JPS62102237U - - Google Patents
Info
- Publication number
- JPS62102237U JPS62102237U JP19300785U JP19300785U JPS62102237U JP S62102237 U JPS62102237 U JP S62102237U JP 19300785 U JP19300785 U JP 19300785U JP 19300785 U JP19300785 U JP 19300785U JP S62102237 U JPS62102237 U JP S62102237U
- Authority
- JP
- Japan
- Prior art keywords
- switch
- temperature
- reed switch
- coefficient
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000014676 Phragmites communis Nutrition 0.000 claims description 7
- 239000000696 magnetic material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Contacts (AREA)
Description
第１図は本考案の一実施例の要部のみを示す斜
視図、第２図は第１図で使用された端子部品の斜
視図、第３図はプラスチツクにて封止成形する前
の従来の温度スイツチの斜視図、第４図は第３図
の部分拡大図である。
１……リードスイツチ、１ａ……リード部、５
，７……端子部品、７ａ……Ｖ形溝、６……プラ
スチツク。
Fig. 1 is a perspective view showing only the main parts of an embodiment of the present invention, Fig. 2 is a perspective view of the terminal component used in Fig. 1, and Fig. 3 is a conventional one before sealing with plastic. FIG. 4 is a partially enlarged view of FIG. 3. 1...Reed switch, 1a...Reed part, 5
, 7...Terminal parts, 7a...V-shaped groove, 6...Plastic.
Claims (1)
に配置された感温磁性体および永久磁石と、上記
リードスイツチのリード部に接続された端子部品
とを、これらの温度スイツチ構成部品の熱膨張係
数に近似する熱膨張係数を有する熱可塑性あるい
は熱硬化性樹脂によつて封止成形し、予じめ定め
られた温度で上記リードスイツチを開閉するよう
にした温度スイツチにおいて、上記端子部品に上
記リードスイツチのリード部を受け入れたＶ字形
溝を設けたことを特徴とする封止成形型温度スイ
ツチ。 The reed switch, the temperature-sensitive magnetic material and permanent magnet arranged around the reed switch, and the terminal parts connected to the leads of the reed switch are approximated to the coefficient of thermal expansion of these temperature switch components. In a temperature switch which is sealed and molded with thermoplastic or thermosetting resin having a coefficient of thermal expansion and which opens and closes the reed switch at a predetermined temperature, the lead of the reed switch is attached to the terminal component. 1. A sealed molded temperature switch characterized by having a V-shaped groove that receives a portion of the temperature switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19300785U JPS62102237U (en) | 1985-12-17 | 1985-12-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19300785U JPS62102237U (en) | 1985-12-17 | 1985-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62102237U true JPS62102237U (en) | 1987-06-29 |
Family
ID=31148621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19300785U Pending JPS62102237U (en) | 1985-12-17 | 1985-12-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62102237U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS597711U (en) * | 1982-07-06 | 1984-01-19 | 東洋ケミカル株式会社 | compact |
-
1985
- 1985-12-17 JP JP19300785U patent/JPS62102237U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS597711U (en) * | 1982-07-06 | 1984-01-19 | 東洋ケミカル株式会社 | compact |
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