JPH02138832U - - Google Patents

Info

Publication number
JPH02138832U
JPH02138832U JP4926889U JP4926889U JPH02138832U JP H02138832 U JPH02138832 U JP H02138832U JP 4926889 U JP4926889 U JP 4926889U JP 4926889 U JP4926889 U JP 4926889U JP H02138832 U JPH02138832 U JP H02138832U
Authority
JP
Japan
Prior art keywords
ring
temperature switch
shaped
thermal expansion
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4926889U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4926889U priority Critical patent/JPH02138832U/ja
Publication of JPH02138832U publication Critical patent/JPH02138832U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Thermally Actuated Switches (AREA)
  • Manufacture Of Switches (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案による封止成形型温度スイツチ
の斜視図。第2図は本考案による温度スイツチ素
子の斜視図。第3図は本考案における温度スイツ
チ素子の接着剤を塗布した状態を示す部分斜視図
。第4図は本考案による温度スイツチ素子を構成
する非磁性のスペーサを示す斜視図。第5図は従
来の封止成形型温度スイツチを構成する温度スイ
ツチ素子の斜視図。第6図は従来の温度スイツチ
素子の接着剤を塗布した部分斜視図。 1……感温磁性体、2……永久磁石、3,31
……スペーサ、4……リードスイツチ、5……ワ
イヤー接続用端子、6……接着剤、7……封止成
形樹脂、10……封止成形型温度スイツチ、11
12……温度スイツチ素子。
FIG. 1 is a perspective view of a sealing mold temperature switch according to the present invention. FIG. 2 is a perspective view of a temperature switch element according to the present invention. FIG. 3 is a partial perspective view showing the temperature switch element according to the present invention in a state where adhesive is applied. FIG. 4 is a perspective view showing a non-magnetic spacer constituting the temperature switch element according to the present invention. FIG. 5 is a perspective view of a temperature switch element constituting a conventional sealing mold temperature switch. FIG. 6 is a partial perspective view of a conventional temperature switch element coated with adhesive. 1...Temperature-sensitive magnetic material, 2...Permanent magnet, 3,31
... Spacer, 4 ... Lead switch, 5 ... Wire connection terminal, 6 ... Adhesive, 7 ... Sealing molding resin, 10 ... Sealing mold temperature switch, 11
, 12 ...Temperature switch element.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードスイツチ、リング状の感温磁性体、リン
グ状の永久磁石、並びにリング状の非磁性のスペ
ーサとから構成される常開型、又は常閉型温度ス
イツチ素子を、各構成部品の熱膨張係数に近い熱
膨張係数を有する熱硬化性、又は熱可塑性樹脂に
て一体成形して成る封止成形型温度スイツチにお
いて、スペーサの外径寸法を、永久磁石、感温磁
性体の外形寸法より小さくしたことを特徴とする
封止成形型温度スイツチ。
A normally open or normally closed temperature switch element consisting of a reed switch, a ring-shaped temperature-sensitive magnetic material, a ring-shaped permanent magnet, and a ring-shaped non-magnetic spacer is constructed by adjusting the thermal expansion coefficient of each component. In a sealed molded temperature switch integrally molded with a thermosetting or thermoplastic resin having a coefficient of thermal expansion close to A sealed molded temperature switch characterized by:
JP4926889U 1989-04-26 1989-04-26 Pending JPH02138832U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4926889U JPH02138832U (en) 1989-04-26 1989-04-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4926889U JPH02138832U (en) 1989-04-26 1989-04-26

Publications (1)

Publication Number Publication Date
JPH02138832U true JPH02138832U (en) 1990-11-20

Family

ID=31566811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4926889U Pending JPH02138832U (en) 1989-04-26 1989-04-26

Country Status (1)

Country Link
JP (1) JPH02138832U (en)

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