JPH0364236B2 - - Google Patents

Info

Publication number
JPH0364236B2
JPH0364236B2 JP63259970A JP25997088A JPH0364236B2 JP H0364236 B2 JPH0364236 B2 JP H0364236B2 JP 63259970 A JP63259970 A JP 63259970A JP 25997088 A JP25997088 A JP 25997088A JP H0364236 B2 JPH0364236 B2 JP H0364236B2
Authority
JP
Japan
Prior art keywords
hole
laser beam
workpiece
cutting
starting position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63259970A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02108484A (ja
Inventor
Yukinobu Maekawa
Hirohito Maki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibuya Corp
Original Assignee
Shibuya Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibuya Kogyo Co Ltd filed Critical Shibuya Kogyo Co Ltd
Priority to JP63259970A priority Critical patent/JPH02108484A/ja
Publication of JPH02108484A publication Critical patent/JPH02108484A/ja
Publication of JPH0364236B2 publication Critical patent/JPH0364236B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)
JP63259970A 1988-10-14 1988-10-14 レーザ光線による穴の形成方法 Granted JPH02108484A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63259970A JPH02108484A (ja) 1988-10-14 1988-10-14 レーザ光線による穴の形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63259970A JPH02108484A (ja) 1988-10-14 1988-10-14 レーザ光線による穴の形成方法

Publications (2)

Publication Number Publication Date
JPH02108484A JPH02108484A (ja) 1990-04-20
JPH0364236B2 true JPH0364236B2 (cg-RX-API-DMAC7.html) 1991-10-04

Family

ID=17341456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63259970A Granted JPH02108484A (ja) 1988-10-14 1988-10-14 レーザ光線による穴の形成方法

Country Status (1)

Country Link
JP (1) JPH02108484A (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5856649A (en) * 1994-02-25 1999-01-05 Fanuc Ltd. Laser beam machine
US5658474A (en) * 1994-12-16 1997-08-19 Alza Corporation Method and apparatus for forming dispenser delivery ports
US5837964A (en) * 1998-01-16 1998-11-17 Chromalloy Gas Turbine Corporation Laser drilling holes in components by combined percussion and trepan drilling
DE10144008A1 (de) * 2001-09-07 2003-03-27 Siemens Ag Verfahren und Vorrichtung zum Erzeugen einer Bohrung in einem Werkstück mit Laserstrahlung

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5220719A (en) * 1975-08-11 1977-02-16 Kuniaki Miyazawa Television system
JPS6027321Y2 (ja) * 1980-07-17 1985-08-17 三菱電機株式会社 冷暖房装置

Also Published As

Publication number Publication date
JPH02108484A (ja) 1990-04-20

Similar Documents

Publication Publication Date Title
JPS60223684A (ja) レ−ザを利用した鋸による切断方法及び装置
KR880004610A (ko) 레이저 스크라이빙 장치와 방법
US20140263212A1 (en) Coordination of beam angle and workpiece movement for taper control
KR950024836A (ko) 레이저 가공방법 및 그의 장치
WO2003004210B1 (en) Method of ablating an opening in a hard, non-metallic substrate
JP2003170286A (ja) 材料に逆テーパ貫通穴をあけるレーザ穴あけ加工法
US6670575B1 (en) Method and apparatus for removing substance from the surface of a workpiece
JP2023523031A (ja) 凹部を基板中に生成するための方法
JPH0364236B2 (cg-RX-API-DMAC7.html)
JP2000334594A (ja) レーザー加工装置及びレーザー加工方法
WO2020078782A1 (de) Verfahren zur materialabtragenden laserbearbeitung eines werkstücks
JP2000288752A (ja) レーザ加工方法及びレーザ加工装置
JPS6317035B2 (cg-RX-API-DMAC7.html)
JPS6383221A (ja) レ−ザ光による切断方法
JPH09220683A (ja) 丸穴加工方法
JPH07214360A (ja) レーザ加工
JPS58218387A (ja) レ−ザによる穿孔方法
JPS63160779A (ja) エネルギ−ビ−ム切断・穿孔方法
JPH0159076B2 (cg-RX-API-DMAC7.html)
JP2628189B2 (ja) レーザビームによる孔あけ方法
JPH0257477B2 (cg-RX-API-DMAC7.html)
JP2618730B2 (ja) レーザ加工方法およびレーザ加工装置
JPH02197388A (ja) レーザ加工方法
JPH071123A (ja) 開先切断方法
JP4304808B2 (ja) レーザ加工方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees