JPH036086A - Metal-based printed wiring board - Google Patents
Metal-based printed wiring boardInfo
- Publication number
- JPH036086A JPH036086A JP14042789A JP14042789A JPH036086A JP H036086 A JPH036086 A JP H036086A JP 14042789 A JP14042789 A JP 14042789A JP 14042789 A JP14042789 A JP 14042789A JP H036086 A JPH036086 A JP H036086A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- printed wiring
- insulating layer
- wiring board
- silicon carbide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims description 26
- 229910052751 metal Inorganic materials 0.000 title claims description 26
- 239000000919 ceramic Substances 0.000 claims abstract description 28
- 239000000835 fiber Substances 0.000 claims abstract description 24
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 17
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 15
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 239000010953 base metal Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract description 3
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 239000004634 thermosetting polymer Substances 0.000 abstract 2
- 238000001035 drying Methods 0.000 abstract 1
- 238000010292 electrical insulation Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Organic Insulating Materials (AREA)
- Insulating Bodies (AREA)
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は金属ベースプリント配線板に係り、特に放熱
性と絶縁性の優れた金属ベースプリント配線板の改良に
関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a metal-based printed wiring board, and more particularly to improvement of a metal-based printed wiring board with excellent heat dissipation and insulation properties.
第３図は絶縁層に従来のセラミックスペーパーを使用し
た金属ベースプリント配線板の断面図、第４図は従来の
金属ベースプリント配線板の絶縁材料に使用するセラミ
ックスペーパーの断面図である。FIG. 3 is a sectional view of a metal-based printed wiring board using a conventional ceramic paper for an insulating layer, and FIG. 4 is a sectional view of a ceramic paper used as an insulating material for a conventional metal-based printed wiring board.
図において、！はセラミックスペーパー ２はセラミッ
クスペーパー１を形成しているアルミナｍ維、３はセラ
ミックスペーパー１を用いた従来の金属ベースプリント
配線板で、ベース金属４の片面にセラミックスペーパー
１を使用した絶縁層５を介して導体６が固着されて、一
体化され形成されたものである。In the figure! 2 is a ceramic paper, 2 is an alumina m-fiber forming the ceramic paper 1, and 3 is a conventional metal-based printed wiring board using the ceramic paper 1, with an insulating layer 5 using the ceramic paper 1 on one side of the base metal 4. The conductor 6 is fixed thereto and is integrally formed.
一般に従来の金属ベースプリント配線板３は、絶縁層５
としてアルミナ繊維２のみを用いて抄造されたセラミッ
クスペーパー！にエポキシ樹脂等の熱硬化性樹Ｊ］Ｉ７
を含浸させたプリプレグを基材として用い、この絶縁層
５をアルミニュウム、鉄等のベース金属４と銅箔、アル
ミ箔等の導体６間に介在されて加圧加熱することにより
一体化したものである。Generally, a conventional metal-based printed wiring board 3 has an insulating layer 5
Ceramic paper made using only alumina fiber 2! Thermosetting resin such as epoxy resin] I7
This insulating layer 5 is interposed between a base metal 4 such as aluminum or iron and a conductor 6 such as copper foil or aluminum foil, and is integrated by applying pressure and heating. be.
しかしながら、従来のプリント配線板３においては、絶
縁層５に用いるセラミックスペーパー１はアルミナ繊維
２のみを主成分として抄造されているので、基板の放熱
特性の向上に限りがあるという問題点があった。However, in the conventional printed wiring board 3, since the ceramic paper 1 used for the insulating layer 5 is made of only alumina fiber 2 as a main component, there is a problem in that there is a limit to the improvement of the heat dissipation characteristics of the board. .
この発明は以上のような問題点を解消するためになさね
たもので、が伝導性に優わ、電気絶縁性を兼ね備えた高
放熱性の金属ベースプリント配線板を得ることを目的と
する。The present invention has been made to solve the above-mentioned problems, and its object is to obtain a metal-based printed wiring board with excellent conductivity, electrical insulation, and high heat dissipation.
この発明は、ベース金属と絶縁層および導体とが積層し
て形成され、前記絶縁層をアルミナ繊維と炭化ケイ素と
を混合して成るセラミックスペーパーに熱硬化性樹脂を
含浸させた基材を用いて形成した金属ベースプリント基
板を得ることにあり、これによって前記目的を達成しよ
うとするものである。This invention is formed by laminating a base metal, an insulating layer, and a conductor, and the insulating layer is formed using a base material made of ceramic paper made of a mixture of alumina fiber and silicon carbide impregnated with a thermosetting resin. The object of the present invention is to obtain a metal-based printed circuit board formed of metal, thereby achieving the above object.
