JPH02138832U - - Google Patents
Info
- Publication number
- JPH02138832U JPH02138832U JP4926889U JP4926889U JPH02138832U JP H02138832 U JPH02138832 U JP H02138832U JP 4926889 U JP4926889 U JP 4926889U JP 4926889 U JP4926889 U JP 4926889U JP H02138832 U JPH02138832 U JP H02138832U
- Authority
- JP
- Japan
- Prior art keywords
- ring
- temperature switch
- shaped
- thermal expansion
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 3
- 239000000696 magnetic material Substances 0.000 claims description 2
- 235000014676 Phragmites communis Nutrition 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Thermally Actuated Switches (AREA)
- Manufacture Of Switches (AREA)
Description
第1図は本考案による封止成形型温度スイツチ
の斜視図。第2図は本考案による温度スイツチ素
子の斜視図。第3図は本考案における温度スイツ
チ素子の接着剤を塗布した状態を示す部分斜視図
。第4図は本考案による温度スイツチ素子を構成
する非磁性のスペーサを示す斜視図。第5図は従
来の封止成形型温度スイツチを構成する温度スイ
ツチ素子の斜視図。第6図は従来の温度スイツチ
素子の接着剤を塗布した部分斜視図。
1……感温磁性体、2……永久磁石、3,31
……スペーサ、4……リードスイツチ、5……ワ
イヤー接続用端子、6……接着剤、7……封止成
形樹脂、10……封止成形型温度スイツチ、11
,12……温度スイツチ素子。
FIG. 1 is a perspective view of a sealing mold temperature switch according to the present invention. FIG. 2 is a perspective view of a temperature switch element according to the present invention. FIG. 3 is a partial perspective view showing the temperature switch element according to the present invention in a state where adhesive is applied. FIG. 4 is a perspective view showing a non-magnetic spacer constituting the temperature switch element according to the present invention. FIG. 5 is a perspective view of a temperature switch element constituting a conventional sealing mold temperature switch. FIG. 6 is a partial perspective view of a conventional temperature switch element coated with adhesive. 1...Temperature-sensitive magnetic material, 2...Permanent magnet, 3,31
... Spacer, 4 ... Lead switch, 5 ... Wire connection terminal, 6 ... Adhesive, 7 ... Sealing molding resin, 10 ... Sealing mold temperature switch, 11
, 12 ...Temperature switch element.
Claims (1)
グ状の永久磁石、並びにリング状の非磁性のスペ
ーサとから構成される常開型、又は常閉型温度ス
イツチ素子を、各構成部品の熱膨張係数に近い熱
膨張係数を有する熱硬化性、又は熱可塑性樹脂に
て一体成形して成る封止成形型温度スイツチにお
いて、スペーサの外径寸法を、永久磁石、感温磁
性体の外形寸法より小さくしたことを特徴とする
封止成形型温度スイツチ。 A normally open or normally closed temperature switch element consisting of a reed switch, a ring-shaped temperature-sensitive magnetic material, a ring-shaped permanent magnet, and a ring-shaped non-magnetic spacer is constructed by adjusting the thermal expansion coefficient of each component. In a sealed molded temperature switch integrally molded with a thermosetting or thermoplastic resin having a coefficient of thermal expansion close to A sealed molded temperature switch characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4926889U JPH02138832U (en) | 1989-04-26 | 1989-04-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4926889U JPH02138832U (en) | 1989-04-26 | 1989-04-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02138832U true JPH02138832U (en) | 1990-11-20 |
Family
ID=31566811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4926889U Pending JPH02138832U (en) | 1989-04-26 | 1989-04-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02138832U (en) |
-
1989
- 1989-04-26 JP JP4926889U patent/JPH02138832U/ja active Pending
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