JPH0362513B2 - - Google Patents
Info
- Publication number
- JPH0362513B2 JPH0362513B2 JP57125628A JP12562882A JPH0362513B2 JP H0362513 B2 JPH0362513 B2 JP H0362513B2 JP 57125628 A JP57125628 A JP 57125628A JP 12562882 A JP12562882 A JP 12562882A JP H0362513 B2 JPH0362513 B2 JP H0362513B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- processing
- detection means
- amount
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012545 processing Methods 0.000 claims description 58
- 238000002834 transmittance Methods 0.000 claims description 22
- 238000005259 measurement Methods 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims 11
- 230000000903 blocking effect Effects 0.000 claims 1
- 238000003754 machining Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57125628A JPS5916691A (ja) | 1982-07-21 | 1982-07-21 | レ−ザ加工装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57125628A JPS5916691A (ja) | 1982-07-21 | 1982-07-21 | レ−ザ加工装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5916691A JPS5916691A (ja) | 1984-01-27 |
| JPH0362513B2 true JPH0362513B2 (enrdf_load_stackoverflow) | 1991-09-26 |
Family
ID=14914755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57125628A Granted JPS5916691A (ja) | 1982-07-21 | 1982-07-21 | レ−ザ加工装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5916691A (enrdf_load_stackoverflow) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6257787A (ja) * | 1985-07-05 | 1987-03-13 | フラウンホッファー―ゲゼルシャフト ツァフェルダールング デァ アンゲヴァンテン フォアシュンク エー．ファオ． | レ−ザ−加工装置 |
| JP2804027B2 (ja) * | 1987-07-13 | 1998-09-24 | ファナック 株式会社 | レーザ出力補正方式 |
| JPH0616952B2 (ja) * | 1988-08-05 | 1994-03-09 | 日本電気株式会社 | レーザ光エネルギー管理方法 |
| JP2599439B2 (ja) * | 1988-08-25 | 1997-04-09 | 松下電器産業株式会社 | レーザトリミング装置およびトリミング方法 |
| JPH05261577A (ja) * | 1992-03-18 | 1993-10-12 | Sumitomo Heavy Ind Ltd | レーザ加工装置 |
| US5427733A (en) * | 1993-10-20 | 1995-06-27 | United Technologies Corporation | Method for performing temperature-controlled laser sintering |
| US5529951A (en) * | 1993-11-02 | 1996-06-25 | Sony Corporation | Method of forming polycrystalline silicon layer on substrate by large area excimer laser irradiation |
| JP6998149B2 (ja) * | 2017-08-08 | 2022-01-18 | 株式会社ディスコ | レーザー加工方法 |
-
1982
- 1982-07-21 JP JP57125628A patent/JPS5916691A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5916691A (ja) | 1984-01-27 |
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