この発明の金属ベースプリント配線板は、絶縁層を形成
するセラミックスペーパーがアルミナ繊維の他に、より
熱伝導性に優れ、電気絶縁性を兼ね備えた炭化ケイ素に
より形成されているため、導体上に取付けらねる半導体
等の電子部品から伝導される熱を金属ベースに逃がすた
めの熱伝導性や電気絶縁性を改善することができる。In the metal-based printed wiring board of this invention, the ceramic paper forming the insulating layer is made of silicon carbide, which has superior thermal conductivity and electrical insulation properties, in addition to alumina fibers, so it can be mounted on a conductor. It is possible to improve thermal conductivity and electrical insulation for dissipating heat conducted from electronic components such as semiconductors to the metal base.
以下、この発明の一実施例を図に従って説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図はこの発明の一実施例の金属ベースプリント配線
板の断面図、第２図は第１図の金属ベースプリント配線
板の絶縁層を形成するためのセラミックスペーパーを示
す断面図である。FIG. 1 is a sectional view of a metal-based printed wiring board according to an embodiment of the present invention, and FIG. 2 is a sectional view showing ceramic paper for forming an insulating layer of the metal-based printed wiring board of FIG. 1.
図に示すように、この発明の金属ベースプリント配線板
８はベース金属４の上にアルミナｙａＭ１２と炭化ケイ
素繊維９とを混合して抄造して形成された高放熱性のセ
ラミックスペーパー１０を用いた絶縁層！１および導体
６を一体的に積層して形成されたものである。As shown in the figure, a metal base printed wiring board 8 of the present invention uses a highly heat dissipating ceramic paper 10 formed by mixing alumina yaM12 and silicon carbide fibers 9 on a base metal 4. Insulating layer! 1 and a conductor 6 are integrally laminated.
そして、この発明の金属ベースプリント配線板８に形成
される上述の絶縁層！１は、まず、アルミナ繊維２に対
し５％〜５０％（重量％）の炭化ケイ素繊維９を混合し
て抄造して第２図に示すセラミックスペーパー１０を形
成し、このセラミックスペーパー１０にエポキシ樹脂等
の熱硬化性樹脂７を含浸させ、乾燥して半硬化したプリ
プレグ（不図示）を基材として形成する。そしてさらに
、この基材としてのプリプレグをベース金属４と銅箔等
の導体６との中間に介装して積層し、加熱、加圧して硬
化させることにより一体的に形成できるものである。And the above-mentioned insulating layer formed on the metal base printed wiring board 8 of the present invention! 1, first, a ceramic paper 10 shown in FIG. 2 is formed by mixing 5% to 50% (wt%) silicon carbide fiber 9 with alumina fiber 2, and then epoxy resin is applied to this ceramic paper 10. A prepreg (not shown) impregnated with a thermosetting resin 7 such as the like, dried and semi-cured is formed as a base material. Further, this prepreg as a base material can be interposed between the base metal 4 and a conductor 6 such as copper foil, laminated, and then heated and pressurized to harden, so that the prepreg can be integrally formed.
なお、前記セラミックスペーパー１０はアルミナ繊維２
と混合する炭化ケイ素繊維９の比率を５％〜５０％（重
量％）とした場合が成形性がよい。Note that the ceramic paper 10 is made of alumina fiber 2.
The moldability is good when the ratio of the silicon carbide fibers 9 mixed with the silicon carbide fibers is 5% to 50% (wt%).
以上の構成により、この発明の金属ベースプリント配線
板８はその絶縁層１１を形成するセラミックスペーパー
１０に混合される炭化ケイ素の熱伝導率がアルミナの熱
伝導率１７Ｗ−ｍ−’・Ｋ−１に対して２７０Ｗ−ｍ−
’−に一’と高く、さらに電気絶縁性にも優れているの
で、この発明の金属ベースプリント配線板はセラミック
スペーパーに従来のアルミナ１ａＭのみを使用したもの
より放熱性と電気絶縁性に優れている。尚、この発明は
、金属芯プリント配線板、コンポジットプリント配線板
等への応用や積層板への応用も同様に実施できる。With the above configuration, the metal base printed wiring board 8 of the present invention has a thermal conductivity of silicon carbide mixed in the ceramic paper 10 forming the insulating layer 11, which is higher than that of alumina, which is 17 W-m-'·K-1. 270W-m-
The metal-based printed wiring board of this invention has excellent heat dissipation and electrical insulation properties compared to conventional ceramic paper using only 1aM alumina. There is. Note that the present invention can be similarly applied to metal-core printed wiring boards, composite printed wiring boards, etc., and to laminated boards.
