特徴とする封止成形型温度スイツチ。 The reed switch, the temperature-sensitive magnetic material and permanent magnet arranged around the reed switch, and the terminal parts connected to the leads of the reed switch are approximated to the coefficient of thermal expansion of the parts constituting the temperature switch. In the sealing mold temperature switch, which is molded with a thermoplastic or thermosetting sealing resin having a coefficient of thermal expansion, the reed switch is configured to open and close at a set temperature. The tip of the lead of the reed switch is formed into a hook shape, and the terminal component is provided with a hole through which the hook-shaped lead tip of the reed switch is inserted, and a groove is formed on the plate surface between the hole and the end surface of the terminal component. A sealed molding type temperature switch characterized in that the tip of the lead part is inserted into a hole of a terminal component, and the lead part is fixed along the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12524489U JPH0364452U (en) | 1989-10-25 | 1989-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12524489U JPH0364452U (en) | 1989-10-25 | 1989-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0364452U true JPH0364452U (en) | 1991-06-24 |
Family
ID=31673127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12524489U Pending JPH0364452U (en) | 1989-10-25 | 1989-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0364452U (en) |
-
1989
- 1989-10-25 JP JP12524489U patent/JPH0364452U/ja active Pending
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