JPH0363209B2 - - Google Patents

Info

Publication number
JPH0363209B2
JPH0363209B2 JP57205981A JP20598182A JPH0363209B2 JP H0363209 B2 JPH0363209 B2 JP H0363209B2 JP 57205981 A JP57205981 A JP 57205981A JP 20598182 A JP20598182 A JP 20598182A JP H0363209 B2 JPH0363209 B2 JP H0363209B2
Authority
JP
Japan
Prior art keywords
etching
gas
sio
plasma
etched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57205981A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58100684A (ja
Inventor
Seitaro Matsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP20598182A priority Critical patent/JPS58100684A/ja
Publication of JPS58100684A publication Critical patent/JPS58100684A/ja
Publication of JPH0363209B2 publication Critical patent/JPH0363209B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
JP20598182A 1982-11-26 1982-11-26 ドライ・エツチング方法 Granted JPS58100684A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20598182A JPS58100684A (ja) 1982-11-26 1982-11-26 ドライ・エツチング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20598182A JPS58100684A (ja) 1982-11-26 1982-11-26 ドライ・エツチング方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP4531979A Division JPS55138834A (en) 1979-04-16 1979-04-16 Dry etching method

Publications (2)

Publication Number Publication Date
JPS58100684A JPS58100684A (ja) 1983-06-15
JPH0363209B2 true JPH0363209B2 (enrdf_load_stackoverflow) 1991-09-30

Family

ID=16515916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20598182A Granted JPS58100684A (ja) 1982-11-26 1982-11-26 ドライ・エツチング方法

Country Status (1)

Country Link
JP (1) JPS58100684A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0793291B2 (ja) * 1986-12-19 1995-10-09 アプライド マテリアルズインコーポレーテッド シリコンおよび珪化物のための臭素およびヨウ素エッチング方法
JPS63261835A (ja) * 1987-04-20 1988-10-28 Fujitsu Ltd 電極・配線形成方法
US5157091A (en) * 1987-10-07 1992-10-20 Murahara Masataka Ultraviolet-absorbing polymer material and photoetching process
US5007982A (en) * 1988-07-11 1991-04-16 North American Philips Corporation Reactive ion etching of silicon with hydrogen bromide
JP5537324B2 (ja) 2010-08-05 2014-07-02 株式会社東芝 半導体装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5713137A (en) * 1980-06-24 1982-01-23 Toshiba Corp Amorphous alloy for magnetic head

Also Published As

Publication number Publication date
JPS58100684A (ja) 1983-06-15

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