以上のように、この発明によりば、金属ベースプリント
配線板の絶縁層を形成する基材としてのセラミックスペ
ーパーのアルミナ繊維に熱伝導性の優れた炭化ケイ素繊
維を混合して抄造し、熱硬化性樹脂を含浸したものを用
いたので、セラミックスペーパーにアルミナ単体を用い
た従来品より、導体側からベース金属への放熱性と電気
絶縁性に優れ、炭化ケイ素単品を用いたものより安価な
高放熱性の金属ベースプリント配線板を得ることができ
る。As described above, according to the present invention, silicon carbide fibers with excellent thermal conductivity are mixed with alumina fibers of ceramic paper as a base material for forming an insulating layer of a metal-based printed wiring board, and silicon carbide fibers with excellent thermal conductivity are mixed to form a paper. Because it uses resin-impregnated ceramic paper, it has better heat dissipation from the conductor side to the base metal and electrical insulation than conventional products that use alumina alone, and is cheaper than silicon carbide alone. It is possible to obtain a metal-based printed wiring board with a high quality.
第１図はこの発明の一実施例の金属ベースプリント配線
板の断面図、第２図は第１図の金属ベースプリント配線
板の絶縁層を形成するためのセラミックスペーパーを示
す断面図、第３図は絶縁層に従来のセラミックスペーパ
ーを使用した金属ベースプリント配線板の断面図、第４
図は従来の金属ベースプリント配線板の絶縁材料に使用
するセラミックスペーパーの断面図である。
なお、各図中、同一符号は同一（相当）構成要素を示す
。
２・・・・・・アルミナ繊維
４・・・・・・ベース金属
６・・・・・・導体
７・−・・・・熱硬化性樹脂
８・・・・・・金属ベースプリント配線板９・・・・・
・炭化ケイ素繊維
１０・・・・・・セラミックスペーパー１１−・・・・
・絶縁層FIG. 1 is a cross-sectional view of a metal-based printed wiring board according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing ceramic paper for forming an insulating layer of the metal-based printed wiring board of FIG. 1, and FIG. The figure is a cross-sectional view of a metal-based printed wiring board using conventional ceramic paper for the insulating layer.
The figure is a cross-sectional view of ceramic paper used as an insulating material for conventional metal-based printed wiring boards. Note that in each figure, the same reference numerals indicate the same (equivalent) components. 2... Alumina fiber 4... Base metal 6... Conductor 7... Thermosetting resin 8... Metal base printed wiring board 9・・・・・・
・Silicon carbide fiber 10... Ceramic paper 11-...
・Insulating layer
Claims (1)
、前記絶縁層を、アルミナ繊維と炭化ケイ素繊維とを混
合して成るセラミックスペーパーに熱硬化性樹脂を含浸
させた基材を用いて形成したことを特徴とする金属ベー
スプリント配線板。It is formed by laminating a base metal, an insulating layer, and a conductor, and the insulating layer is formed using a base material made of a ceramic paper made of a mixture of alumina fiber and silicon carbide fiber impregnated with a thermosetting resin. A metal-based printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14042789A JPH036086A (en) | 1989-06-02 | 1989-06-02 | Metal-based printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14042789A JPH036086A (en) | 1989-06-02 | 1989-06-02 | Metal-based printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH036086A true JPH036086A (en) | 1991-01-11 |
Family
ID=15268436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14042789A Pending JPH036086A (en) | 1989-06-02 | 1989-06-02 | Metal-based printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH036086A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107848245A (en) * | 2015-07-17 | 2018-03-27 | 罗杰斯德国有限公司 | Method for the substrate of electric circuit and for manufacturing this substrate |
-
1989
- 1989-06-02 JP JP14042789A patent/JPH036086A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107848245A (en) * | 2015-07-17 | 2018-03-27 | 罗杰斯德国有限公司 | Method for the substrate of electric circuit and for manufacturing this substrate |
| US10940671B2 (en) | 2015-07-17 | 2021-03-09 | Rogers Germany Gmbh | Substrate for electrical circuits and method for producing a substrate of this type |
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