JPH02101444U - - Google Patents
Info
- Publication number
- JPH02101444U JPH02101444U JP1056389U JP1056389U JPH02101444U JP H02101444 U JPH02101444 U JP H02101444U JP 1056389 U JP1056389 U JP 1056389U JP 1056389 U JP1056389 U JP 1056389U JP H02101444 U JPH02101444 U JP H02101444U
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- switch
- molded
- temperature switch
- permanent magnet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000014676 Phragmites communis Nutrition 0.000 claims description 3
- 239000000696 magnetic material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 2
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
Landscapes
- Manufacture Of Switches (AREA)
Description
第１図は本考案の一実施例を示す外観透視斜視
図。第２図は従来例を示す外観透視斜視図。
１，１１……リードスイツチ、２，２１……感
温磁性体、３，３１……永久磁石、４，４１……
成形樹脂、５１，５２，５３，５４……位置出し
ピン跡、５５……温度スイツチの取付け面。
FIG. 1 is an external perspective view showing an embodiment of the present invention. FIG. 2 is an external perspective view showing a conventional example. 1, 11... Reed switch, 2, 21... Temperature-sensitive magnetic material, 3, 31... Permanent magnet, 4, 41...
Molded resin, 51, 52, 53, 54... Positioning pin marks, 55... Temperature switch mounting surface.
Claims (1)
永久磁石を予め接着・固定することなく、熱可塑
性或は熱硬化性樹脂にて一体に封止成形した温度
スイツチで、リードスイツチと感温磁性体、及び
永久磁石の相対的位置関係を決定するために、少
なくとも１個の位置出しピンを有する封止成形金
型にて成形された封止成形型温度スイツチにおい
て、該位置出しピン跡が温度スイツチとしての取
付け面とは違う面に形成される事を特徴とする封
止成形型温度スイツチ。 Basic components: reed switch, temperature-sensitive magnetic material,
A temperature switch that is integrally molded with thermoplastic or thermosetting resin without adhering or fixing the permanent magnet in advance, and determines the relative positional relationship between the reed switch, the temperature-sensitive magnetic material, and the permanent magnet. Therefore, in a sealing mold temperature switch molded with a sealing mold having at least one positioning pin, the positioning pin mark is formed on a surface different from the mounting surface as the temperature switch. A sealed molded temperature switch featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1056389U JPH02101444U (en) | 1989-01-30 | 1989-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1056389U JPH02101444U (en) | 1989-01-30 | 1989-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02101444U true JPH02101444U (en) | 1990-08-13 |
Family
ID=31218336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1056389U Pending JPH02101444U (en) | 1989-01-30 | 1989-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02101444U (en) |
-
1989
- 1989-01-30 JP JP1056389U patent/JPH02101444U/ja active Pending
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