JPH0410944U - - Google Patents
Info
- Publication number
- JPH0410944U JPH0410944U JP5138290U JP5138290U JPH0410944U JP H0410944 U JPH0410944 U JP H0410944U JP 5138290 U JP5138290 U JP 5138290U JP 5138290 U JP5138290 U JP 5138290U JP H0410944 U JPH0410944 U JP H0410944U
- Authority
- JP
- Japan
- Prior art keywords
- temperature switch
- insulating resin
- molded
- sealed
- mold temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 235000014676 Phragmites communis Nutrition 0.000 claims description 3
- 239000000696 magnetic material Substances 0.000 claims description 2
- 238000000605 extraction Methods 0.000 claims 1
Landscapes
- Thermally Actuated Switches (AREA)
Description
第１図は、本考案の第一の実施例を示す封止成
形型温度スイツチの外観斜視図。第２図は、第１
図における封止成形型温度スイツチに適用される
端子板の外観斜視図。第３図は、第１図の封止成
形型温度スイツチに第２図の端子板を適用した第
二の実施例の封止成形型温度スイツチに太いワイ
ヤーを接続した状態を示す外観斜視図。第４図は
、従来の封止成形型温度スイツチの外観斜視図で
ある。
１……絶縁樹脂、２……取付け部、３……リー
ド、４……溝、５……凹部、６……突起、７……
端子板、７ａ……嵌合部、７ｂ……接続部、７ｃ
……挟持部、８……端部、９……太いワイヤー、
１０……処理部、１１……リードスイツチ、１２
……感温磁性体、１３……永久磁石、１４……温
度スイツチ素子、１５……絶縁樹脂、１６……リ
ード、１７……取付け部。
FIG. 1 is an external perspective view of a sealing mold temperature switch showing a first embodiment of the present invention. Figure 2 shows the first
FIG. 2 is an external perspective view of a terminal plate applied to the sealing mold temperature switch shown in the figure. 3 is an external perspective view showing a state in which a thick wire is connected to a sealing mold temperature switch of a second embodiment in which the terminal plate of FIG. 2 is applied to the sealing mold temperature switch of FIG. 1; FIG. FIG. 4 is an external perspective view of a conventional sealing mold temperature switch. 1...Insulating resin, 2...Mounting part, 3...Lead, 4...Groove, 5...Recess, 6...Protrusion, 7 ...
Terminal board, 7a... Fitting part, 7b... Connection part, 7c
... clamping part, 8 ... end, 9 ... thick wire,
10...Processing unit, 11...Reed switch, 12
... Temperature-sensitive magnetic material, 13 ... Permanent magnet, 14 ... Temperature switch element, 15 ... Insulating resin, 16 ... Lead, 17 ... Mounting part.
Claims (1)
永久磁石を挿通して構成される温度スイツチ素子
を、絶縁樹脂にて一体に封止成形し、前記リード
スイツチの両リードは、前記絶縁樹脂の外部に引
き出された封止成形型温度スイツチにおいて、前
記絶縁樹脂の前記リードの引き出し部に、外部接
続用ワイヤーを接続する端子板を嵌合固定する溝
と突起を一体に設けた事の特徴とする封止成形型
温度スイツチ。 ２ 請求項１記載の封止成形型温度スイツチの封
止成形した絶縁樹脂のリード引き出し部に一体に
設けた溝と突起に、嵌合部と挟持部及び接続部を
持つＬ字形の端子板の前記嵌合部と前記挟持部を
、それぞれ嵌合固定した事を特徴とする封止成形
型温度スイツチ。[Claims for Utility Model Registration] 1. A temperature switch element consisting of an annular temperature-sensitive magnetic material and a permanent magnet inserted around the outer periphery of the reed switch is integrally sealed and molded with an insulating resin, and the reed switch is Both leads are provided with grooves and protrusions for fitting and fixing a terminal plate for connecting an external connection wire to the lead-out portion of the leads of the insulating resin in the sealing mold temperature switch drawn out to the outside of the insulating resin. Sealed mold temperature switch featuring an integrated feature. 2. An L-shaped terminal board having a fitting part, a clamping part, and a connecting part is attached to the groove and protrusion integrally provided in the lead extraction part of the molded insulating resin of the sealed molded temperature switch according to claim 1. A sealing mold temperature switch characterized in that the fitting part and the holding part are fitted and fixed, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5138290U JPH0410944U (en) | 1990-05-16 | 1990-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5138290U JPH0410944U (en) | 1990-05-16 | 1990-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0410944U true JPH0410944U (en) | 1992-01-29 |
Family
ID=31570778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5138290U Pending JPH0410944U (en) | 1990-05-16 | 1990-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410944U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0670863U (en) * | 1993-03-11 | 1994-10-04 | 株式会社フカガワ | Extruder for sealant containing cartridge |
-
1990
- 1990-05-16 JP JP5138290U patent/JPH0410944U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0670863U (en) * | 1993-03-11 | 1994-10-04 | 株式会社フカガワ | Extruder for sealant containing cartridge |
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